# DRV8833PWPR

**Texas Instruments** · Stepper Motor Driver · TSSOP-16-EP

DRV8833PWPR from Texas Instruments, in a TSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | nSLEEP | input | Sleep-mode logic input: logic high enables the device, logic low puts it into low-power sleep mode and resets all internal logic (internal pulldown). |
| 2 | AOUT1 | output | Bridge A output 1, connected to motor winding A. |
| 3 | AISEN | bidirectional | Bridge A ground/current-sense pin; connect to a current-sense resistor for bridge A, or to GND if current control is not needed. |
| 4 | AOUT2 | output | Bridge A output 2, connected to motor winding A. |
| 5 | BOUT2 | output | Bridge B output 2, connected to motor winding B. |
| 6 | BISEN | bidirectional | Bridge B ground/current-sense pin; connect to a current-sense resistor for bridge B, or to GND if current control is not needed. |
| 7 | BOUT1 | output | Bridge B output 1, connected to motor winding B. |
| 8 | nFAULT | output | Open-drain fault output driven logic low during a fault condition (overtemperature or overcurrent). |
| 9 | BIN1 | input | Bridge B logic input 1 that controls the state of BOUT1 (internal pulldown). |
| 10 | BIN2 | input | Bridge B logic input 2 that controls the state of BOUT2 (internal pulldown). |
| 11 | VCP | bidirectional | High-side gate-drive charge-pump pin; connect a 0.01-µF, 16-V (minimum) X7R ceramic capacitor to VM. |
| 12 | VM | power_in | Device power-supply pin (2.7 V to 10.8 V); connect to the motor supply, with a 10-µF (minimum) ceramic bypass capacitor to GND recommended. |
| 13 | GND | power_in | Device ground pin; both the GND pin and the device PowerPAD must be connected to ground. |
| 14 | VINT | power_out | Internal supply bypass node; bypass to GND with a 2.2-µF, 6.3-V capacitor. |
| 15 | AIN2 | input | Bridge A logic input 2 that controls the state of AOUT2 (internal pulldown). |
| 16 | AIN1 | input | Bridge A logic input 1 that controls the state of AOUT1 (internal pulldown). |
| 17 | PPAD | power_in | Exposed PowerPAD thermal/ground pad; must be soldered and electrically connected to GND for proper grounding and heat dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSSOP-16-EP |
| Category | Motor Driver ICs |
| Pins | 17 |

## CAD (KiCad official)

- Symbol: `DRV8833PWPR`
- Footprint: `Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm`
- 3D model: TSSOP-16-EP (KiCad packages3D, STEP)
- 3D model files: `drv8833pwpr-etched.step` / `drv8833pwpr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv8833pwpr.step` / `drv8833pwpr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/drv8833) (30 pp, sha256 `93657bed2ecc27eb`, retrieved 2026-09-23, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/drv8833pwpr-datasheet.pdf)