component
DS90LV011AQMFE
Public Made by Adomby adom
Texas Instruments LVDS ICs, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
Ray
Publish 0.1.0
ae0e906
DS90LV011AQMFE
Texas Instruments · LVDS ICs · SOT-23-5
DS90LV011AQMFE from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply pin, +3.3V ± 0.3V. |
| 2 | GND | power_in | Ground pin. |
| 3 | OUT− | output | Inverting LVDS driver output pin. |
| 4 | OUT+ | output | Non-inverting LVDS driver output pin. |
| 5 | TTL IN | input | LVTTL/LVCMOS driver input pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Interface |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VDD) | VDD | 3 | 3.3 | 3.6 | V | 2 | |
| Temperature (TA) | TA | -40 | 25 | 125 | °C | 2 | |
| Supply Voltage (VDD) absolute maximum | VDD | -0.3 | 4 | V | 2 | ||
| LVCMOS input voltage (TTL IN) | -0.3 | V | max is VDD + 0.3V as printed | 2 | |||
| LVDS output voltage (OUT±) | -0.3 | 3.9 | V | 2 | |||
| LVDS output short circuit current | 24 | mA | 2 | ||||
| Maximum Package Power Dissipation | 794 | mW | DBV package at +25°C | 2 | |||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Lead Temperature Range Soldering | 260 | °C | 4 sec. | 2 | |||
| Maximum Junction Temperature | 135 | °C | 2 | ||||
| ESD HBM | 8 | kV | Human Body Model, JESD22-A114C | 2 | |||
| ESD MM | 250 | V | Machine Model, JESD22-A115-A | 2 | |||
| ESD CDM | 1250 | V | Field Induced Charge Device Model, JESD22-C101-C | 2 | |||
| /VOD/ Output Differential Voltage | /VOD/ | 250 | 350 | 450 | mV | RL = 100Ω (Figure 2 and Figure 3) | 2 |
| ΔVOD VOD Magnitude Change | ΔVOD | 3 | 35 | mV | 2 | ||
| VOS Offset Voltage | VOS | 1.125 | 1.22 | 1.375 | V | RL = 100Ω (Figure 2) | 2 |
| ΔVOS Offset Magnitude Change | ΔVOS | 0 | 1 | 25 | mV | 2 | |
| IOFF Power-off Leakage | IOFF | -10 | 1 | 10 | μA | VOUT = 3.6V or GND, VDD = 0V | 2 |
| IOS Output Short Circuit Current | IOS | -6 | -24 | mA | VOUT+ and VOUT− = 0V | 2 | |
| IOSD Differential Output Short Circuit Current | IOSD | -5 | -12 | mA | VOD = 0V | 2 | |
| COUT Output Capacitance | COUT | 3 | pF | 2 | |||
| VIH Input High Voltage | VIH | 2 | V | TTL IN; max printed as VDD | 3 | ||
| VIL Input Low Voltage | VIL | 0.8 | V | GND as minimum, not numeric | 3 | ||
| IIH Input High Current | IIH | -10 | 2 | 10 | μA | VIN = 3.3V or 2.4V | 3 |
| IIL Input Low Current | IIL | -10 | 1 | 10 | μA | VIN = GND or 0.5V | 3 |
| VCL Input Clamp Voltage | VCL | -1.5 | -0.6 | V | ICL = −18 mA | 3 | |
| CIN Input Capacitance | CIN | 3 | pF | 3 | |||
| IDD Power Supply Current | IDD | 5 | 8 | mA | No Load, VIN = VDD or GND | 3 | |
| IDD Power Supply Current (loaded) | IDD | 7 | 10 | mA | RL = 100Ω | 3 | |
| Differential Propagation Delay High to Low | tPHLD | 0.3 | 1 | 1.5 | ns | RL = 100Ω, CL = 15 pF | 3 |
| Differential Propagation Delay Low to High | tPLHD | 0.3 | 1.1 | 1.5 | ns | Figure 4 and Figure 5 | 3 |
| Differential Pulse Skew | tSKD1 | 0 | 0.1 | 0.7 | ns | 3 | |
| Differential Part to Part Skew | tSKD3 | 0 | 0.2 | 1 | ns | 3 | |
| Differential Part to Part Skew | tSKD4 | 0 | 0.4 | 1.2 | ns | 3 | |
| Transition Low to High Time | tTLH | 0.2 | 0.5 | 1 | ns | 3 | |
| Transition High to Low Time | tTHL | 0.2 | 0.5 | 1 | ns | 3 | |
| Maximum Operating Frequency | fMAX | 250 | MHz | 3 | |||
| Package Thermal Resistance θJA | θJA | 138.5 | °C/W | 4-Layer, 2 oz. Cu, JEDEC | 2 | ||
| Package Thermal Resistance θJC | θJC | 107 | °C/W | 4-Layer, 2 oz. Cu, JEDEC | 2 |
CAD (KiCad official)
- Symbol:
DS90LV011AQMFE - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
ds90lv011aqmfe-etched.step/ds90lv011aqmfe-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds90lv011aqmfe.step/ds90lv011aqmfe.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (13 pp, sha256
b4d1e486264c9ed5, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DS90LV011AQMFE
**Texas Instruments** · LVDS ICs · SOT-23-5
DS90LV011AQMFE from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply pin, +3.3V ± 0.3V. |
| 2 | GND | power_in | Ground pin. |
| 3 | OUT− | output | Inverting LVDS driver output pin. |
| 4 | OUT+ | output | Non-inverting LVDS driver output pin. |
| 5 | TTL IN | input | LVTTL/LVCMOS driver input pin. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Interface |
| Pins | 5 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VDD) | VDD | 3 | 3.3 | 3.6 | V | | 2 |
| Temperature (TA) | TA | -40 | 25 | 125 | °C | | 2 |
| Supply Voltage (VDD) absolute maximum | VDD | -0.3 | | 4 | V | | 2 |
| LVCMOS input voltage (TTL IN) | | -0.3 | | | V | max is VDD + 0.3V as printed | 2 |
| LVDS output voltage (OUT±) | | -0.3 | | 3.9 | V | | 2 |
| LVDS output short circuit current | | | | 24 | mA | | 2 |
| Maximum Package Power Dissipation | | | | 794 | mW | DBV package at +25°C | 2 |
| Storage Temperature | | -65 | | 150 | °C | | 2 |
| Lead Temperature Range Soldering | | | | 260 | °C | 4 sec. | 2 |
| Maximum Junction Temperature | | | | 135 | °C | | 2 |
| ESD HBM | | 8 | | | kV | Human Body Model, JESD22-A114C | 2 |
| ESD MM | | 250 | | | V | Machine Model, JESD22-A115-A | 2 |
| ESD CDM | | 1250 | | | V | Field Induced Charge Device Model, JESD22-C101-C | 2 |
| /VOD/ Output Differential Voltage | /VOD/ | 250 | 350 | 450 | mV | RL = 100Ω (Figure 2 and Figure 3) | 2 |
| ΔVOD VOD Magnitude Change | ΔVOD | | 3 | 35 | mV | | 2 |
| VOS Offset Voltage | VOS | 1.125 | 1.22 | 1.375 | V | RL = 100Ω (Figure 2) | 2 |
| ΔVOS Offset Magnitude Change | ΔVOS | 0 | 1 | 25 | mV | | 2 |
| IOFF Power-off Leakage | IOFF | -10 | 1 | 10 | μA | VOUT = 3.6V or GND, VDD = 0V | 2 |
| IOS Output Short Circuit Current | IOS | -6 | -24 | | mA | VOUT+ and VOUT− = 0V | 2 |
| IOSD Differential Output Short Circuit Current | IOSD | -5 | -12 | | mA | VOD = 0V | 2 |
| COUT Output Capacitance | COUT | | 3 | | pF | | 2 |
| VIH Input High Voltage | VIH | 2 | | | V | TTL IN; max printed as VDD | 3 |
| VIL Input Low Voltage | VIL | | | 0.8 | V | GND as minimum, not numeric | 3 |
| IIH Input High Current | IIH | -10 | 2 | 10 | μA | VIN = 3.3V or 2.4V | 3 |
| IIL Input Low Current | IIL | -10 | 1 | 10 | μA | VIN = GND or 0.5V | 3 |
| VCL Input Clamp Voltage | VCL | -1.5 | | -0.6 | V | ICL = −18 mA | 3 |
| CIN Input Capacitance | CIN | | 3 | | pF | | 3 |
| IDD Power Supply Current | IDD | | 5 | 8 | mA | No Load, VIN = VDD or GND | 3 |
| IDD Power Supply Current (loaded) | IDD | | 7 | 10 | mA | RL = 100Ω | 3 |
| Differential Propagation Delay High to Low | tPHLD | 0.3 | 1 | 1.5 | ns | RL = 100Ω, CL = 15 pF | 3 |
| Differential Propagation Delay Low to High | tPLHD | 0.3 | 1.1 | 1.5 | ns | Figure 4 and Figure 5 | 3 |
| Differential Pulse Skew | tSKD1 | 0 | 0.1 | 0.7 | ns | | 3 |
| Differential Part to Part Skew | tSKD3 | 0 | 0.2 | 1 | ns | | 3 |
| Differential Part to Part Skew | tSKD4 | 0 | 0.4 | 1.2 | ns | | 3 |
| Transition Low to High Time | tTLH | 0.2 | 0.5 | 1 | ns | | 3 |
| Transition High to Low Time | tTHL | 0.2 | 0.5 | 1 | ns | | 3 |
| Maximum Operating Frequency | fMAX | | | 250 | MHz | | 3 |
| Package Thermal Resistance θJA | θJA | | 138.5 | | °C/W | 4-Layer, 2 oz. Cu, JEDEC | 2 |
| Package Thermal Resistance θJC | θJC | | 107 | | °C/W | 4-Layer, 2 oz. Cu, JEDEC | 2 |
## CAD (KiCad official)
- Symbol: `DS90LV011AQMFE`
- Footprint: `Package_TO_SOT_SMD:SOT-23-5`
- 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files: `ds90lv011aqmfe-etched.step` / `ds90lv011aqmfe-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds90lv011aqmfe.step` / `ds90lv011aqmfe.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ds90lv011aq-q1) (13 pp, sha256 `b4d1e486264c9ed5`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ds90lv011aqmfe-datasheet.pdf)