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DSEC30-06A

IXYS · Diodes - Fast Recovery Rectifiers · TO-247-3

DSEC30-06A from IXYS, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first diode (2x 15 A, 600 V HiPerFRED fast recovery diode, common-cathode configuration).
2 C passive Common cathode of both diodes (600 V VRRM), also connected to the backside tab of the package.
3 A2 passive Anode of the second diode (2x 15 A, 600 V HiPerFRED fast recovery diode, common-cathode configuration).

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-247-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 600 V TVJ = 25°C 2
Forward voltage drop VF 2.24 V IF = 30 A; TVJ = 25°C 2
Forward voltage drop VF 1.57 V IF = 30 A; TVJ = 150°C 2
Reverse current IR 0.5 mA VR = VRRM; TVJ = 150°C 2
Reverse recovery time trr 95 ns TVJ = 25°C; reverse recovery test conditions as printed on page 2 2
Threshold voltage V0 0.99 V TVJ = 175°C; on die level 3
Slope resistance R0 11.7 mΩ TVJ = 175°C; on die level 3
Total power dissipation Ptot 95 W TC = 25°C 2
Max. forward surge current IFSM 110 A t = 10 ms (50 Hz), sine; TVJ = 175°C; VR = 0 V 2
Max. RMS current per terminal IRMS 50 A per terminal 3
Virtual junction temperature TVJ -55 175 °C 3
Operation temperature Top -55 150 °C 3
Storage temperature Tstg -55 150 °C 3
Mounting torque MD 0.8 1.2 Nm 3
Mounting force with clip FC 20 120 N 3
Thermal resistance junction to case RthJC 1.6 K/W 2
Thermal resistance case to heatsink RthCH 0.25 K/W 2

CAD (KiCad official)

  • Symbol: DSEC30-06A
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247-3 (KiCad packages3D, STEP)
  • 3D model files: dsec30-06a-etched.step / dsec30-06a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dsec30-06a.step / dsec30-06a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (5 pp, sha256 73b13e6174935d77, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF