Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

DRV8824RHDR

Texas Instruments · Motor Driver ICs · VQFN-28-EP(5x5)

DRV8824RHDR from Texas Instruments, in a VQFN-28-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 MODE2 input Microstep mode 2 input; MODE0 through MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with internal pulldown.
2 nHOME output Open-drain home position output that is logic low when at the home state of the step table.
3 GND power_in Device ground.
4 CP1 passive Charge pump flying capacitor pin; connect a 0.01-µF 50-V capacitor between CP1 and CP2.
5 CP2 passive Charge pump flying capacitor pin; connect a 0.01-µF 50-V capacitor between CP1 and CP2.
6 VCP passive High-side gate drive voltage; connect a 0.1-µF 16-V ceramic capacitor, and optionally a 1-MΩ resistor to VM to accelerate discharge of the VCP capacitor.
7 VMA power_in Bridge A power supply; connect to motor supply (8.2 to 45 V), same supply as VMB, bypassed with a 0.1-µF capacitor to GND plus bulk capacitance.
8 AOUT1 output Bridge A output 1; connect to bipolar stepper motor winding A.
9 ISENA passive Bridge A ground / Isense; connect to current sense resistor for bridge A.
10 AOUT2 output Bridge A output 2; positive current is AOUT1 to AOUT2.
11 BOUT2 output Bridge B output 2; positive current is BOUT1 to BOUT2.
12 ISENB passive Bridge B ground / Isense; connect to current sense resistor for bridge B.
13 BOUT1 output Bridge B output 1; connect to bipolar stepper motor winding B.
14 VMB power_in Bridge B power supply; connect to motor supply (8.2 to 45 V), same supply as VMA, bypassed with a 0.1-µF capacitor to GND plus bulk capacitance.
15 AVREF input Bridge A current set reference input; normally tied to the same voltage as BVREF and can be connected to V3P3OUT.
16 BVREF input Bridge B current set reference input; normally tied to the same voltage as AVREF and can be connected to V3P3OUT.
17 GND power_in Device ground.
18 V3P3OUT power_out 3.3-V regulator output; bypass to GND with a 0.47-µF 6.3-V ceramic capacitor, can supply VREF, max load 1 mA.
19 nRESET input Active-low reset input that initializes the indexer logic and disables the H-bridge outputs, with internal pulldown.
20 nSLEEP input Sleep mode input; logic high enables the device, logic low enters low-power sleep mode, with internal pulldown.
21 nFAULT output Open-drain fault output that is logic low in a fault condition (overtemperature, overcurrent).
22 DECAY input Decay mode input: low = slow decay, open = mixed decay, high = fast decay, with internal pulldown and pullup.
23 DIR input Direction input whose level sets the direction of stepping, with internal pulldown.
24 nENBL input Enable input; logic high disables outputs and indexer operation, logic low enables, with internal pulldown.
25 STEP input Step input where a rising edge moves the indexer one step, with internal pulldown.
26 NC unconnected No connect; leave this pin unconnected.
27 MODE0 input Microstep mode 0 input; MODE0 through MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with internal pulldown.
28 MODE1 input Microstep mode 1 input; MODE0 through MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with internal pulldown.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-28-EP(5x5)
Category Power Supply Chip
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage V(VMx) -0.3 47 V over operating free-air temperature 5
Power supply ramp rate V(VMx) 1 V/µs 5
Digital pin voltage -0.5 7 V 5
xVREF input voltage V(xVREF) -0.3 4 V 5
ISENSEx pin voltage -0.8 0.8 V Transients of ±1 V for less than 25 ns are acceptable 5
Continuous motor drive output current 1.6 A Power dissipation and thermal limits must be observed 5
Operating virtual junction temperature TJ -40 150 °C 5
Storage temperature Tstg -60 150 °C 5
ESD HBM V(ESD) -2000 2000 V Human body model, all pins 5
ESD CDM V(ESD) -500 500 V Charged device model, all pins 5
Motor power supply voltage range V(VMx) 8.2 45 V All VM pins connected to same supply 5
VREF input voltage V(xVREF) 1 3.5 V Operational at VREF between 0 and 1 V, but accuracy is degraded 5
V3P3OUT load current IV3P3 1 mA 5
Junction-to-ambient thermal resistance RθJA 35.8 °C/W RHD (VQFN) 28 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 25.1 °C/W RHD (VQFN) 28 pins 5
Junction-to-board thermal resistance RθJB 8.2 °C/W RHD (VQFN) 28 pins 5
Junction-to-top characterization parameter ψJT 0.3 °C/W RHD (VQFN) 28 pins 5
Junction-to-board characterization parameter ψJB 8.2 °C/W RHD (VQFN) 28 pins 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 1.1 °C/W RHD (VQFN) 28 pins 5
VMx operating supply current IVMx 5 8 mA V(VMx) = 24 V, ƒPWM < 50 kHz 6
VMx sleep mode supply current IVMxQ 10 20 μA V(VMx) = 24 V 6
V3P3OUT voltage V3P3 3.18 3.3 3.42 V IOUT = 0 to 1 mA, V(VMx) = 24 V, TJ = 25°C 6
V3P3OUT voltage V3P3 3.1 3.3 3.5 V IOUT = 0 to 1 mA 6
Input low voltage VIL 0 0.7 V Logic-level inputs 6
Input high voltage VIH 2 5.25 V Logic-level inputs 6
Input hysteresis VHYS 0.45 V 6
Input low current IIL -20 20 μA V(VIN) = 0 6
Input high current IIH 100 μA V(VIN) = 3.3 V 6
Internal pulldown resistance RPD 100 kΩ nENBL, nRESET, DIR, STEP, MODEx 6
Internal pulldown resistance RPD 1 MΩ nSLEEP 6
Output low voltage VOL 0.5 V IO = 5 mA, nHOME/nFAULT 6
Output high leakage current IOH 1 μA VO = 3.3 V 6
Input low threshold voltage (DECAY) VIL 0.8 V For slow decay mode 6
Input high threshold voltage (DECAY) VIH 2 V For fast decay mode 6
DECAY input current IIN -100 100 µA 6
DECAY internal pullup resistance RPU 130 kΩ 6
DECAY internal pulldown resistance RPD 80 kΩ 6
HS FET on resistance RDS(ON) 0.63 Ω V(VMx) = 24 V, IO = 1 A, TJ = 25°C 6
HS FET on resistance RDS(ON) 0.76 0.9 Ω V(VMx) = 24 V, IO = 1 A, TJ = 85°C 6
LS FET on resistance RDS(ON) 0.65 Ω V(VMx) = 24 V, IO = 1 A, TJ = 25°C 6
LS FET on resistance RDS(ON) 0.78 0.9 Ω V(VMx) = 24 V, IO = 1 A, TJ = 85°C 6
Off-state leakage current IOFF -20 20 μA 6
Internal PWM frequency ƒPWM 50 kHz 6
Current sense blanking time tBLANK 3.75 μs 6
Rise time tR 100 360 ns V(VMx) = 24 V 6
Fall time tF 80 250 ns V(VMx) = 24 V 6
Dead time tDEAD 400 ns 6
VMx undervoltage lockout voltage VUVLO 8.2 V V(VMx) rising 6
Overcurrent protection trip level IOCP 1.8 5 A 6
Overcurrent deglitch time tDEG 3 µs 6
Thermal shutdown temperature TTSD 150 160 180 °C Die temperature 6
xVREF input current IREF -3 3 μA V(xVREF) = 3.3 V 6
xISENSE trip voltage VTRIP 635 660 685 mV V(xVREF) = 3.3 V, 100% current setting 7
Current trip accuracy ΔITRIP -25 25 % V(xVREF) = 3.3 V, 5% current setting 7
Current trip accuracy ΔITRIP -15 15 % V(xVREF) = 3.3 V, 10% to 34% current setting 7
Current trip accuracy ΔITRIP -10 10 % V(xVREF) = 3.3 V, 38% to 67% current setting 7
Current trip accuracy ΔITRIP -5 5 % V(xVREF) = 3.3 V, 71% to 100% current setting 7
Current sense amplifier gain AISENSE 5 V/V Reference only 7
Step frequency ƒSTEP 175 kHz 7
Pulse duration, STEP high tWH(STEP) 2.8 μs 7
Pulse duration, STEP low tWL(STEP) 2.8 μs 7
Setup time, command before STEP rising tSU(STEP) 200 ns 7
Hold time, command after STEP rising tH(STEP) 200 ns 7
Enable time, nENBL active to STEP tENBL 200 ns 7
Wakeup time, nSLEEP inactive high to STEP input accepted tWAKE 1 ms 7

CAD (KiCad official)

  • Symbol: DRV8824RHDR
  • Footprint: Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
  • 3D model: VQFN-28-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: drv8824rhdr-etched.step / drv8824rhdr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8824rhdr.step / drv8824rhdr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 1892628a6c17ad0f, retrieved 2026-10-31, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF