component
DS90C401MX
Public Made by Adomby adom
Texas Instruments LVDS ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
DS90C401MX
Texas Instruments · LVDS ICs · SOIC-8
DS90C401MX from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Positive power supply pin, specified at +5.0V ±10% (recommended supply range 4.5 V to 5.5 V). |
| 2 | DOUT− | output | Inverting driver output pin; it goes high when DIN is low and low when DIN is high, per the truth table. |
| 3 | DOUT+ | output | Non-inverting driver output pin; it goes high when DIN is high and low when DIN is low, per the truth table. |
| 4 | DIN | input | TTL/CMOS driver input pin; a logic-high input drives DOUT+ high and DOUT− low. |
| 5 | GND | power_in | Ground pin for the device. |
| 6 | DOUT− | output | Inverting driver output pin (second channel); it goes high when DIN is low and low when DIN is high, per the truth table. |
| 7 | DOUT+ | output | Non-inverting driver output pin (second channel); it goes high when DIN is high and low when DIN is low, per the truth table. |
| 8 | DIN | input | TTL/CMOS driver input pin (second channel); a logic-high input drives DOUT+ high and DOUT− low. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VCC) | VCC | -0.3 | 6 | V | 2 | ||
| Input Voltage (DIN) | -0.3 | V | 2 | ||||
| Output Voltage (DOUT+, DOUT−) | -0.3 | V | 2 | ||||
| Maximum Package Power Dissipation | 1068 | mW | D Package @ +25°C | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Lead Temperature Range Soldering | 260 | °C | 4 sec. | 2 | |||
| Maximum Junction Temperature | 150 | °C | 2 | ||||
| ESD Rating (HBM) | 3500 | V | HBM, 1.5 kΩ, 100 pF | 2 | |||
| ESD Rating (EIAJ) | 250 | V | EIAJ, 0 Ω, 200 pF | 2 | |||
| Supply Voltage | VCC | 4.5 | 5 | 5.5 | V | 2 | |
| Operating Free Air Temperature | TA | -40 | 25 | 85 | °C | 2 | |
| Differential Output Voltage | VOD1 | 250 | 340 | 450 | mV | RL = 100Ω (Figure 1) | 2 |
| Change in Magnitude of VOD1 for Complementary Output States | ΔVOD1 | 35 | /mV/ | 2 | |||
| Offset Voltage | VOS | 1.125 | 1.25 | 1.375 | V | 2 | |
| Change in Magnitude of VOS for Complementary Output States | ΔVOS | 25 | /mV/ | 2 | |||
| Output Voltage High | VOH | 1.41 | 1.6 | V | RL = 100Ω | 2 | |
| Output Voltage Low | VOL | 0.9 | 1.07 | V | 2 | ||
| Output Short Circuit Current | IOS | -5 | -3.5 | mA | VOUT = 0V | 2 | |
| Input Voltage High | VIH | 2 | V | DIN | 2 | ||
| Input Voltage Low | VIL | 0.8 | V | GND | 2 | ||
| Input Current | II | -10 | 1 | 10 | μA | VIN = VCC, GND, 2.5V or 0.4V | 2 |
| Input Clamp Voltage | VCL | -1.5 | -0.8 | V | ICL = −18 mA | 2 | |
| No Load Supply Current | ICC | 1.7 | 3 | mA | DIN = VCC or GND | 2 | |
| No Load Supply Current | ICC | 3.5 | 5.5 | mA | DIN = 2.5V or 0.4V | 2 | |
| Loaded Supply Current | ICCL | 8 | 14 | mA | RL = 100Ω; All Channels; VIN = VCC or GND (all inputs) | 2 | |
| Differential Propagation Delay High to Low | tPHLD | 0.5 | 2 | 3.5 | ns | RL = 100Ω, CL = 5 pF (Figure 2 and Figure 3) | 3 |
| Differential Propagation Delay Low to High | tPLHD | 0.5 | 2.1 | 3.5 | ns | 3 | |
| Differential Skew | tSKD | 0 | 80 | 900 | ps | /tPHLD − tPLHD/ | 3 |
| Channel-to-Channel Skew | tSK1 | 0 | 0.3 | 1 | ns | 3 | |
| Chip to Chip Skew | tSK2 | 3 | ns | 3 | |||
| Rise Time | tTLH | 0.35 | 2 | ns | 3 | ||
| Fall Time | tTHL | 0.35 | 2 | ns | 3 |
CAD (KiCad official)
- Symbol:
DS90C401MX - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ds90c401mx-etched.step/ds90c401mx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds90c401mx.step/ds90c401mx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (20 pp, sha256
a8a43ecd6b3c4b7b, retrieved 2026-11-10, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).