# DS92001TMAX

**Texas Instruments** · LVDS ICs · SOIC-8

DS92001TMAX from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Device ground return (0 V). Bond to a solid ground plane. |
| 2 | IN- | input | Inverting receiver B/LVDS input pin. Accepts LVDS/CML/LVPECL differential signals; differential input threshold |VTH| < ~30 mV (spec ±100 mV), common-mode range |VID|/2 to VCC − |VID|/2. |
| 3 | IN+ | input | Non-inverting receiver B/LVDS input pin. Paired with IN- to form the differential receiver input. |
| 4 | N/C | unconnected | No-connect pin. Leave floating (or optionally tie to GND for mechanical stability); no internal connection. |
| 5 | VCC | power_in | Single-supply power input, 3.3 V ± 0.3 V (3.0-3.6 V). Decouple with 0.01 µF and 0.1 µF ceramics close to the pin plus bulk tantalum ≥10 µF at the board power entry. |
| 6 | OUT+ | output | Non-inverting BLVDS driver output. Differential |VOD| ≈ 250-500 mV into 27 Ω (or 350-600 mV into 50 Ω); VOS ≈ 1.25 V. TRI-STATE when EN = LOW. |
| 7 | OUT- | output | Inverting BLVDS driver output. Paired with OUT+ to form the differential driver output. TRI-STATE when EN = LOW. |
| 8 | EN | input | LVCMOS/LVTTL enable input. When EN = HIGH (VIH ≥ 2.0 V) the driver is enabled; when EN = LOW (VIL ≤ 0.8 V) the BLVDS outputs go to TRI-STATE. IIH ≤ +20 µA, IIL between −10 and +10 µA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `DS92001TMAXTMA/NOPB`
- `DS92001TMAX/NOPB`
- `DS92001TMAXTLD/NOPB`

## CAD (KiCad official)

- Symbol: `DS92001TMAX`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ds92001tmax-etched.step` / `ds92001tmax-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds92001tmax.step` / `ds92001tmax.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ds92001) (None pp, sha256 `68e0b2131ab9b53b`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ds92001tmax-datasheet.pdf)