component
DS90UB949TRGCRQ1
Public Made by Adomby adom
Texas Instruments Serializers / Deserializers, VQFN-64-EP(9x9). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDS90UB949TRGCRQ1
Texas Instruments · Serializers / Deserializers · VQFN-64-EP(9x9)
DS90UB949TRGCRQ1 from Texas Instruments, in a VQFN-64-EP(9x9). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CEC | bidirectional | Open-drain Consumer Electronic Control channel I/O; pull up with a 27-kΩ resistor to 3.3 V. |
| 2 | RES0 | passive | Reserved; tie to GND. |
| 3 | VDDIO | power_in | 1.8-V (±5%) IO supply. |
| 4 | GPIO0/SDIN | bidirectional | LVCMOS BCC GPIO0, shared with master-mode auxiliary I2S data input SDIN. |
| 5 | GPIO1/SWC | bidirectional | LVCMOS BCC GPIO1, shared with master-mode I2S word clock output SWC. |
| 6 | I2CSEL/SCLK | bidirectional | I2C voltage strap read at power-up (10-kΩ to VDDIO for 1.8-V I2C, float for 3.3-V I2C), then switches to master-mode I2S clock output SCLK. |
| 7 | VDDL11 | power_in | 1.1-V (±5%) digital supply. |
| 8 | D_GPIO0/MOSI | bidirectional | LVCMOS high-speed GPIO0 shared with SPI MOSI (dual-link mode only). |
| 9 | VDDA11 | power_in | 1.1-V (±5%) analog supply. |
| 10 | D_GPIO1/MISO | bidirectional | LVCMOS high-speed GPIO1 shared with SPI MISO (dual-link mode only). |
| 11 | D_GPIO2/SPLK | bidirectional | LVCMOS high-speed GPIO2 shared with SPI clock (dual-link mode only). |
| 12 | D_GPIO3/SS | bidirectional | LVCMOS high-speed GPIO3 shared with SPI slave select (dual-link mode only). |
| 13 | INTB | output | Open-drain active-low remote interrupt output; pull up to VDDIO with 4.7 kΩ. |
| 14 | SDA | bidirectional | Open-drain I2C data I/O; requires external pullup to 1.8 V or 3.3 V (recommended 4.7 kΩ), do not float. |
| 15 | SCL | bidirectional | Open-drain I2C clock I/O; requires external pullup to 1.8 V or 3.3 V (recommended 4.7 kΩ), do not float. |
| 16 | MCLK | bidirectional | LVCMOS master-mode I2S system clock input/output. |
| 17 | VDDP11 | power_in | 1.1-V (±5%) PLL supply. |
| 18 | MODE_SEL0 | input | Analog mode select 0 input set by resistor divider (see Table 6). |
| 19 | IDx | input | Analog I2C serial control bus device ID address select. |
| 20 | LFT | passive | FPD-Link III loop filter; connect a 10-nF capacitor to GND. |
| 21 | VDDHS11 | power_in | 1.1-V (±5%) supply. |
| 22 | DOUT1- | output | FPD-Link III inverting output 1; AC-couple with 0.1 µF for 92x deserializers or 33 nF for 94x. |
| 23 | DOUT1+ | output | FPD-Link III true output 1; AC-couple with 0.1 µF for 92x deserializers or 33 nF for 94x. |
| 24 | VDD18 | power_in | 1.8-V (±5%) analog supply. |
| 25 | VDDS11 | power_in | 1.1-V (±5%) serializer supply. |
| 26 | DOUT0- | output | FPD-Link III inverting output 0; AC-couple with 0.1 µF for 92x deserializers or 33 nF for 94x. |
| 27 | DOUT0+ | output | FPD-Link III true output 0; AC-couple with 0.1 µF for 92x deserializers or 33 nF for 94x. |
| 28 | VDDHS11 | power_in | 1.1-V (±5%) supply. |
| 29 | RES1 | passive | Reserved; tie to GND. |
| 30 | RES2 | passive | Reserved; connect with 50 Ω to GND. |
| 31 | PDB | input | LVCMOS power-down mode input (active-high enable). |
| 32 | MODE_SEL1 | input | Analog mode select 1 input set by resistor divider (see Table 6). |
| 33 | I2S_WC/GPIO7_REG | bidirectional | Slave-mode I2S word clock input shared with register-only GPIO7. |
| 34 | I2S_CLK/GPIO8_REG | bidirectional | Slave-mode I2S clock input shared with register-only GPIO8. |
| 35 | I2S_DA/GPIO6_REG | bidirectional | Slave-mode I2S data input shared with register-only GPIO6. |
| 36 | I2S_DB/GPIO5_REG | bidirectional | Slave-mode I2S data input shared with register-only GPIO5. |
| 37 | I2S_DC/GPIO2 | bidirectional | Slave-mode I2S data input shared with BCC GPIO2. |
| 38 | I2S_DD/GPIO3 | bidirectional | Slave-mode I2S data input shared with BCC GPIO3. |
| 39 | X1 | input | Optional CEC reference clock input, 25 MHz 0.1% 45-55% duty cycle at 1.8-V CMOS level; leave open if unused. |
| 40 | REM_INTB | output | Open-drain remote interrupt mirroring INTB_IN from the deserializer; external 1.8-V pullup required (recommended 4.7 kΩ). |
| 41 | VDDL11 | power_in | 1.1-V (±5%) digital supply. |
| 42 | HPD | output | Open-drain Hot Plug Detect output; pull up to RX_5V with a 1-kΩ resistor. |
| 43 | RX_5V | input | HDMI 5-V detect input. |
| 44 | DDC_SDA | bidirectional | Open-drain DDC slave serial data; pull up to RX_5V with 47 kΩ. |
| 45 | DDC_SCL | input | Open-drain DDC slave serial clock; pull up to RX_5V with 47 kΩ. |
| 46 | VDDIO | power_in | 1.8-V (±5%) IO supply. |
| 47 | NC0 | unconnected | No connect; leave floating, do not connect to VDD or GND. |
| 48 | NC1 | unconnected | No connect; leave floating, do not connect to VDD or GND. |
| 49 | IN_CLK- | input | TMDS clock differential input (negative). |
| 50 | IN_CLK+ | input | TMDS clock differential input (positive). |
| 51 | VDD18 | power_in | 1.8-V (±5%) analog supply. |
| 52 | VDDHA11 | power_in | 1.1-V (±5%) TMDS supply. |
| 53 | NC2 | unconnected | No connect; leave floating, do not connect to VDD or GND. |
| 54 | VDDHA11 | power_in | 1.1-V (±5%) TMDS supply. |
| 55 | IN_D0- | input | TMDS data channel 0 differential input (negative). |
| 56 | IN_D0+ | input | TMDS data channel 0 differential input (positive). |
| 57 | VTERM | power_in | 3.3-V (±5%) supply for DC-coupled internal termination or 1.8-V (±5%) for AC-coupled termination. |
| 58 | VDDHA11 | power_in | 1.1-V (±5%) TMDS supply. |
| 59 | IN_D1- | input | TMDS data channel 1 differential input (negative). |
| 60 | IN_D1+ | input | TMDS data channel 1 differential input (positive). |
| 61 | VDDHA11 | power_in | 1.1-V (±5%) TMDS supply. |
| 62 | IN_D2- | input | TMDS data channel 2 differential input (negative). |
| 63 | IN_D2+ | input | TMDS data channel 2 differential input (positive). |
| 64 | VDD18 | power_in | 1.8-V (±5%) analog supply. |
| 65 | GND | power_in | Exposed thermal pad (DAP) ground; connect to ground plane with at least 9 vias. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-64-EP(9x9) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 65 |
CAD (KiCad official)
- Symbol:
DS90UB949TRGCRQ1 - Footprint:
Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm - 3D model: VQFN-64-EP(9x9) (KiCad packages3D, STEP)
- 3D model files:
ds90ub949trgcrq1-etched.step/ds90ub949trgcrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds90ub949trgcrq1.step/ds90ub949trgcrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (88 pp, sha256
6c33021a3706f57f, retrieved 2026-10-07, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).