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Contents

README

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DS15BR401TSQ

Texas Instruments · LVDS ICs · WQFN-32(5x5)

DS15BR401TSQ from Texas Instruments, in a WQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N/C unconnected No Connect
2 PEM input Pre-emphasis Control Input (affects all channels)
3 VDD power_in Power supply voltage 3.3V, ±10%
4 VDD power_in Power supply voltage 3.3V, ±10%
5 GND power_in Ground reference for LVDS and CMOS circuitry
6 VDD power_in Power supply voltage 3.3V, ±10%
7 VDD power_in Power supply voltage 3.3V, ±10%
8 PWDN input A logic low activates the hardware power down mode (all channels)
9 IN0+ input Channel 0 non-inverting differential LVDS input
10 IN0− input Channel 0 inverting differential LVDS input
11 IN1+ input Channel 1 non-inverting differential LVDS input
12 IN1− input Channel 1 inverting differential LVDS input
13 IN2+ input Channel 2 non-inverting differential LVDS input
14 IN2− input Channel 2 inverting differential LVDS input
15 IN3+ input Channel 3 non-inverting differential LVDS input
16 IN3− input Channel 3 inverting differential LVDS input
17 N/C unconnected No Connect
18 N/C unconnected No Connect
19 N/C unconnected No Connect
20 VDD power_in Power supply voltage 3.3V, ±10%
21 VDD power_in Power supply voltage 3.3V, ±10%
22 N/C unconnected No Connect
23 N/C unconnected No Connect
24 N/C unconnected No Connect
25 OUT3- tri_state Channel 3 inverting differential LVDS output
26 OUT3+ tri_state Channel 3 non-inverting differential LVDS output
27 OUT2− tri_state Channel 2 inverting differential LVDS output
28 OUT2+ tri_state Channel 2 non-inverting differential LVDS output
29 OUT1− tri_state Channel 1 inverting differential LVDS output
30 OUT1+ tri_state Channel 1 non-inverting differential LVDS output
31 OUT0− tri_state Channel 0 inverting differential LVDS output
32 OUT0+ tri_state Channel 0 non-inverting differential LVDS output
33 DAP power_in Exposed metal thermal pad for ground connection, connect to ground plane with minimum 4 vias for optimal AC and thermal performance

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-32(5x5)
Category Interface
Pins 33

CAD (KiCad official)

  • Symbol: DS15BR401TSQ
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: WQFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: ds15br401tsq-etched.step / ds15br401tsq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds15br401tsq.step / ds15br401tsq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (24 pp, sha256 d2f51d86ec9c5b5f, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF