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DS15MB200TSQ
Public Made by Adomby adom
Texas Instruments LVDS ICs, WQFN-48-EP(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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DS15MB200TSQ
Texas Instruments · LVDS ICs · WQFN-48-EP(7x7)
DS15MB200TSQ from Texas Instruments, in a WQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N/C | unconnected | No connect pin, shown as N/C in the connection diagram. |
| 2 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 3 | GND | power_in | Ground reference for LVDS and CMOS circuitry. |
| 4 | ENL_1 | input | LVTTL output enable for the Channel 1 Line-side output driver. |
| 5 | PREL_1 | input | LVTTL pre-emphasis control for the Channel 1 Line-side output (0 = 0%, 1 = 100%). |
| 6 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 7 | LO_1+ | tri_state | Line-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop), with internal 100Ω source termination. |
| 8 | LO_1- | tri_state | Line-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop), with internal 100Ω source termination. |
| 9 | LI_1+ | input | Line-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 10 | LI_1- | input | Line-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 11 | MUX_S1 | input | LVTTL mux select for Channel 1 choosing Switch-side input A or B to pass to the Line-side. |
| 12 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 13 | ENA_1 | input | LVTTL output enable for the Channel 1 Switch A-side output driver. |
| 14 | ENB_1 | input | LVTTL output enable for the Channel 1 Switch B-side output driver. |
| 15 | SOA_1+ | tri_state | Switch A-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 16 | SOA_1- | tri_state | Switch A-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 17 | SOB_1+ | tri_state | Switch B-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 18 | SOB_1- | tri_state | Switch B-side Channel 1 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 19 | SIA_1+ | input | Switch A-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 20 | SIA_1- | input | Switch A-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 21 | SIB_1+ | input | Switch B-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 22 | SIB_1- | input | Switch B-side Channel 1 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 23 | PREA_1 | input | LVTTL pre-emphasis control for the Channel 1 Switch A-side output (0 = 0%, 1 = 100%). |
| 24 | PREB_1 | input | LVTTL pre-emphasis control for the Channel 1 Switch B-side output (0 = 0%, 1 = 100%). |
| 25 | PREB_0 | input | LVTTL pre-emphasis control for the Channel 0 Switch B-side output (0 = 0%, 1 = 100%). |
| 26 | PREA_0 | input | LVTTL pre-emphasis control for the Channel 0 Switch A-side output (0 = 0%, 1 = 100%). |
| 27 | SIB_0- | input | Switch B-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 28 | SIB_0+ | input | Switch B-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 29 | SIA_0- | input | Switch A-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 30 | SIA_0+ | input | Switch A-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 31 | SOB_0- | tri_state | Switch B-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 32 | SOB_0+ | tri_state | Switch B-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 33 | SOA_0- | tri_state | Switch A-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 34 | SOA_0+ | tri_state | Switch A-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop). |
| 35 | ENB_0 | input | LVTTL output enable for the Channel 0 Switch B-side output driver. |
| 36 | ENA_0 | input | LVTTL output enable for the Channel 0 Switch A-side output driver. |
| 37 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 38 | MUX_S0 | input | LVTTL mux select for Channel 0 choosing Switch-side input A or B to pass to the Line-side. |
| 39 | LI_0- | input | Line-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 40 | LI_0+ | input | Line-side Channel 0 differential input, LVDS, Bus LVDS, CML or LVPECL compatible. |
| 41 | LO_0- | tri_state | Line-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop), with internal 100Ω source termination. |
| 42 | LO_0+ | tri_state | Line-side Channel 0 LVDS-compatible differential output, point-to-point only (no multidrop), with internal 100Ω source termination. |
| 43 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 44 | PREL_0 | input | LVTTL pre-emphasis control for the Channel 0 Line-side output (0 = 0%, 1 = 100%). |
| 45 | ENL_0 | input | LVTTL output enable for the Channel 0 Line-side output driver. |
| 46 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 47 | GND | power_in | Ground reference for LVDS and CMOS circuitry. |
| 48 | VDD | power_in | Power supply, VDD = 3.3V ±0.3V. |
| 49 | DAP | power_in | Exposed die attach pad and primary ground connection, to be tied to the ground plane with at least 4 vias for AC and thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-48-EP(7x7) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 49 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD | -0.3 | 4 | V | 5 | ||
| CMOS Input Voltage | -0.3 | V | -0.3 to (VDD+0.3) | 5 | |||
| LVDS Output Short Circuit Current | 40 | mA | 5 | ||||
| Junction Temperature | 150 | °C | 5 | ||||
| Storage Temperature | -65 | 150 | °C | 5 | |||
| Lead Temperature | 260 | °C | Solder, 4sec | 5 | |||
| Max Pkg Power Capacity | 5.2 | W | @ 25°C | 5 | |||
| Thermal Resistance | θJA | 24 | °C/W | 5 | |||
| Supply Voltage | VCC | 3 | 3.6 | V | 5 | ||
| Input Voltage | VI | 0 | 3.6 | V | 0 to VCC; VID max < 2.4V | 5 | |
| Output Voltage | VO | 0 | 3.6 | V | 0 to VCC | 5 | |
| Operating Temperature | TA | -40 | 85 | °C | Industrial | 5 | |
| High Level Input Voltage | VIH | 2 | 3.3 | V | max printed as VDD | 6 | |
| Low Level Input Voltage | VIL | 0 | 0.8 | V | min printed as GND | 6 | |
| High Level Input Current | IIH | -10 | 10 | µA | VIN = VDD = VDDMAX | 6 | |
| High Level Input Current | IIHR | 40 | 200 | µA | PREA_n, PREB_n, PREL_n | 6 | |
| Low Level Input Current | IIL | -10 | 10 | µA | VIN = VSS, VDD = VDDMAX | 6 | |
| Input Clamp Voltage | VCL | -1.5 | -0.8 | V | ICL = -18 mA | 6 | |
| Differential Input High Threshold | VTH | 0 | 100 | mV | VCM = 0.8V or 1.2V or 3.55V, VDD = 3.6V | 6 | |
| Differential Input Low Threshold | VTL | -100 | 0 | mV | VCM = 0.8V or 1.2V or 3.55V, VDD = 3.6V | 6 | |
| Differential Input Voltage | VID | 100 | 2400 | mV | VCM = 0.8V to 3.55V, VDD = 3.6V | 6 | |
| Common Mode Voltage Range | VCMR | 0.05 | 3.55 | V | VID = 150 mV, VDD = 3.6V | 6 | |
| Input Current | IIN | -15 | 15 | µA | VIN = 3.6V, VDD = VDDMAX or 0V | 6 | |
| Differential Output Voltage | VOD | 250 | 360 | 500 | mV | RL is the internal 100Ω between OUT+ and OUT-, 0% Pre-emphasis | 6 |
| Change in VOD between Complementary States | ΔVOD | -35 | 35 | mV | 6 | ||
| Offset Voltage | VOS | 1.05 | 1.22 | 1.475 | V | 6 | |
| Change in VOS between Complementary States | ΔVOS | -35 | 35 | mV | 6 | ||
| Output Short Circuit Current | IOS | -21 | -40 | mA | OUT+ or OUT- Short to GND | 6 | |
| Supply Current | ICC | 225 | 275 | mA | All inputs and outputs enabled and active, terminated with external load of 100Ω between OUT+ and OUT- | 6 | |
| Supply Current - Powerdown Mode | ICCZ | 0.6 | 4 | mA | ENA_0 = ENB_0 = ENL_0 = ENA_1 = ENB_1 = ENL_1 = L | 6 | |
| Differential Low to High Transition Time | tLHT | 170 | 250 | ps | Alternating 1 and 0 pattern at 200 Mb/s, 20% to 80% of VOD | 6 | |
| Differential High to Low Transition Time | tHLT | 170 | 250 | ps | Alternating 1 and 0 pattern at 200 Mb/s, 20% to 80% of VOD | 6 | |
| Differential Low to High Propagation Delay | tPLHD | 1 | 2.5 | ns | Alternating 1 and 0 pattern at 200 Mb/s, 50% VOD input to output | 6 | |
| Differential High to Low Propagation Delay | tPHLD | 1 | 2.5 | ns | Alternating 1 and 0 pattern at 200 Mb/s, 50% VOD input to output | 6 | |
| Pulse Skew | tSKD1 | 25 | 75 | ps | /tPLHD-tPHLD/ | 6 | |
| Output Channel to Channel Skew | tSKCC | 50 | 115 | ps | Difference in propagation delay among all output channels | 6 | |
| Jitter RJ (0% Pre-emphasis) | tJIT | 1.1 | 1.5 | psrms | RJ - Alternating 1 and 0 at 750MHz | 7 | |
| Jitter DJ (0% Pre-emphasis) | tJIT | 20 | 34 | psp-p | DJ - K28.5 Pattern, 1.5 Gbps | 7 | |
| Jitter TJ (0% Pre-emphasis) | tJIT | 14 | 28 | psp-p | TJ - PRBS 2^7-1 Pattern, 1.5 Gbps | 7 | |
| LVDS Output Enable Time | tON | 0.5 | 1.5 | µs | ENA_n, ENB_n, or ENL_n to OUT± change from TRI-STATE to active | 7 | |
| LVDS Output Enable Time from Powerdown Mode | tON2 | 10 | 20 | µs | ENA_n, ENB_n, or ENL_n to OUT± change from Powerdown Mode to active | 7 | |
| LVDS Output Disable Time | tOFF | 12 | ns | ENA_n, ENB_n, or ENL_n to OUT± change from active to TRI-STATE or Powerdown mode | 7 | ||
| Input Capacitance (digital) | CIN1 | 2 | pF | Any Digital Input Pin to VSS | 6 | ||
| Output Capacitance (digital) | COUT1 | 4 | pF | Any Digital Output Pin to VSS | 6 | ||
| Input Capacitance (LVDS) | CIN2 | 2 | pF | IN+ or IN- to VSS | 6 | ||
| Output Capacitance (LVDS) | COUT2 | 4 | pF | OUT+ or OUT- to GND when TRI-STATE | 6 |
CAD (KiCad official)
- Symbol:
DS15MB200TSQ - Footprint:
Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm - 3D model: WQFN-48-EP(7x7) (KiCad packages3D, STEP)
- 3D model files:
ds15mb200tsq-etched.step/ds15mb200tsq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds15mb200tsq.step/ds15mb200tsq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (20 pp, sha256
5af4c72a7d27eccb, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).