# DS8201-50F8

**DSTECH** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8

DS8201-50F8 from DSTECH, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated output port; for DS8201-50 the absolute maximum VOUT-to-GND rating is -0.3V to 6V, output current is limited to 140mA typical, and the output capacitor (1uF to 22uF effective, ESR above 1mΩ) should sit close to VOUT and GND. |
| 2 | SNS | input | Output voltage sense input used to set the output voltage through the feedback divider from VOUT; for DS8201-50 the absolute maximum SNS-to-GND rating is -0.3V to 6V, and divider current should exceed 50uA. |
| 3 | NC | unconnected | No internal connection; the datasheet specifies this pin as floating. |
| 4 | GND | power_in | Ground reference pin; input and output capacitor ground connections must return directly to this pin using short, wide traces. |
| 5 | EN | input | Enable control: pulling EN low enters shutdown mode (about 0.1uA typical shutdown current), with the EN rising threshold VIH of 3.0V and falling threshold VIL of 0.6V. |
| 6 | NC | unconnected | No internal connection; the datasheet specifies this pin as floating. |
| 7 | NC | unconnected | No internal connection; the datasheet specifies this pin as floating. |
| 8 | VIN | power_in | Power input; recommended input voltage is 3.0V to 110V, absolute maximum VIN-to-GND rating is -0.3V to 125V, and a 1uF or larger input capacitor should be placed close to VIN and GND. |
| 9 | Exposed Pad | passive | Exposed thermal pad for heat dissipation, which may be left floating or connected to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | DSTECH |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage VIN | VIN | 3 |  | 110 | V |  | 5 |
| Output voltage accuracy |  | -1 |  | 1 | % | ILOAD =0.1mA | 5 |
| Dropout voltage | VDROP |  |  | 0.5 | V | ILOAD =50mA; VOUT ≥ 5V | 5 |
| Quiescent current | IQ |  | 3 |  | µA | ILOAD = 0mA; VOUT ≤ 5V | 5 |
| Shutdown current | ISD |  | 0.1 | 0.5 | µA | VEN = 0V, VOUT = 0V | 5 |
| VOUT leakage current in shutdown mode | ILEAK |  | 0.1 | 0.5 | µA | shutdown mode (row label) | 5 |
| SNS input current | ISNS |  | 0.85 |  | µA | SNS = VOUT; VOUT ≤ 5V | 5 |
| EN threshold rising | VIH | 3 |  |  | V | EN Rising | 5 |
| EN threshold falling | VIL |  |  | 0.6 | V | EN Falling | 5 |
| EN input current | IEN |  | 10 | 100 | nA | VEN = 36V | 5 |
| Input voltage regulation | ΔLINE |  |  | 0.3 | % | ILOAD =10mA, 5 ≤ VIN ≤ 55V | 5 |
| Load voltage regulation | ΔLOAD |  |  | 0.5 | % | 1mA ≤ ILOAD ≤ 50mA | 5 |
| Output current limit | ILIM | 101 | 140 |  | mA | VOUT =0 | 5 |
| Power supply rejection ratio | PSRR |  | 70 |  | dB | VOUT =5V, ILOAD =30mA, VIN = 12V, f = 100Hz | 5 |
| Thermal shutdown temperature | TSD |  | 160 |  | °C | ILOAD =10mA | 5 |
| Thermal shutdown hysteresis | ΔTSD |  | 15 |  | °C |  | 5 |
| VIN to GND | VIN | -0.3 |  | 125 | V |  | 4 |
| SNS to GND | SNS | -0.3 |  | 6 | V | DS8201-18, DS8201-33, DS8201-50 | 4 |
| VOUT to GND | VOUT | -0.3 |  | 6 | V | DS8201-18, DS8201-33, DS8201-50 | 4 |
| VOUT to VIN | VOUT-VIN | -125 |  | 0.3 | V |  | 4 |
| Junction temperature |  |  |  | 150 | oC |  | 4 |
| Storage temperature range |  | -60 |  | 150 | oC |  | 4 |
| Lead soldering temperature |  |  |  | 260 | oC | Soldering, 10 sec. | 4 |
| ESD HBM |  |  |  | 2 | KV | HBM | 4 |
| ESD MM |  |  |  | 200 | V | MM | 4 |
| Thermal resistance junction-to-ambient, ESOP-8 | θJA |  | 55 |  | oC/W | TA = 25°C, DSTECH EVB board (Note 2) | 4 |
| Input voltage VIN (recommended) | VIN | 3 |  | 110 | V |  | 4 |
| Application junction temperature range | TJ | -40 |  | 125 | oC |  | 4 |
| Application ambient temperature range | TA | -40 |  | 85 | oC |  | 4 |

## CAD (KiCad official)

- Symbol: `DS8201-50F8`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ds8201-50f8-etched.step` / `ds8201-50f8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds8201-50f8.step` / `ds8201-50f8.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [DSTECH datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590908699827519488) (13 pp, sha256 `53613125cec676a8`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ds8201-50f8-datasheet.pdf)