DS25BR101TSDE from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	EQ	input	Equalizer select pin (LVCMOS input, VIH 2.0V min, VIL 0.8V max); selects low or medium equalization level.
2	IN+	input	Non-inverting LVDS input pin; DS25BR101 has no internal 100Ω termination and requires external 100Ω termination.
3	IN-	input	Inverting LVDS input pin; DS25BR101 has no internal 100Ω termination and requires external 100Ω termination.
4	PE	input	Pre-emphasis select pin (LVCMOS input, VIH 2.0V min, VIL 0.8V max); selects off or medium pre-emphasis.
5	NC	unconnected	No connect pin.
6	OUT-	output	Inverting LVDS output pin with VOD of 250 to 450 mV into a 100Ω load.
7	OUT+	output	Non-inverting LVDS output pin with VOD of 250 to 450 mV into a 100Ω load.
8	VCC	power_in	Power supply pin, 3.0V to 3.6V recommended operating range.
9	GND	power_in	Ground via the die attach pad (DAP, exposed pad), which must be soldered to the board for thermal and mechanical performance.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SON-8-EP(3x3)
Category	Communication Interface Chip/UART/485/232
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (VCC) recommended	VCC	3	3.3	3.6	V		3
Operating Free Air Temperature	TA	-40	25	85	°C		3
Supply Voltage (VCC) absolute maximum	VCC	-0.3		4	V		3
LVCMOS Input Voltage (EQ, PE)		-0.3			V	Max printed as VCC + 0.3V	3
LVDS Input Voltage (IN+, IN−)		-0.3		4	V		3
LVDS Output Voltage (OUT+, OUT−)		-0.3			V	Max printed as VCC + 0.3V	3
LVDS Differential Output Voltage (OUT+) − (OUT−)		0		1	V		3
LVDS Output Short Circuit Current Duration				5	ms		3
Junction Temperature				150	°C		3
Storage Temperature Range		-65		150	°C		3
Lead Temperature Range Soldering				260	°C	4 sec.	3
Maximum Package Power Dissipation				2.08	W	NGQ0008A Package at 25°C	3
ESD HBM		7			kV	Human Body Model, JESD22-A114C	3
ESD MM		250			V	Machine Model, JESD22-A115-A	3
ESD CDM		1250			V	Field Induced Charge Device Model, JESD22-C101-C	3
Package Thermal Resistance θJA	θJA		60		°C/W		3
Package Thermal Resistance θJC	θJC		12.3		°C/W		3
LVCMOS High Level Input Voltage	VIH	2			V	Max printed as VCC	4
LVCMOS Low Level Input Voltage	VIL			0.8	V	Min printed as GND	4
High Level Input Current	IIH	-10	0	10	μA	VIN = 3.6V; VCC = 3.6V	4
Low Level Input Current	IIL	-10	0	10	μA	VIN = GND; VCC = 3.6V	4
Input Clamp Voltage	VCL	-1.5		-0.9	V	ICL = −18 mA, VCC = 0V	4
Differential Output Voltage	VOD	250	350	450	mV		4
Change in Magnitude of VOD for Complementary Output States	ΔVOD	-35		35	mV	RL = 100Ω	4
Offset Voltage	VOS	1.05	1.2	1.375	V		4
Change in Magnitude of VOS for Complementary Output States	ΔVOS	-35		35	mV	RL = 100Ω	4
Output Short Circuit Current OUT to GND	IOS	-55		-35	mA	OUT to GND, PE = 0	4
Output Short Circuit Current OUT to VCC	IOS	7		55	mA	OUT to VCC, PE = 0	4
Input Differential Voltage	VID	0		1	V		4
Differential Input High Threshold	VTH	0		100	mV	VCM = +0.05V or VCC-0.05V	4
Differential Input Low Threshold	VTL	-100		0	mV		4
Common Mode Voltage Range	VCMR	0.05			V	VID = 100 mV; max printed as VCC - 0.05	4
LVDS Input Current	IIN	-10		10	μA	VIN = GND or 3.6V; VCC = 3.6V or 0.0V	4
Supply Current	ICC		35	43	mA	EQ = 0, PE = 0	4
Differential Propagation Delay High to Low	tPHLD	350		465	ps	RL = 100Ω	5
Differential Propagation Delay Low to High	tPLHD	350		465	ps	RL = 100Ω	5
Pulse Skew /tPLHD − tPHLD/	tSKD1	45		100	ps		5
Part to Part Skew	tSKD2	45		150	ps		5
Rise Time	tLHT	80		150	ps	RL = 100Ω	5
Fall Time	tHLT	80		150	ps	RL = 100Ω	5
Random Jitter RMS (PE off, EQ low)	tRJ1A	0.5		1	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 0, EQ = 0	5
Deterministic Jitter pk-pk (PE off, EQ low)	tDJ1A	1		16	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 0, EQ = 0	5
Deterministic Jitter pk-pk K28.5 (PE off, EQ low)	tDJ2A	11		31	ps	VID = 350 mV, VCM = 1.2V, 3.125 Gbps, PE = 0, EQ = 0	5
Total Jitter pk-pk (PE off, EQ low)	tTJ1A	0.03		0.09	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps PRBS-23, PE = 0, EQ = 0	5
Total Jitter pk-pk (PE off, EQ low) 3.125 Gbps	tTJ2A	0.06		0.14	UIP-P	VID = 350 mV, VCM = 1.2V, 3.125 Gbps PRBS-23, PE = 0, EQ = 0	5
Random Jitter RMS (PE off, EQ medium)	tRJ1B	0.5		1	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 0, EQ = 1	5
Deterministic Jitter pk-pk (PE off, EQ medium)	tDJ1B	10		29	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 0, EQ = 1	5
Deterministic Jitter pk-pk K28.5 (PE off, EQ medium)	tDJ2B	27		43	ps	VID = 350 mV, VCM = 1.2V, 3.125 Gbps, PE = 0, EQ = 1	5
Total Jitter pk-pk (PE off, EQ medium)	tTJ1B	0.07		0.12	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps PRBS-23, PE = 0, EQ = 1	5
Total Jitter pk-pk (PE off, EQ medium) 3.125 Gbps	tTJ2B	0.12		0.17	UIP-P	VID = 350 mV, VCM = 1.2V, 3.125 Gbps PRBS-23, PE = 0, EQ = 1	5
Random Jitter RMS (PE medium, EQ low)	tRJ1C	0.5		1	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 1, EQ = 0	6
Deterministic Jitter pk-pk (PE medium, EQ low)	tDJ1C	29		57	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 1, EQ = 0	6
Deterministic Jitter pk-pk K28.5 (PE medium, EQ low)	tDJ2C	29		51	ps	VID = 350 mV, VCM = 1.2V, 3.125 Gbps, PE = 1, EQ = 0	6
Total Jitter pk-pk (PE medium, EQ low)	tTJ1C	0.1		0.19	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps PRBS-23, PE = 1, EQ = 0	6
Total Jitter pk-pk (PE medium, EQ low) 3.125 Gbps	tTJ2C	0.13		0.22	UIP-P	VID = 350 mV, VCM = 1.2V, 3.125 Gbps PRBS-23, PE = 1, EQ = 0	6
Random Jitter RMS (PE medium, EQ medium)	tRJ1D	0.5		1.1	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 1, EQ = 1	6
Deterministic Jitter pk-pk (PE medium, EQ medium)	tDJ1D	41		77	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps, PE = 1, EQ = 1	6
Deterministic Jitter pk-pk K28.5 (PE medium, EQ medium)	tDJ2D	46		98	ps	VID = 350 mV, VCM = 1.2V, 3.125 Gbps, PE = 1, EQ = 1	6
Total Jitter pk-pk (PE medium, EQ medium)	tTJ1D	0.13		0.2	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps PRBS-23, PE = 1, EQ = 1	6
Total Jitter pk-pk (PE medium, EQ medium) 3.125 Gbps	tTJ2D	0.19		0.3	UIP-P	VID = 350 mV, VCM = 1.2V, 3.125 Gbps PRBS-23, PE = 1, EQ = 1	6

CAD (KiCad official)

Symbol: DS25BR101TSDE
Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
3D model files: ds25br101tsde-etched.step / ds25br101tsde-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds25br101tsde.step / ds25br101tsde.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (21 pp, sha256 4d577eebf1fdf04b, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

DS25BR101TSDE

Verified DS25BR101TSDE

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README