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Contents

README

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DRV8881PPWPR

Texas Instruments · Stepper Motor Driver · HTSSOP-28-EP

DRV8881PPWPR from Texas Instruments, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CPL passive Charge pump negative switching pin; connect a VM-rated, 0.1-µF ceramic capacitor between CPH and CPL, with an absolute maximum range of -0.3 V to VM.
2 CPH power_out Charge pump output; connect a VM-rated, 0.1-µF X7R capacitor between CPH and CPL, with an absolute maximum of VM + 12 V.
3 VCP power_out Charge pump output; connect a 16-V, 0.47-µF ceramic capacitor to VM.
4 VM power_in Motor supply input, operating range 6.5 V to 45 V with an absolute maximum of 50 V; bypass to GND with two 0.1-µF capacitors (one per VM pin) plus a bulk capacitor rated for VM.
5 AOUT1 output H-bridge A winding output that drives one winding of the stepper motor; continuous phase node voltage limited to -0.7 V to VM + 0.7 V.
6 AISEN output Winding A sense pin; requires a sense resistor to GND whose value sets the peak current, with continuous input limited to ±0.55 V.
7 AOUT2 output H-bridge A winding output that drives one winding of the stepper motor; continuous phase node voltage limited to -0.7 V to VM + 0.7 V.
8 BOUT2 output H-bridge B winding output that drives one winding of the stepper motor; continuous phase node voltage limited to -0.7 V to VM + 0.7 V.
9 BISEN output Winding B sense pin; requires a sense resistor to GND whose value sets the peak current, with continuous input limited to ±0.55 V.
10 BOUT1 output H-bridge B winding output that drives one winding of the stepper motor; continuous phase node voltage limited to -0.7 V to VM + 0.7 V.
11 VM power_in Motor supply input, operating range 6.5 V to 45 V with an absolute maximum of 50 V; bypass to GND with two 0.1-µF capacitors (one per VM pin) plus a bulk capacitor rated for VM.
12 GND power_in Device ground; must be connected to ground.
13 AVREF input Reference voltage input that sets the full-scale chopping current of H-bridge A; absolute range -0.3 V to V3P3 + 0.5 V.
14 BVREF input Reference voltage input that sets the full-scale chopping current of H-bridge B; absolute range -0.3 V to V3P3 + 0.5 V.
15 V3P3 power_out Internal 3.3-V regulator output; bypass to GND with a 6.3-V, 0.47-µF ceramic capacitor and supports up to 10 mA of external load.
16 TOFF input Tri-level input that sets the decay mode off time during current chopping.
17 nSLEEP input Logic high enables the device and logic low enters low-power sleep mode; internal pulldown.
18 nFAULT output Open-drain fault indication output that is pulled logic low on a fault condition; requires an external pullup, with open-drain output current limited to 10 mA.
19 BDECAY input Tri-level input that sets the decay mode for bridge B.
20 ADECAY input Tri-level input that sets the decay mode for bridge A.
21 BIN2 input Bridge B PWM input; the logic level controls the state of H-bridge B, with an internal pulldown.
22 BIN1 input Bridge B PWM input; the logic level controls the state of H-bridge B, with an internal pulldown.
23 AIN2 input Bridge A PWM input; the logic level controls the state of H-bridge A, with an internal pulldown.
24 AIN1 input Bridge A PWM input; the logic level controls the state of H-bridge A, with an internal pulldown.
25 PARA input Parallel mode input; logic high enables parallel mode.
26 TRQ1 input Torque DAC current scalar input (with TRQ0) that scales the current to 100%, 75%, 50% or 25%; internal pulldown.
27 TRQ0 input Torque DAC current scalar input (with TRQ1) that scales the current to 100%, 75%, 50% or 25%; internal pulldown.
28 GND power_in Device ground; must be connected to ground.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-28-EP
Category Motor Driver ICs
Pins 29

CAD (KiCad official)

  • Symbol: DRV8881PPWPR
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
  • 3D model files: drv8881ppwpr-etched.step / drv8881ppwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8881ppwpr.step / drv8881ppwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (49 pp, sha256 656d41b4b52789b1, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF