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DS1302ZN

HGSEMI · Real Time Clocks · DIP-8

DS1302ZN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC2 power_in Main power supply input; the device runs from the higher of VCC1 or VCC2, and the recommended supply range is 2.0 V to 5.5 V.
2 X1 passive Connection to the 32.768 kHz crystal, which should have a specified load capacitance of 6 pF.
3 X2 passive Connection to the 32.768 kHz crystal, which should have a specified load capacitance of 6 pF.
4 GND power_in Ground reference for the device.
5 RST input Reset/chip-enable input: driving it high starts data transfer and driving it low aborts transfer and forces I/O to high impedance, and it must be low before VCC reaches 2.5 V at power-up.
6 I/O bidirectional Serial data input/output pin that goes high impedance when RST is low; at VCC=5 V the logic levels are TTL compatible.
7 SCLK input Serial clock input: data is sampled on rising edges and output on falling edges, and SCLK must be low when RST is driven high.
8 VCC1 power_in Backup power supply input that keeps the clock and RAM powered when VCC2 is absent, within the 2.0 V to 5.5 V recommended range.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Clock/Timing
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
引脚对地电压 (Voltage on any pin to ground) VP -0.5 7 V 3
工作温度 (Operating temperature, DS1302Z grade) TA -40 85 ℃ DS1302Z row (applies to DS1302ZN) 3
贮存温度 (Storage temperature) TS -55 125 ℃ 3
焊接温度 (Soldering temperature) TH 260 ℃ 10 s 3
供给电源电压 (Supply voltage) VCC1, VCC2 2 5.5 V TA=0℃~70℃ 3
逻辑1输入电压 (Logic 1 input voltage) VIH 2 V 3
逻辑0输入电压 (Logic 0 input voltage) VIL -0.3 0.3 V VCC=2.0V 3
逻辑0输入电压 (Logic 0 input voltage) VIL -0.3 0.8 V VCC=5V 3
输入电容 (Input capacitance) CI 10 pF TA=25℃ 3
I/O 电容 (I/O capacitance) CI/O 15 pF TA=25℃ 3
晶体振荡器电容 (Crystal oscillator capacitance) CX 6 pF TA=25℃ 3
输入电流 (Input current) ILI 500 μA 0℃至70℃; VCC=2.5V至5.5V 4
I/O 漏电流 (I/O leakage current) ILO 500 μA 0℃至70℃; VCC=2.5V至5.5V 4
逻辑1输出电压 (Logic 1 output voltage) VOH 1.6 V VCC=2.5V 4
逻辑1输出电压 (Logic 1 output voltage) VOH 2.4 V VCC=5V 4
逻辑0输出电压 (Logic 0 output voltage) VOL 0.4 V VCC=2.5V 4
供电电流 (Active supply current, VCC1) ICC1A 0.4 mA VCC1=2.5V 4
供电电流 (Active supply current, VCC1) ICC1A 1.2 mA VCC1=5V 4
时间保持电流 (Timekeeping current, VCC1) ICC1T 0.3 μA VCC1=2.5V 4
时间保持电流 (Timekeeping current, VCC1) ICC1T 1 μA VCC1=5V 4
静态电流 (Standby current, VCC1) ICC1S 100 nA VCC1=2.5V 4
供电电流 (Active supply current, VCC2) ICC2A 0.425 mA VCC2=2.5V 4
供电电流 (Active supply current, VCC2) ICC2A 1.28 mA VCC2=5V 4
时间保持电流 (Timekeeping current, VCC2) ICC2T 25.3 μA VCC2=2.5V 4
时间保持电流 (Timekeeping current, VCC2) ICC2T 81 μA VCC2=5V 4
静态电流 (Standby current, VCC2) ICC2S 25 μA VCC2=2.5V 4
静态电流 (Standby current, VCC2) ICC2S 80 μA VCC2=5V 4
CLK 到RST 保持 (CLK to RST hold) tcch 240 ns VCC=2V 4
CLK 到RST 保持 (CLK to RST hold) tcch 60 ns VCC=5V 4
RST 无效 (RST inactive time) tcwh 4 ns VCC=2V 4
RST 无效 (RST inactive time) tcwh 1 ns VCC=5V 4
RST 到I/O 高阻 (RST to I/O high-Z) tcdz 280 ns VCC=2V 4
RST 到I/O 高阻 (RST to I/O high-Z) tcdz 70 ns VCC=5V 4
SCLK 到I/O 高阻 (SCLK to I/O high-Z) tccz 280 ns VCC=2V 4
SCLK 到I/O 高阻 (SCLK to I/O high-Z) tccz 70 ns VCC=5V 4
Data 到CLK 建立 (Data to CLK setup) tdc 200 ns VCC=2V 4
Data 到CLK 建立 (Data to CLK setup) tdc 50 ns VCC=5V 4
CLK 到Data 保持 (CLK to Data hold) tcdh 280 ns VCC=2V 4
CLK 到Data 保持 (CLK to Data hold) tcdh 70 ns VCC=5V 4
CLK 到Data 延时 (CLK to Data delay) tcdd 800 ns VCC=2V 4
CLK 到Data 延时 (CLK to Data delay) tcdd 200 ns VCC=5V 4
CLK 低 (CLK low time) tcl 1000 ns VCC=2V 4
CLK 低 (CLK low time) tcl 250 ns VCC=5V 4
CLK 高 (CLK high time) tch 1000 ns VCC=2V 4
CLK 高 (CLK high time) tch 250 ns VCC=5V 4
CLK 频率 (CLK frequency) tclk 0.5 MHz VCC=2V 5
CLK 频率 (CLK frequency) tclk 2 MHz VCC=5V 5
CLK 上升和下降时间 (CLK rise and fall time) tr, tf 2000 ns VCC=2V 5
CLK 上升和下降时间 (CLK rise and fall time) tr, tf 500 ns VCC=5V 5
RST 到CLK 建立 (RST to CLK setup) tCC 4 µs VCC=2V 5
RST 到CLK 建立 (RST to CLK setup) tCC 1 µs VCC=5V 5
涓流充电电阻 R1 (Trickle-charge resistor R1) R1 2 kΩ 4
涓流充电电阻 R2 (Trickle-charge resistor R2) R2 4 kΩ 4
涓流充电电阻 R3 (Trickle-charge resistor R3) R3 8 kΩ 4
涓流充电二极管压降 (Trickle-charge diode forward drop) VTD 0.7 V 4

CAD (KiCad official)

  • Symbol: DS1302ZN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: ds1302zn-etched.step / ds1302zn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds1302zn.step / ds1302zn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (15 pp, sha256 610b1880d250ea8d, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF