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DSEP2X61-12A
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IXYS Diodes - Fast Recovery Rectifiers, SOT-227. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DSEP2X61-12A
IXYS · Diodes - Fast Recovery Rectifiers · SOT-227
DSEP2X61-12A from IXYS, in a SOT-227. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of the first fast diode (right side of the symbol), rated for VRRM 1200 V and IFAV 60 A per diode. |
| 2 | A1 | passive | Anode of the first fast diode (left side of the symbol), rated for IFAV 60 A per diode with VF 2.42 V max at 120 A and 25°C. |
| 3 | A2 | passive | Anode of the second fast diode (left side of the symbol), rated for IFAV 60 A per diode. |
| 4 | K2 | passive | Cathode of the second fast diode (right side of the symbol), rated for VRRM 1200 V and IFAV 60 A per diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | SOT-227 |
| Category | Diodes |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 1200 | V | TVJ = 25°C | 2 | ||
| Max. non-repetitive reverse blocking voltage | VRSM | 1200 | V | 2 | |||
| Reverse current | IR | 1 | mA | VR = VRRM; TVJ = 25°C | 2 | ||
| Reverse current | IR | 4 | mA | VR = VRRM; TVJ = 150°C | 2 | ||
| Forward voltage drop | VF | 2.42 | 2.84 | V | TVJ = 25°C; IF = 120 A | 2 | |
| Forward voltage drop | VF | 1.52 | V | TVJ = 150°C; IF = 60 A | 2 | ||
| Forward voltage drop | VF | 1.92 | V | TVJ = 150°C; IF = 120 A | 2 | ||
| Max. reverse recovery current | IRM | 13 | A | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 25°C | 2 | ||
| Max. reverse recovery current | IRM | 20 | A | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 100°C | 2 | ||
| Reverse recovery time | trr | 85 | ns | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 25°C | 2 | ||
| Reverse recovery time | trr | 250 | ns | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 100°C | 2 | ||
| Max. forward surge current | IFSM | 800 | A | t = 10 ms (50 Hz), sine; VR = 0 V; TVJ = 45°C | 2 | ||
| Average forward current | IFAV | 60 | A | TC = 80°C; rectangular, d = 0.5 | 2 | ||
| Total power dissipation | Ptot | 200 | W | TC = 25°C | 2 | ||
| Thermal resistance junction to case | RthJC | 0.6 | K/W | 2 | |||
| Threshold voltage | VF0 | 1.15 | V | TVJ = 150°C | 3 | ||
| Slope resistance (on die level) | R0 | 4.3 | mΩ | TVJ = 150°C; on die level | 3 | ||
| Slope resistance for power loss calculation only | rF | 6.2 | mΩ | TVJ = 150°C | 2 | ||
| Thermal resistance case to heatsink | RthCH | 0.1 | K/W | 2 | |||
| Junction capacitance | CJ | 48 | pF | VR = 600 V; f = 1 MHz; TVJ = 25°C | 2 | ||
| Virtual junction temperature | TVJ | -40 | 150 | °C | 3 | ||
| Operation temperature | Top | -40 | 125 | °C | 3 | ||
| Storage temperature | Tstg | -40 | 150 | °C | 3 | ||
| Mounting torque | MD | 1.1 | 1.5 | Nm | 3 | ||
| Terminal torque | MT | 1.1 | 1.5 | Nm | 3 | ||
| RMS current per terminal | IRMS | 100 | A | 3 | |||
| Isolation voltage | VISOL | 3000 | V | 50/60 Hz, RMS; IISOL ≤ 1 mA; t = 1 second | 3 | ||
| Isolation voltage | VISOL | 2500 | V | 50/60 Hz, RMS; IISOL ≤ 1 mA; t = 1 minute | 3 |
CAD (KiCad official)
- Symbol:
DSEP2X61-12A - Footprint:
Package_TO_SOT_THT:SOT-227 - 3D model: SOT-227, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.45 mm nominal SOT height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
dsep2x61-12a-etched.step/dsep2x61-12a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dsep2x61-12a.step/dsep2x61-12a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: IXYS datasheet (5 pp, sha256
6a9452d28aa467cd, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DSEP2X61-12A
**IXYS** · Diodes - Fast Recovery Rectifiers · SOT-227
DSEP2X61-12A from IXYS, in a SOT-227. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of the first fast diode (right side of the symbol), rated for VRRM 1200 V and IFAV 60 A per diode. |
| 2 | A1 | passive | Anode of the first fast diode (left side of the symbol), rated for IFAV 60 A per diode with VF 2.42 V max at 120 A and 25°C. |
| 3 | A2 | passive | Anode of the second fast diode (left side of the symbol), rated for IFAV 60 A per diode. |
| 4 | K2 | passive | Cathode of the second fast diode (right side of the symbol), rated for VRRM 1200 V and IFAV 60 A per diode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | SOT-227 |
| Category | Diodes |
| Pins | 4 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | | | 1200 | V | TVJ = 25°C | 2 |
| Max. non-repetitive reverse blocking voltage | VRSM | | | 1200 | V | | 2 |
| Reverse current | IR | | | 1 | mA | VR = VRRM; TVJ = 25°C | 2 |
| Reverse current | IR | | | 4 | mA | VR = VRRM; TVJ = 150°C | 2 |
| Forward voltage drop | VF | | 2.42 | 2.84 | V | TVJ = 25°C; IF = 120 A | 2 |
| Forward voltage drop | VF | | 1.52 | | V | TVJ = 150°C; IF = 60 A | 2 |
| Forward voltage drop | VF | | | 1.92 | V | TVJ = 150°C; IF = 120 A | 2 |
| Max. reverse recovery current | IRM | | | 13 | A | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 25°C | 2 |
| Max. reverse recovery current | IRM | | | 20 | A | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 100°C | 2 |
| Reverse recovery time | trr | | | 85 | ns | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 25°C | 2 |
| Reverse recovery time | trr | | | 250 | ns | IF = 60 A; -diF/dt = 200 A/µs; VR = 600 V; TVJ = 100°C | 2 |
| Max. forward surge current | IFSM | | | 800 | A | t = 10 ms (50 Hz), sine; VR = 0 V; TVJ = 45°C | 2 |
| Average forward current | IFAV | | | 60 | A | TC = 80°C; rectangular, d = 0.5 | 2 |
| Total power dissipation | Ptot | | | 200 | W | TC = 25°C | 2 |
| Thermal resistance junction to case | RthJC | | | 0.6 | K/W | | 2 |
| Threshold voltage | VF0 | | | 1.15 | V | TVJ = 150°C | 3 |
| Slope resistance (on die level) | R0 | | | 4.3 | mΩ | TVJ = 150°C; on die level | 3 |
| Slope resistance for power loss calculation only | rF | | 6.2 | | mΩ | TVJ = 150°C | 2 |
| Thermal resistance case to heatsink | RthCH | | 0.1 | | K/W | | 2 |
| Junction capacitance | CJ | | 48 | | pF | VR = 600 V; f = 1 MHz; TVJ = 25°C | 2 |
| Virtual junction temperature | TVJ | -40 | | 150 | °C | | 3 |
| Operation temperature | Top | -40 | | 125 | °C | | 3 |
| Storage temperature | Tstg | -40 | | 150 | °C | | 3 |
| Mounting torque | MD | 1.1 | | 1.5 | Nm | | 3 |
| Terminal torque | MT | 1.1 | | 1.5 | Nm | | 3 |
| RMS current per terminal | IRMS | | | 100 | A | | 3 |
| Isolation voltage | VISOL | | | 3000 | V | 50/60 Hz, RMS; IISOL ≤ 1 mA; t = 1 second | 3 |
| Isolation voltage | VISOL | | | 2500 | V | 50/60 Hz, RMS; IISOL ≤ 1 mA; t = 1 minute | 3 |
## CAD (KiCad official)
- Symbol: `DSEP2X61-12A`
- Footprint: `Package_TO_SOT_THT:SOT-227`
- 3D model: SOT-227, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.45 mm nominal SOT height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `dsep2x61-12a-etched.step` / `dsep2x61-12a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dsep2x61-12a.step` / `dsep2x61-12a.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [IXYS datasheet](docs/dsep2x61-12a-datasheet.pdf) (5 pp, sha256 `6a9452d28aa467cd`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dsep2x61-12a-datasheet.pdf)