component
DS1307MM
Public Made by Adomby adom
HGSEMI Real Time Clocks, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDS1307MM
HGSEMI · Real Time Clocks · MSOP-8
DS1307MM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | X1 | passive | 32.768 kHz crystal pin; the datasheet specifies a crystal load capacitance (CL) of 12.5 pF, and when the device is driven by an external 32.768 kHz oscillator, this pin is the oscillator input. |
| 2 | X2 | passive | 32.768 kHz crystal pin; it is left floating when the device is driven by an external 32.768 kHz oscillator on X1. |
| 3 | VBAT | power_in | +3V lithium battery or other battery input that must be held between 2.0 V and 3.5 V for proper operation, and it keeps the RTC and RAM powered when VCC falls below VBAT. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Serial data input/output of the I2C interface; it is an open-drain pin that requires an external pull-up resistor. |
| 6 | SCL | input | Serial clock input of the I2C interface; it is an open-drain pin that requires an external pull-up resistor. |
| 7 | SQW/OUT | output | Square-wave output driver (1 Hz, 4.096 kHz, 8.192 kHz or 32.768 kHz when SQWE=1) or a static output level controlled by the OUT bit when square-wave output is disabled; it is an open-drain pin that requires an external pull-up resistor. |
| 8 | VCC | power_in | Power supply input of +5 V; the datasheet specifies VCC from 4.5 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Clock/Timing |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (recommended) | VCC | 4.5 | 5 | 5.5 | V | 3 | |
| Logic 1 input voltage | VIH | 2.2 | V | Max printed as VCC+0.3 | 3 | ||
| Logic 0 input voltage | VIL | -0.5 | 0.8 | V | 3 | ||
| Battery voltage | VBAT | 2 | 3.5 | V | Column placement inferred from layout | 3 | |
| Input leakage current (SCL) | ILI | 1 | µA | 3 | |||
| I/O leakage current (SDA and SQW/OUT) | ILO | 1 | µA | 3 | |||
| Logic 0 output voltage | VOL | 0.4 | V | IOL=5mA | 3 | ||
| Operating supply current | ICCA | 1.5 | mA | note 7: SCL at maximum frequency, 100kHz | 3 | ||
| Standby current | ICCS | 200 | µA | note 1: VCC, SDA and SCL = 5.0V | 3 | ||
| Battery current (OSC ON, SQW/OUT OFF) | IBAT1 | 300 | 500 | nA | SQW/OUT OFF; note 2: VCC=0V, VBAT=3V | 3 | |
| Battery current (OSC ON, SQW/OUT ON 32kHz) | IBAT2 | 480 | 800 | nA | SQW/OUT ON (32kHz) | 3 | |
| Power-fail voltage | VPF | 1.216 | 1.25 | 1.284 | V | Printed as 1.216×VBAT / 1.25×VBAT / 1.284×VBAT; note 8: VBAT=3.0V | 3 |
| SCL clock frequency | fSCL | 0 | 100 | kHz | 4 | ||
| Bus free time between STOP and START | tBUF | 4.7 | µs | 4 | |||
| START condition hold time | tHDSTA | 4 | µs | note 3 | 4 | ||
| SCL low period | tLOW | 4.7 | µs | 4 | |||
| SCL high period | tHIGH | 4 | µs | 4 | |||
| START condition setup time | tSUSTA | 4.7 | µs | 4 | |||
| Data hold time | tHDDAT | 0 | µs | notes 4, 5 | 4 | ||
| Data setup time | tSUDAT | 250 | ns | 4 | |||
| SDA and SCL rise time | tR | 1000 | ns | 4 | |||
| SDA and SCL fall time | tF | 300 | ns | 4 | |||
| STOP condition setup time | tSUSTO | 4.7 | µs | 4 | |||
| Capacitive load per bus | CB | 400 | pF | note 6: sum of bus capacitances | 4 | ||
| I/O capacitance | CI/O | 10 | pF | TA=25℃ | 4 | ||
| Specified crystal load capacitance | 12.5 | pF | TA=25℃ | 4 | |||
| Storage temperature | -55 | 125 | ℃ | 3 | |||
| Voltage on any pin to GND | -0.5 | 7 | V | 3 | |||
| Operating temperature (DS1307, non-Z grade) | 0 | 70 | ℃ | DS1307 commercial grade; DS1307Z (-40 to +85) excluded | 3 | ||
| Soldering temperature | 260 | ℃ | 10 s | 3 |
CAD (KiCad official)
- Symbol:
DS1307MM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
ds1307mm-etched.step/ds1307mm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds1307mm.step/ds1307mm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
99d95856b4d3f840, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).