main
History Download
Ray Publish 0.1.0 7ee17c3

DS90LV047ATM

Texas Instruments · LVDS ICs · SOIC-16

DS90LV047ATM from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Driver enable pin: when EN is low the driver is disabled; when EN is high and EN* is low or open the driver is enabled; if both EN and EN* are open the driver is disabled.
2 DIN1 input Driver input pin, TTL/CMOS compatible (VIH 2 V to VCC, VIL GND to 0.8 V).
3 DIN2 input Driver input pin, TTL/CMOS compatible (VIH 2 V to VCC, VIL GND to 0.8 V).
4 VCC power_in Power supply pin, +3.3 V ± 0.3 V.
5 GND power_in Ground pin.
6 DIN3 input Driver input pin, TTL/CMOS compatible (VIH 2 V to VCC, VIL GND to 0.8 V).
7 DIN4 input Driver input pin, TTL/CMOS compatible (VIH 2 V to VCC, VIL GND to 0.8 V).
8 EN* input Driver enable pin: when EN* is high the driver is disabled; when EN* is low or open and EN is high the driver is enabled; if both EN and EN* are open the driver is disabled.
9 DOUT4- output Inverting driver output pin, LVDS levels.
10 DOUT4+ output Non-inverting driver output pin, LVDS levels.
11 DOUT3+ output Non-inverting driver output pin, LVDS levels.
12 DOUT3- output Inverting driver output pin, LVDS levels.
13 DOUT2- output Inverting driver output pin, LVDS levels.
14 DOUT2+ output Non-inverting driver output pin, LVDS levels.
15 DOUT1+ output Non-inverting driver output pin, LVDS levels.
16 DOUT1- output Inverting driver output pin, LVDS levels.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Interface ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VCC) VCC -0.3 4 V 3
Input voltage (DIN) -0.3 V max VCC + 0.3 V 3
Enable input voltage (EN, EN*) -0.3 V max VCC + 0.3 V 3
Output voltage (DOUT+, DOUT-) -0.3 3.9 V 3
Maximum package power dissipation (D0016A package) 1088 mW at +25°C 3
Lead temperature soldering 260 °C Soldering (4 s) 3
Maximum junction temperature 150 °C 3
Storage temperature Tstg -65 150 °C 3
Supply voltage VCC 3 3.3 3.6 V 4
Operating free air temperature TA -40 25 85 °C 4
Differential output voltage VOD1 250 310 450 mV RL = 100 Ω (Figure 17) 4
Change in magnitude of VOD1 for complementary output states ΔVOD1 1 35 /mV/ 4
Offset voltage VOS 1.125 1.17 1.375 V 4
Change in magnitude of VOS for complementary output states ΔVOS 1 25 /mV/ 4
Output high voltage VOH 1.33 1.6 V 4
Output low voltage VOL 0.9 1.02 V 4
Input high voltage VIH 2 V max VCC 4
Input low voltage VIL 0.8 V min GND 4
Input high current IIH -10 2 10 µA VIN = VCC or 2.5 V 4
Input low current IIL -10 -2 10 µA VIN = GND or 0.4 V 4
Input clamp voltage VCL -1.5 -0.8 V ICL = -18 mA 4
Output short-circuit current IOS -4.2 -9 mA ENABLED, DIN = VCC, DOUT+ = 0 V or DIN = GND, DOUT- = 0 V 5
Differential output short-circuit current IOSD -4.2 -9 mA ENABLED, VOD = 0 V 5
Power-off leakage IOFF -20 1 20 µA VOUT = 0 V or 3.6 V, VCC = 0 V or Open 5
Output TRI-STATE current IOZ -10 1 10 µA EN = 0.8 V and EN* = 2.0 V, VOUT = 0 V or VCC 5
No load supply current drivers enabled ICC 4 8 mA DIN = VCC or GND 5
Loaded supply current drivers enabled ICCL 20 30 mA RL = 100 Ω all channels, DIN = VCC or GND (all inputs) 5
No load supply current drivers disabled ICCZ 2.2 6 mA DIN = VCC or GND, EN = GND, EN* = VCC 5
Differential propagation delay high to low tPHLD 0.5 0.9 1.7 ns RL = 100 Ω, CL = 15 pF (Figure 18 and Figure 19) 5
Differential propagation delay low to high tPLHD 0.5 1.2 1.7 ns RL = 100 Ω, CL = 15 pF (Figure 18 and Figure 19) 5
Differential pulse skew tSKD1 0 0.3 0.4 ns /tPHLD − tPLHD/ 5
Channel-to-channel skew tSKD2 0 0.4 0.5 ns 5
Differential part-to-part skew tSKD3 0 1 ns 5
Differential part-to-part skew tSKD4 0 1.2 ns 5
Rise time tTLH 0.5 1.5 ns 5
Fall time tTHL 0.5 1.5 ns 5
Disable time high to Z tPHZ 2 5 ns RL = 100 Ω, CL = 15 pF (Figure 20 and Figure 21) 5
Disable time low to Z tPLZ 2 5 ns RL = 100 Ω, CL = 15 pF (Figure 20 and Figure 21) 5
Enable time Z to high tPZH 3 7 ns RL = 100 Ω, CL = 15 pF (Figure 20 and Figure 21) 5
Enable time Z to low tPZL 3 7 ns RL = 100 Ω, CL = 15 pF (Figure 20 and Figure 21) 5
Maximum operating frequency fMAX 200 250 MHz 5

CAD (KiCad official)

  • Symbol: DS90LV047ATM
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: ds90lv047atm-etched.step / ds90lv047atm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds90lv047atm.step / ds90lv047atm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 148b9d9b2cfd7df9, retrieved 2026-11-10, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF