component

DS90C032TMX

Public Made by Adom

by adom

Texas Instruments LVDS ICs, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterfaceds90c032tmxfactory-2.0.0extractor-text

Verified DS90C032TMX

by Ray · last 5 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

5 Nov 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: DS90C032TMX · SOIC-16 · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 18-page datasheet
  • ✓distributor: lcsc C2671004, digikey DS90C032TMXTR-ND, mouser 926-DS90C032TMX
  • ✓family: SOIC-16_3.9x9.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-ir4dfq3u/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ ds90c032tmx.kicad_sym✓ ds90c032tmx.kicad_mod✓ ds90c032tmx.step
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DS90C032TMX

Texas Instruments · LVDS ICs · SOIC-16

DS90C032TMX from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RIN− input Inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
2 RIN+ input Non-inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
3 ROUT output Receiver CMOS output pin; output is HIGH for both fail-safe conditions and goes to TRI-STATE when the receiver is disabled.
4 EN input Active high enable pin, OR-ed with EN*.
5 ROUT output Receiver CMOS output pin; output is HIGH for both fail-safe conditions and goes to TRI-STATE when the receiver is disabled.
6 RIN+ input Non-inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
7 RIN− input Inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
8 GND power_in Ground pin; all voltages are referenced to this pin.
9 RIN− input Inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
10 RIN+ input Non-inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
11 ROUT output Receiver CMOS output pin; output is HIGH for both fail-safe conditions and goes to TRI-STATE when the receiver is disabled.
12 EN* input Active low enable pin, OR-ed with EN.
13 ROUT output Receiver CMOS output pin; output is HIGH for both fail-safe conditions and goes to TRI-STATE when the receiver is disabled.
14 RIN+ input Non-inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
15 RIN− input Inverting receiver input pin; operating input voltage range is 0V to +2.4V measured from each pin to ground.
16 VCC power_in Power supply pin, +5V ± 10%, with a recommended supply range of +4.5V to +5.5V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6 V 3
Maximum Package Power Dissipation at +25°C, D Package 1025 mW D package 3
Derate D Package 8.2 mW/°C above +25°C 3
Storage Temperature Range -65 150 °C 3
Lead Temperature Range Soldering 260 °C 4 seconds 3
Maximum Junction Temperature (DS90C032T) 150 °C DS90C032T 3
ESD HBM 3500 V HBM, 1.5 kΩ, 100 pF 3
ESD EIAJ 250 V EIAJ, 0 Ω, 200 pF 3
Supply Voltage VCC 4.5 5 5.5 V 3
Receiver Input Voltage 0 2.4 V 3
Operating Free Air Temperature (TA) DS90C032T TA -40 25 85 °C DS90C032T 3
Differential Input High Threshold VTH 100 mV VCM = +1.2V, RIN+, RIN− 4
Differential Input Low Threshold VTL -100 mV VCM = +1.2V, RIN+, RIN− 4
Input Current IIN -10 1 10 µA VIN = +2.4V, VCC = 5.5V 4
Output High Voltage VOH 3.8 4.9 V IOH = −0.4 mA, VID = +200 mV, ROUT 4
Output Low Voltage VOL 0.07 0.3 V IOL = 2 mA, VID = −200 mV 4
Output Short Circuit Current IOS -15 -60 -100 mA Enabled, VOUT = 0V 4
Output TRI-STATE Current IOZ -10 1 10 µA Disabled, VOUT = 0V or VCC 4
Input High Voltage VIH 2 V EN, EN* 4
Input Low Voltage VIL 0.8 V EN, EN* 4
Input Clamp Voltage VCL -1.5 -0.8 V ICL = −18 mA 4
No Load Supply Current, Receivers Enabled ICC 3.5 10 mA EN, EN* = VCC or GND, Inputs Open, DS90C032T 4
No Load Supply Current, Receivers Disabled ICCZ 3.5 10 mA EN = GND, EN* = VCC, Inputs Open, DS90C032T 4
Differential Propagation Delay High to Low tPHLD 1.5 3.4 5 ns VCC = +5.0V, TA = +25°C, CL = 5 pF, VID = 200 mV 4
Differential Propagation Delay Low to High tPLHD 1.5 3.48 5 ns VCC = +5.0V, TA = +25°C, CL = 5 pF, VID = 200 mV 4
Differential Skew tSKD 0 80 600 ps VCC = +5.0V, TA = +25°C, /tPHLD − tPLHD/ 4
Channel-to-Channel Skew tSK1 0 0.6 1 ns VCC = +5.0V, TA = +25°C 4
Rise Time tTLH 0.5 2 ns VCC = +5.0V, TA = +25°C 4
Fall Time tTHL 0.5 2 ns VCC = +5.0V, TA = +25°C 4
Disable Time High to Z tPHZ 10 15 ns VCC = +5.0V, TA = +25°C, RL = 2 kΩ, CL = 10 pF 4
Disable Time Low to Z tPLZ 10 15 ns VCC = +5.0V, TA = +25°C, RL = 2 kΩ, CL = 10 pF 4
Enable Time Z to High tPZH 4 10 ns VCC = +5.0V, TA = +25°C 4
Enable Time Z to Low tPZL 4 10 ns VCC = +5.0V, TA = +25°C 4
Differential Propagation Delay High to Low tPHLD 1 3.4 6 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C, CL = 5 pF, VID = 200 mV 5
Differential Propagation Delay Low to High tPLHD 1 3.48 6 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C, CL = 5 pF, VID = 200 mV 5
Differential Skew tSKD 0 0.08 1.2 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C, /tPHLD − tPLHD/ 5
Channel-to-Channel Skew tSK1 0 0.6 1.5 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5
Chip to Chip Skew tSK2 5 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5
Rise Time tTLH 0.5 2.5 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5
Fall Time tTHL 0.5 2.5 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5
Disable Time High to Z tPHZ 10 20 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C, RL = 2 kΩ, CL = 10 pF 5
Disable Time Low to Z tPLZ 10 20 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C, RL = 2 kΩ, CL = 10 pF 5
Enable Time Z to High tPZH 4 15 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5
Enable Time Z to Low tPZL 4 15 ns VCC = +5.0V ± 10%, TA = −40°C to +85°C 5

CAD (KiCad official)

  • Symbol: DS90C032TMX
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: ds90c032tmx-etched.step / ds90c032tmx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds90c032tmx.step / ds90c032tmx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (18 pp, sha256 8a1d12517016b994, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF