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DS90LV028ATMX

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Texas Instruments LVDS ICs, SOIC-8. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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DS90LV028ATMX

Texas Instruments · LVDS ICs · SOIC-8

DS90LV028ATMX from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RIN1- input Inverting differential receiver input for channel 1, accepts low voltage (350 mV typical) differential signals within the input voltage range of GND to 3.9 V (absolute maximum).
2 RIN1+ input Noninverting differential receiver input for channel 1, accepts low voltage (350 mV typical) differential signals within the input voltage range of GND to 3.9 V (absolute maximum).
3 RIN2+ input Noninverting differential receiver input for channel 2, accepts low voltage (350 mV typical) differential signals within the input voltage range of GND to 3.9 V (absolute maximum).
4 RIN2- input Inverting differential receiver input for channel 2, accepts low voltage (350 mV typical) differential signals within the input voltage range of GND to 3.9 V (absolute maximum).
5 GND power_in Ground pin for power supply return and signal reference.
6 ROUT1 output Receiver output for channel 1, translates LVDS inputs to 3.3 V CMOS logic levels with 2.5 ns maximum propagation delay.
7 ROUT2 output Receiver output for channel 2, translates LVDS inputs to 3.3 V CMOS logic levels with 2.5 ns maximum propagation delay.
8 VCC power_in Power supply pin requiring 3.3 V ±0.3 V nominal with recommended operating range of 3.0 V to 3.6 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.3 4 V 4
Input voltage RIN+, RIN− -0.3 3.9 V 4
Output voltage ROUT -0.3 V ROUT pin; upper limit printed as VCC + 0.3 4
Maximum package power dissipation 1025 mW at 25°C, D package 4
Lead temperature range, soldering 260 °C 4 s 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Electrostatic discharge, human-body model V(ESD) -7000 7000 V HBM, ANSI/ESDA/JEDEC JS-001 4
Electrostatic discharge, machine model V(ESD) -500 500 V MM 4
Supply voltage VCC 3 3.3 3.6 V 4
Receiver input voltage 3 V 4
Operating free-air temperature TA -40 25 85 °C 4
Junction-to-ambient thermal resistance, low-K board RθJA 212 °C/W D (SOIC) package, low-K 4
Junction-to-ambient thermal resistance, high-K board RθJA 122 °C/W D (SOIC) package, high-K 4
Junction-to-case (top) thermal resistance RθJC(top) 69.1 °C/W D (SOIC) package 4
Junction-to-board thermal resistance RθJB 47.7 °C/W D (SOIC) package 4
Junction-to-top characterization parameter ψJT 15.2 °C/W D (SOIC) package 4
Junction-to-board characterization parameter ψJB 47.2 °C/W D (SOIC) package 4
Differential input high threshold VTH 100 mV VCM = 1.2 V, 0 V, 3 V, RIN+, RIN− pins 5
Differential input low threshold VTL -100 mV VCM = 1.2 V, 0 V, 3 V, RIN+, RIN− pins 5
Input current IIN -10 10 μA VCC = 3.6 V or 0 V, VIN = 2.8 V, RIN+, RIN− pins 5
Input current IIN -20 20 μA VCC = 0 V, VIN = 3.6 V, RIN+, RIN− pins 5
Output high voltage VOH 2.7 3.1 V IOH = -0.4 mA, VID = 200 mV, ROUT pin 5
Output low voltage VOL 0.3 0.5 V IOL = 2 mA, VID = -200 mV, ROUT pin 5
Output short-circuit current IOS -100 -50 -15 mA VOUT = 0 V, ROUT pin 5
Input clamp voltage VCL -1.5 -0.8 V ICL = -18 mA, ROUT pin 5
No load supply current ICC 5.4 9 mA VCC pin, inputs open 5
Differential propagation delay high to low tPHLD 1 1.6 2.5 ns CL = 15 pF 5
Differential propagation delay low to high tPLHD 1 1.7 2.5 ns VID = 200 mV 5
Differential pulse skew tSKD1 0 50 400 ps See Figure 18 and Figure 19 5
Differential channel-to-channel skew, same device tSKD2 0 0.1 0.5 ns 5
Differential part to part skew tSKD3 0 1 ns 5
Differential part to part skew tSKD4 0 1.5 ns 5
Rise time tTLH 325 800 ps 5
Fall time tTHL 225 800 ps 5
Maximum operating frequency fMAX 200 250 MHz tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential 5

CAD (KiCad official)

  • Symbol: DS90LV028ATMX
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ds90lv028atmx-etched.step / ds90lv028atmx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds90lv028atmx.step / ds90lv028atmx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 677b699ed5fb99d1, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF