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Contents

README

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DS1302M

HGSEMI · Real Time Clocks · SOP-8

DS1302M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC2 power_in Main supply pin, specified at 2.0 V to 5.5 V; the DS1302 is powered from whichever of VCC1 or VCC2 is higher, and from VCC2 when VCC2 exceeds VCC1 + 0.2 V.
2 X1 passive Connection to the 32.768 kHz crystal, which must have a specified load capacitance of 6 pF (CL).
3 X2 passive Connection to the 32.768 kHz crystal, which must have a specified load capacitance of 6 pF (CL).
4 GND power_in Ground reference pin for the device.
5 RST input Reset input: driving it high enables data transfers, driving it low aborts all transfers and places I/O in high impedance, and it must be low before VCC reaches 2.5 V at power-up.
6 I/O bidirectional Serial data input/output, with data sampled on SCLK rising edges for writes and output on SCLK falling edges for reads, and high impedance when RST is low.
7 SCLK input Serial clock input that synchronizes command and data transfers on I/O, and must be low when RST is driven high.
8 VCC1 power_in Backup supply pin, specified at 2.0 V to 5.5 V, which powers the device when VCC2 + 0.2 V is less than VCC1 and provides battery backup of the clock and RAM.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Clock/Timing
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage on any pin to ground VP -0.5 7 V 3
Operating temperature (DS1302, not DS1302Z) TA 0 70 ℃ DS1302 (not DS1302Z) 3
Storage temperature TS -55 125 ℃ 3
Soldering temperature TH 260 ℃ 10 s 3
Supply voltage VCC1, VCC2 2 5.5 V 3
Logic 1 input voltage VIH 2 V 3
Logic 0 input voltage VIL -0.3 0.3 V VCC=2.0V 3
Logic 0 input voltage VIL -0.3 0.8 V VCC=5V 3
Input capacitance CI 10 pF 3
I/O capacitance CI/O 15 pF 3
Input leakage current ILI 500 μA 4
I/O leakage current ILO 500 μA 4
Logic 1 output voltage VOH 1.6 V VCC=2.5V 4
Logic 1 output voltage VOH 2.4 V VCC=5V 4
Logic 0 output voltage VOL 0.4 V VCC=2.5V 4
Active supply current (VCC1) ICC1A 0.4 mA VCC1=2.5V 4
Active supply current (VCC1) ICC1A 1.2 mA VCC1=5V 4
Timekeeping current (VCC1) ICC1T 0.3 μA VCC1=2.5V 4
Timekeeping current (VCC1) ICC1T 1 μA VCC1=5V 4
Standby current (VCC1) ICC1S 100 nA VCC1=2.5V 4
Active supply current (VCC2) ICC2A 0.425 mA VCC2=2.5V 4
Active supply current (VCC2) ICC2A 1.28 mA VCC2=5V 4
Timekeeping current (VCC2) ICC2T 25.3 μA VCC2=2.5V 4
Timekeeping current (VCC2) ICC2T 81 μA VCC2=5V 4
Standby current (VCC2) ICC2S 25 μA VCC2=2.5V 4
Standby current (VCC2) ICC2S 80 μA VCC2=5V 4
CLK to RST hold time tcch 240 ns VCC=2V 4
CLK to RST hold time tcch 60 ns VCC=5V 4
RST inactive time tcwh 4 ns VCC=2V 4
RST inactive time tcwh 1 ns VCC=5V 4
RST to I/O high-Z tcdz 280 ns VCC=2V 4
RST to I/O high-Z tcdz 70 ns VCC=5V 4
SCLK to I/O high-Z tccz 280 ns VCC=2V 4
SCLK to I/O high-Z tccz 70 ns VCC=5V 4
Data to CLK setup time tdc 200 ns VCC=2V 4
Data to CLK setup time tdc 50 ns VCC=5V 4
CLK to Data hold time tcdh 280 ns VCC=2V 4
CLK to Data hold time tcdh 70 ns VCC=5V 4
CLK to Data delay tcdd 800 ns VCC=2V 4
CLK to Data delay tcdd 200 ns VCC=5V 4
CLK low time tcl 1000 ns VCC=2V 4
CLK low time tcl 250 ns VCC=5V 4
CLK high time tch 1000 ns VCC=2V 4
CLK high time tch 250 ns VCC=5V 4
CLK frequency tclk 0.5 MHz VCC=2V 5
CLK frequency tclk 2 MHz VCC=5V 5
CLK rise and fall time tr, tf 2000 ns VCC=2V 5
CLK rise and fall time tr, tf 500 ns VCC=5V 5
RST to CLK setup time tCC 4 µs VCC=2V 5
RST to CLK setup time tCC 1 µs VCC=5V 5
Crystal load capacitance (CL) required by 32.768 kHz crystal CX 6 pF 3
Trickle-charge resistor R1 R1 2 kΩ 4
Trickle-charge resistor R2 R2 4 kΩ 4
Trickle-charge resistor R3 R3 8 kΩ 4
Trickle-charge diode forward voltage drop VTD 0.7 V 4

CAD (KiCad official)

  • Symbol: DS1302M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ds1302m-etched.step / ds1302m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds1302m.step / ds1302m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (15 pp, sha256 610b1880d250ea8d, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF