component
DS90LV017ATM
Public Made by Adomby adom
Texas Instruments LVDS ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
Ray
Publish 0.1.0
434a4e6
DS90LV017ATM
Texas Instruments · LVDS ICs · SOIC-8
DS90LV017ATM from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Positive power supply pin, +3.3V ± 0.3V; recommended supply range is 3.0 V to 3.6 V. |
| 2 | DI1 | input | TTL/CMOS driver input pin; VIH is 2.0 V minimum to VCC and VIL is 0.8 V maximum. |
| 3 | NC | unconnected | No connect pin; leave unconnected. |
| 4 | GND | power_in | Ground pin; all voltages are referenced to ground except VOD. |
| 5 | NC | unconnected | No connect pin; leave unconnected. |
| 6 | NC | unconnected | No connect pin; leave unconnected. |
| 7 | DO1+ | output | Non-inverting LVDS driver output; VOD is 250 mV minimum and 450 mV maximum into a 100 Ω load (355 mV typical). |
| 8 | DO1- | output | Inverting LVDS driver output; VOD is 250 mV minimum and 450 mV maximum into a 100 Ω load (355 mV typical), complementary to DO1+. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VCC) recommended | VCC | 3 | 3.3 | 3.6 | V | 2 | |
| Temperature (TA) recommended | TA | -40 | 25 | 85 | °C | 2 | |
| Supply Voltage (VCC) absolute maximum | VCC | -0.3 | 4 | V | 2 | ||
| Input Voltage (DI) absolute maximum | DI | -0.3 | 3.6 | V | 2 | ||
| Output Voltage (DO±) absolute maximum | DO± | -0.3 | 3.9 | V | 2 | ||
| Maximum Package Power Dissipation | 1190 | mW | @ +25°C, D Package | 2 | |||
| Derating above +25°C, D Package | 9.5 | mW/°C | above +25°C, D Package | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Lead Temperature Range Soldering | 260 | °C | 4 sec. | 2 | |||
| ESD HBM | 8 | kV | HBM 1.5 kΩ, 100 pF | 2 | |||
| ESD EIAJ | 1000 | V | EIAJ 0 Ω, 200 pF | 2 | |||
| ESD CDM | 1000 | V | CDM | 2 | |||
| ESD IEC direct | 4 | kV | IEC direct 330 Ω, 150 pF | 2 | |||
| Output Differential Voltage | VOD | 250 | 355 | 450 | mV | RL = 100Ω (Figure 2) | 2 |
| VOD Magnitude Change | ΔVOD | 1 | 35 | mV | 2 | ||
| Output High Voltage | VOH | 1.4 | 1.6 | V | 2 | ||
| Output Low Voltage | VOL | 0.9 | 1.1 | V | 2 | ||
| Offset Voltage | VOS | 1.125 | 1.2 | 1.375 | V | 2 | |
| Offset Magnitude Change | ΔVOS | 0 | 3 | 25 | mV | 2 | |
| Power-off Leakage | IOXD | -10 | 1 | 10 | μA | VOUT = VCC or GND, VCC = 0V | 2 |
| Output Short Circuit Current | IOSD | -8 | -5.7 | mA | 2 | ||
| Input High Voltage | VIH | 2 | V | DI | 2 | ||
| Input Low Voltage | VIL | 0.8 | V | GND | 2 | ||
| Input High Current | IIH | -10 | 2 | 10 | μA | VIN = 3.3V or 2.4V | 2 |
| Input Low Current | IIL | -10 | 1 | 10 | μA | VIN = GND or 0.5V | 2 |
| Input Clamp Voltage | VCL | -1.5 | -0.6 | V | ICL = −18 mA | 2 | |
| Power Supply Current | ICC | 5 | 8 | mA | No Load, VIN = VCC or GND | 2 | |
| Power Supply Current with load | ICC | 7 | 10 | mA | RL = 100Ω | 2 | |
| Differential Propagation Delay High to Low | tPHLD | 0.3 | 0.8 | 1.5 | ns | RL = 100Ω, CL = 15 pF | 3 |
| Differential Propagation Delay Low to High | tPLHD | 0.3 | 1.1 | 1.5 | ns | (Figure 3 and Figure 4) | 3 |
| Differential Pulse Skew | tSKD1 | 0 | 0.3 | 0.7 | ns | 3 | |
| Differential Part to Part Skew (note 6) | tSKD3 | 0 | 1 | ns | 3 | ||
| Differential Part to Part Skew (note 7) | tSKD4 | 0 | 1.2 | ns | 3 | ||
| Transition Low to High Time | tTLH | 0.2 | 0.5 | 1 | ns | 3 | |
| Transition High to Low Time | tTHL | 0.2 | 0.5 | 1 | ns | 3 | |
| Maximum Operating Frequency | fMAX | 350 | MHz | 3 |
CAD (KiCad official)
- Symbol:
DS90LV017ATM - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ds90lv017atm-etched.step/ds90lv017atm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds90lv017atm.step/ds90lv017atm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (17 pp, sha256
c4907a948e2c5026, retrieved 2026-11-11, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DS90LV017ATM
**Texas Instruments** · LVDS ICs · SOIC-8
DS90LV017ATM from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Positive power supply pin, +3.3V ± 0.3V; recommended supply range is 3.0 V to 3.6 V. |
| 2 | DI1 | input | TTL/CMOS driver input pin; VIH is 2.0 V minimum to VCC and VIL is 0.8 V maximum. |
| 3 | NC | unconnected | No connect pin; leave unconnected. |
| 4 | GND | power_in | Ground pin; all voltages are referenced to ground except VOD. |
| 5 | NC | unconnected | No connect pin; leave unconnected. |
| 6 | NC | unconnected | No connect pin; leave unconnected. |
| 7 | DO1+ | output | Non-inverting LVDS driver output; VOD is 250 mV minimum and 450 mV maximum into a 100 Ω load (355 mV typical). |
| 8 | DO1- | output | Inverting LVDS driver output; VOD is 250 mV minimum and 450 mV maximum into a 100 Ω load (355 mV typical), complementary to DO1+. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VCC) recommended | VCC | 3 | 3.3 | 3.6 | V | | 2 |
| Temperature (TA) recommended | TA | -40 | 25 | 85 | °C | | 2 |
| Supply Voltage (VCC) absolute maximum | VCC | -0.3 | | 4 | V | | 2 |
| Input Voltage (DI) absolute maximum | DI | -0.3 | | 3.6 | V | | 2 |
| Output Voltage (DO±) absolute maximum | DO± | -0.3 | | 3.9 | V | | 2 |
| Maximum Package Power Dissipation | | | | 1190 | mW | @ +25°C, D Package | 2 |
| Derating above +25°C, D Package | | | 9.5 | | mW/°C | above +25°C, D Package | 2 |
| Storage Temperature Range | | -65 | | 150 | °C | | 2 |
| Lead Temperature Range Soldering | | | | 260 | °C | 4 sec. | 2 |
| ESD HBM | | 8 | | | kV | HBM 1.5 kΩ, 100 pF | 2 |
| ESD EIAJ | | 1000 | | | V | EIAJ 0 Ω, 200 pF | 2 |
| ESD CDM | | 1000 | | | V | CDM | 2 |
| ESD IEC direct | | 4 | | | kV | IEC direct 330 Ω, 150 pF | 2 |
| Output Differential Voltage | VOD | 250 | 355 | 450 | mV | RL = 100Ω (Figure 2) | 2 |
| VOD Magnitude Change | ΔVOD | | 1 | 35 | mV | | 2 |
| Output High Voltage | VOH | 1.4 | | 1.6 | V | | 2 |
| Output Low Voltage | VOL | 0.9 | | 1.1 | V | | 2 |
| Offset Voltage | VOS | 1.125 | 1.2 | 1.375 | V | | 2 |
| Offset Magnitude Change | ΔVOS | 0 | 3 | 25 | mV | | 2 |
| Power-off Leakage | IOXD | -10 | 1 | 10 | μA | VOUT = VCC or GND, VCC = 0V | 2 |
| Output Short Circuit Current | IOSD | -8 | | -5.7 | mA | | 2 |
| Input High Voltage | VIH | 2 | | | V | DI | 2 |
| Input Low Voltage | VIL | | | 0.8 | V | GND | 2 |
| Input High Current | IIH | -10 | 2 | 10 | μA | VIN = 3.3V or 2.4V | 2 |
| Input Low Current | IIL | -10 | 1 | 10 | μA | VIN = GND or 0.5V | 2 |
| Input Clamp Voltage | VCL | -1.5 | | -0.6 | V | ICL = −18 mA | 2 |
| Power Supply Current | ICC | | 5 | 8 | mA | No Load, VIN = VCC or GND | 2 |
| Power Supply Current with load | ICC | | 7 | 10 | mA | RL = 100Ω | 2 |
| Differential Propagation Delay High to Low | tPHLD | 0.3 | 0.8 | 1.5 | ns | RL = 100Ω, CL = 15 pF | 3 |
| Differential Propagation Delay Low to High | tPLHD | 0.3 | 1.1 | 1.5 | ns | (Figure 3 and Figure 4) | 3 |
| Differential Pulse Skew | tSKD1 | 0 | 0.3 | 0.7 | ns | | 3 |
| Differential Part to Part Skew (note 6) | tSKD3 | 0 | | 1 | ns | | 3 |
| Differential Part to Part Skew (note 7) | tSKD4 | 0 | | 1.2 | ns | | 3 |
| Transition Low to High Time | tTLH | 0.2 | 0.5 | 1 | ns | | 3 |
| Transition High to Low Time | tTHL | 0.2 | 0.5 | 1 | ns | | 3 |
| Maximum Operating Frequency | fMAX | 350 | | | MHz | | 3 |
## CAD (KiCad official)
- Symbol: `DS90LV017ATM`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ds90lv017atm-etched.step` / `ds90lv017atm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds90lv017atm.step` / `ds90lv017atm.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ds90lv017a.pdf) (17 pp, sha256 `c4907a948e2c5026`, retrieved 2026-11-11, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ds90lv017atm-datasheet.pdf)