# DS8201-33F8

**DSTECH** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8

DS8201-33F8 from DSTECH, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated 3.3V power output (±1% accuracy, up to 80mA). Requires a 1µF to 22µF output capacitor placed close to VOUT and GND for stability and improved PSRR/transient response. |
| 2 | SNS | input | Output voltage sense input; tie to VOUT for fixed 3.3V operation, or connect to a resistor divider from VOUT to GND for adjustable output. Abs-max on the -33 option is -0.3V to 6V; typical SNS input current ~0.85µA. |
| 3 | NC | unconnected | No internal connection; leave floating. |
| 4 | GND | power_in | Device ground reference. Should be tied to the exposed pad and to the ground planes with short, wide traces near input/output capacitors for best performance. |
| 5 | EN | input | Active-high enable input. VIH ≥ 3.0V enables regulation; VIL ≤ 0.6V drives shutdown mode (ISD ≈ 100nA typical, 500nA max). EN input current ~10nA (VEN = 36V). |
| 6 | NC | unconnected | No internal connection; leave floating. |
| 7 | NC | unconnected | No internal connection; leave floating. |
| 8 | VIN | power_in | High-voltage supply input, 3.0V to 110V recommended (abs-max 125V to GND). Requires a 1µF or larger input capacitor placed close to VIN and GND. |
| 9 | EP | passive | Exposed thermal pad on the ESOP-8 package. May be left floating or connected to GND; connecting to a copper ground pour is recommended to reduce θJA (55°C/W) and improve power dissipation (PD_max ≈ 1.82W at TA=25°C). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | DSTECH |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 9 |

## Ordering variants

- `DS8201-33F8`
- `DS8201-33F8B8`
- `DS8201-33F8S5`
- `DS8201-33F8A3`

## CAD (KiCad official)

- Symbol: `DS8201-33F8`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ds8201-33f8-etched.step` / `ds8201-33f8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds8201-33f8.step` / `ds8201-33f8.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [DSTECH datasheet](docs/ds8201-33f8-datasheet.pdf) (None pp, sha256 `53613125cec676a8`, retrieved 2026-08-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ds8201-33f8-datasheet.pdf)