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DS3232MZ+TRL

Analog Devices Inc Maxim Integrated · Real Time Clocks · SO-8

DS3232MZ+TRL from Analog Devices Inc Maxim Integrated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 32KHZ output 32.768kHz push-pull output with 50% duty cycle, active on VCC when EN32KHZ = 1 and on VBAT when BB32KHZ = 1, forced low when disabled, and may be left unconnected if not used.
2 VCC power_in Primary power supply pin that should be decoupled using a 0.1µF to 1.0µF capacitor, and connected to ground if not used.
3 INT/SQW output Open-drain active-low interrupt or 1Hz square-wave output that requires an external pullup to a supply of 4.5V or less and may be left open if not used.
4 RST bidirectional Open-drain active-low reset input/output that indicates VCC status relative to VPF and doubles as a debounced pushbutton input, with an internal 50kΩ nominal pullup to VCC, so no external pullup should be connected.
5 GND power_in Ground reference for the device.
6 VBAT power_in Backup power-supply input that should be decoupled with a 0.1µF to 1.0µF low-leakage capacitor when used as the primary source, is not required when used as backup, and should be connected to ground if not used.
7 SDA bidirectional Open-drain I2C serial data input/output that requires an external pullup resistor, with the pullup voltage up to 4.5V regardless of the voltage on VCC.
8 SCL input I2C serial clock input that synchronizes data movement on the serial interface, with the pullup voltage up to 4.5V regardless of the voltage on VCC.

Key specifications

Parameter Value
Manufacturer Analog Devices Inc Maxim Integrated
Package SO-8
Category Clock/Timing
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
1Hz Frequency Tolerance Df/fOUT -5 5 ppm Measured over 10s interval 2
1Hz Frequency Stability vs. VCC Df/V -1 1 ppm/V 2
Timekeeping Accuracy tKA -0.432 0.432 Seconds/Day 2
32kHz Frequency Tolerance Df/fOUT -2.5 2.5 % 2
Supply Voltage (VCC) VCC 2.3 3.3 4.5 V 2
Supply Voltage (VBAT) VBAT 2.3 3 4.5 V 2
Logic 0 Input VIL -0.3 V 2
Active Supply Current (I2C Active) ICCA 125 250 µA Note 3 2
Standby Supply Current (I2C Inactive) ICCS 100 175 µA Notes 3, 4 2
Temperature Conversion Current (I2C Inactive) ICCSCONV 200 350 µA 3
Power-Fail Voltage VPF 2.45 2.575 2.7 V 3
Logic 0 Output (32KHZ, INT/SQW, SDA) VOL 0.4 V IOL = 3mA 3
Logic 0 Output (RST) VOL 0.4 V IOL = 1mA 3
Logic 1 Output (32KHZ) VOH 2 V Active supply > 3.3V, IOH = -1mA 3
Output Leakage (32KHZ, INT/SQW, SDA) ILO -0.1 0.1 µA 3
Input Leakage (SCL) ILI -0.1 0.1 µA 3
RST I/O Leakage IOL -200 10 µA 3
VBAT Leakage IBATLKG -100 25 100 nA TA = +25°C 3
Temperature Accuracy TEMPACC -3 3 °C VCC or VBAT = +3.3V 3
Temperature Conversion Time tCONV 10 ms 3
Active Battery Current (I2C Active) IBATA 25 75 µA Note 3 3
Timekeeping Battery Current (I2C Inactive) IBATT 1.8 3 µA EN32KHZ = 0, INTCN = 1 (Note 3) 3
Data Retention Current (Oscillator Stopped and I2C Inactive) IBATDR 100 nA TA = +25°C 3
Oscillator Stop Flag (OSF) Delay tOSF 25 100 ms Note 5 3
VCC Fall Time, VPFMAX to VPFMIN tVCCF 300 µs 4
VCC Rise Time, VPFMIN to VPFMAX tVCCR 0 µs 4
Recovery at Power-Up tREC 250 300 ms Note 6 4
SCL Clock Frequency fSCL 0 400 kHz 4
Bus Free Time Between STOP and START Conditions tBUF 1.3 µs 4
Hold Time (Repeated) START Condition tHD:STA 0.6 µs 4
Low Period of SCL tLOW 1.3 µs 4
High Period of SCL tHIGH 0.6 µs 4
Data Hold Time tHD:DAT 0 0.9 µs 4
Data Set-Up Time tSU:DAT 100 ns 4
START Set-Up Time tSU:STA 0.6 µs 4
SDA and SCL Rise Time tR 300 ns Note 8 4
SDA and SCL Fall Time tF 300 ns Note 8 4
STOP Set-Up Time tSU:STO 0.6 µs 4
SDA, SCL Input Capacitance CBIN 10 pF Note 9 4
Voltage Range on Any Pin Relative to GND -0.3 6 V 2
Operating Temperature Range TA -40 85 °C 2
Storage Temperature Range -55 125 °C 2
Junction Temperature 150 °C 2
Lead Temperature (soldering) 300 °C 10s 2
Soldering Temperature (reflow) 260 °C 2

CAD (KiCad official)

  • Symbol: DS3232MZ+TRL
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: ds3232mz-trl-etched.step / ds3232mz-trl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds3232mz-trl.step / ds3232mz-trl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices Inc Maxim Integrated datasheet (23 pp, sha256 50daf411ed74bd83, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF