component
DS6521BFD33
Public Made by Adomby adom
DSTECH Battery Management, DFN-10L(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDS6521BFD33
DSTECH · Battery Management · DFN-10L(3x3)
DS6521BFD33 from DSTECH, in a DFN-10L(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TS | input | Connects to the battery pack's temperature-sensing thermistor (25°C NTC, 10K or 100K). |
| 2 | ISET | passive | Programs the fast-charge current; an external resistor from ISET to GND sets the fast-charge current value. |
| 3 | GND | power_in | Ground. |
| 4 | VIN | power_in | Input supply voltage, recommended 4.5V to 24V (28V absolute max). |
| 5 | VCC | power_out | Internal regulator output; a 0.1uF to 1uF capacitor to ground is recommended. |
| 6 | IMIN | passive | Programs the charge termination current; an external resistor from IMIN to GND sets the termination current value. |
| 7 | BAT | power_out | Battery connection, may also connect to the system load; recommended bypass capacitor 10uF to 22uF. |
| 8 | TEM | output | Open-drain output: low (FET on) indicates charge current is below the termination current, open (FET off) indicates it is above. |
| 9 | CHG | output | Open-drain output: low (FET on) indicates charging, open (FET off) indicates not charging or charge complete. |
| 10 | EN | input | Chip enable input; high threshold 1.5V rising, low threshold 0.4V falling. |
| 11 | PGND | power_in | Exposed pad, chip substrate; leave floating or connect directly to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | DSTECH |
| Package | DFN-10L(3x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage (recommended) | VIN | 4.5 | 24 | V | 4 | ||
| Application junction temperature range | -40 | 125 | oC | 4 | |||
| Application ambient temperature range | -40 | 85 | oC | 4 | |||
| VIN / EN / CHG / TEM to GND | -0.3 | 28 | V | 4 | |||
| BAT to GND | -0.3 | 15 | V | 4 | |||
| Other pins to GND | -0.3 | 6 | V | 4 | |||
| Storage temperature range | -60 | 150 | oC | 4 | |||
| Junction temperature (absolute maximum) | 150 | oC | 4 | ||||
| Lead soldering temperature | 260 | oC | Soldering, 10 sec. | 4 | |||
| ESD HBM | 2 | KV | HBM | 4 | |||
| ESD MM | 200 | V | MM | 4 | |||
| Thermal resistance junction-to-ambient, DFN3x3-10L | θJA | 70 | oC /W | TA = 25°C, DSTECH EVB board (Note 2) | 4 | ||
| Input voltage | VIN | 4.5 | 24 | V | 5 | ||
| Input overvoltage protection threshold | VOVP | 6 | V | VIN Rising | 5 | ||
| Input overvoltage protection hysteresis | VOVP_HYS | 0.2 | V | 5 | |||
| Input supply current, charge mode | IQA | 350 | μA | EN = High, VIN = 5V, no load on OUT terminal | 5 | ||
| Input standby current | IQS | 80 | μA | EN = 0V, VIN = 5V | 5 | ||
| Reverse battery current (BAT pin inflow) | IRBAT | 800 | μA | VBAT = -4.2V | 5 | ||
| EN high threshold voltage | VIH | 1.5 | V | EN Rising | 5 | ||
| EN low threshold voltage | VIL | 0.4 | V | EN Falling | 5 | ||
| EN input current | IEN | 10 | 100 | nA | VEN = 5V | 5 | |
| Battery output voltage, Type B (4.35V) | VBAT | 4.31 | 4.35 | 4.39 | V | 5 | |
| Recharge battery voltage, Type B | VBAT | 4.125 | V | 5 | |||
| Fast charge current | ICHG | 50 | 1000 | mA | RISET = KΩ | 5 | |
| Fast charge current accuracy, ICHG > 100mA | ICHG | -10 | 10 | % | ICHG > 100mA | 5 | |
| Fast charge current accuracy, ICHG < 100mA | ICHG | -10 | 10 | mA | ICHG < 100mA | 5 | |
| Pre-charge current | IPRE | 10 | % | Percentage of ICHG | 5 | ||
| Termination (cut-off) charge current | IMIN | 5 | 100 | mA | RIMIN = KΩ | 5 | |
| Termination current delay time | TTEM | 16.7 | mS | IMIN to CHG | 5 | ||
| Temperature regulation threshold | TJ(REG) | 125 | °C | 5 | |||
| Thermal shutdown temperature | TJ_OFF | 155 | °C | 5 |
CAD (KiCad official)
- Symbol:
DS6521BFD33 - Footprint:
Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm - 3D model: DFN-10L(3x3) (KiCad packages3D, STEP)
- 3D model files:
ds6521bfd33-etched.step/ds6521bfd33-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds6521bfd33.step/ds6521bfd33.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: DSTECH datasheet (15 pp, sha256
e4ba68fabe077547, retrieved 2026-11-05, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).