# DS1302N

**XBLW** · Real Time Clocks · DIP-8

DS1302N from XBLW, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC2 | power_in | Primary power-supply pin in dual-supply configuration; powers the DS1302 when VCC2 > VCC1 + 0.2V; otherwise VCC1 powers the device; operates from 2.0V to 5.5V. |
| 2 | X1 | passive | Crystal input connection for standard 32.768kHz quartz crystal with 6pF specified load capacitance; receives external oscillator signal when an external 32.768kHz oscillator is used (X2 floated in that configuration). |
| 3 | X2 | passive | Crystal output connection for standard 32.768kHz quartz crystal with 6pF specified load capacitance; floated when an external oscillator drives X1. |
| 4 | GND | power_in | Ground reference; all pin voltages referenced to ground. |
| 5 | CE | input | Chip enable input; must be asserted high during a read or write; has an internal 40kΩ (typ) pulldown resistor to ground; formerly named RST with no functional change. |
| 6 | I/O | bidirectional | Bidirectional serial data pin for the 3-wire interface; transfers data to and from the DS1302 in single-byte or burst mode; has an internal 40kΩ (typ) pulldown resistor to ground. |
| 7 | SCLK | input | Serial clock input used to synchronize data movement on the 3-wire serial interface; has an internal 40kΩ (typ) pulldown resistor to ground. |
| 8 | VCC1 | power_in | Low-power backup supply pin; rechargeable energy source connected here when trickle charger is used; UL recognized to prevent reverse charging current when used with a lithium battery; powers DS1302 when VCC1 > VCC2; operates from 2.0V to 5.5V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XBLW |
| Package | DIP-8 |
| Category | Clock/Timing |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `DS1302N`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `ds1302n-etched.step` / `ds1302n-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds1302n.step` / `ds1302n.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XBLW datasheet](docs/ds1302n-datasheet.pdf) (16 pp, sha256 `4dffa2998571d25e`, retrieved 2026-09-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-sonnet-4-6` (vision), consensus `claude-opus-4-7` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ds1302n-datasheet.pdf)