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DS8921AMX

Public Made by Adom

by adom

Texas Instruments RS-485/RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DS8921AMX

Texas Instruments · RS-485/RS-422 ICs · SOIC-8

DS8921AMX from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Power supply pin for the 5-V supply (4.5 V to 5.5 V recommended), to be bypassed with a 0.1-µF capacitor placed close to the pin.
2 RO output Receiver output, TTL-compatible single-ended output of the differential receiver.
3 DI input TTL/CMOS-compatible driver input.
4 GND power_in Power ground pin.
5 DO- output Complementary differential driver output (DO-) that drives the twisted-pair or parallel-wire transmission line.
6 DO+ output Differential driver output (DO+) that drives the transmission line and follows DI per the function table.
7 RI- input Differential receiver input (RI-) with ±200 mV sensitivity over a ±7 V common-mode range.
8 RI+ input Differential receiver input (RI+) with ±200 mV sensitivity over a ±7 V common-mode range.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 4.5 5.5 V 4
Operating Temperature DS8921/DS8921A TA 0 70 °C 4
Receiver Threshold Voltage VTH -200 35 200 mV -7 V ≤ VCM ≤ +7 V (typ printed as ±35) 4
Receiver Hysteresis VHYST 15 70 mV -7 V ≤ VCM ≤ +7 V 4
Receiver Input Resistance RIN 4 6 kΩ VIN = -7 V, +7 V, (Other Input = GND) 4
Receiver Input Current IIN 3.25 mA VIN = 10 V 4
Receiver Input Current IIN -3.25 mA VIN = -10 V 4
Receiver Output High Voltage VOH 2.5 V IOH = -400 μA 4
Receiver Output Low Voltage VOL 0.5 V IOL = 8 mA 4
Receiver Short-Circuit Current ISC -15 -100 mA VCC = MAX, VOUT = 0 V 4
Driver Input High Voltage VIH 2 V 4
Driver Input Low Voltage VIL 0.8 V 4
Driver Input Low Current IIL -40 -200 μA VCC = MAX, VIN = 0.4 V 4
Driver Input High Current IIH 20 μA VCC = MAX, VIN = 2.7 V 4
Driver Input Current II 100 μA VCC = MAX, VIN = 7.0 V 4
Driver Input Clamp Voltage VCL -1.5 V VCC = MIN, IIN = -18 mA 4
Driver Output High Voltage VOH 2.5 V VCC = MIN, IOH = -20 mA 4
Driver Output Low Voltage VOL 0.5 V VCC = MIN, IOL = +20 mA 4
Driver Output Off Current IOFF 100 μA VCC = 0V, VOUT = 5.5 V 4
Driver Output Voltage Difference /VT/, /VT/ 0.4 V 4
Driver Differential Output Voltage VT 2 V 4
Driver Offset Voltage Difference /VOS, VOS/ 0.4 V 4
Driver Short-Circuit Current ISC -30 -150 mA VCC = MAX, VOUT = 0 V 4
Supply Current ICC 35 mA VCC = MAX, VOUT = Logic 0 4
Receiver Propagation Delay tpLH tpLH 14 20 ns CL = 30 pF 5
Receiver Propagation Delay tpHL tpHL 14 20 ns CL = 30 pF 5
Receiver /tpLH-tpHL/ /tpLH-tpHL/ 0.5 3.5 ns CL = 30 pF 5
Driver Single-Ended tpLH tpLH 10 15 ns CL = 30 pF 5
Driver Single-Ended tpHL tpHL 10 15 ns CL = 30 pF 5
Driver Transition Time tTLH tTLH 5 8 ns CL = 30 pF 5
Driver Transition Time tTHL tTHL 5 8 ns CL = 30 pF 5
Driver Output Skew Skew 1 3.5 ns CL = 30 pF 5
Driver Differential tpLH tpLH 10 15 ns CL = 30 pF 5
Driver Differential tpHL tpHL 10 15 ns CL = 30 pF 5
Driver Differential /tpLH-tpHL/ /tpLH-tpHL/ 0.5 2.75 ns CL = 30 pF 5
Supply Voltage 7 V 3
Driver Input Voltage -0.5 7 V 3
Output Voltage 5.5 V 3
Receiver Output Sink Current 50 mA 3
Receiver Input Voltage -10 10 V 3
Differential Input Voltage -12 12 V 3
Maximum Package Power Dissipation, D Package 730 mW at 25°C 3
Derating, D Package 9.3 mW/°C above 25°C 3
Lead Temperature 260 °C Soldering, 4 sec. 3
Maximum Junction Temperature 150 °C 3
Storage Temperature Tstg -65 165 °C 3
ESD HBM V(ESD) -2000 2000 V Human-body model, ANSI/ESDA/JEDEC JS-001 4
ESD CDM V(ESD) -1500 1500 V Charged-device model, JEDEC JESD22-C101 4

CAD (KiCad official)

  • Symbol: DS8921AMX
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ds8921amx-etched.step / ds8921amx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds8921amx.step / ds8921amx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (22 pp, sha256 0be14ebc915d205b, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF