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DRV8714HQRHARQ1

Texas Instruments · Gate Drive ICs · VQFN-40(6x6)

DRV8714HQRHARQ1 from Texas Instruments, in a VQFN-40(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IDRIVE input Gate driver output current setting, a 6-level input pin set by an external resistor.
2 MODE input Analog PWM input mode setting, a 4-level input pin set by an external resistor.
3 IN1/EN1 input Half-bridge and H-bridge control input with internal pulldown resistor.
4 IN2/PH1 input Half-bridge and H-bridge control input with internal pulldown resistor.
5 IN3/EN2 input Half-bridge and H-bridge control input with internal pulldown resistor.
6 IN4/PH2 input Half-bridge and H-bridge control input with internal pulldown resistor.
7 nSLEEP input Device enable pin; logic low shuts down the device and enters sleep mode, with internal pulldown resistor.
8 nFLT output Fault indicator output pulled logic low on a fault; open-drain output that needs an external pullup resistor.
9 SO1 output Shunt amplifier 1 output.
10 SO2 output Shunt amplifier 2 output.
11 BRAKE input Power-off brake pin; logic high in low-power sleep mode enables the low-side gate drivers, with internal pulldown resistor.
12 SP1 input Amplifier 1 positive input, connected to the positive terminal of the shunt resistor.
13 SN1 input Amplifier 1 negative input, connected to the negative terminal of the shunt resistor.
14 SP2 input Amplifier 2 positive input, connected to the positive terminal of the shunt resistor.
15 SN2 input Amplifier 2 negative input, connected to the negative terminal of the shunt resistor.
16 GH1 output High-side gate driver output, connected to the gate of the high-side MOSFET.
17 SH1 input High-side source sense input, connected to the high-side MOSFET source.
18 GL1 output Low-side gate driver output, connected to the gate of the low-side MOSFET.
19 PGND1 power_in Low-side MOSFET gate drive 1-2 sense and power return, connected to system ground close to the device and half-bridges 1-2.
20 GL2 output Low-side gate driver output, connected to the gate of the low-side MOSFET.
21 SH2 input High-side source sense input, connected to the high-side MOSFET source.
22 GH2 output High-side gate driver output, connected to the gate of the high-side MOSFET.
23 CP2L passive Charge pump switching node; connect a 100 nF capacitor rated for PVDD between CP2H and CP2L.
24 CP2H passive Charge pump switching node; connect a 100 nF capacitor rated for PVDD between CP2H and CP2L.
25 CP1L passive Charge pump switching node; connect a 100 nF capacitor rated for PVDD between CP1H and CP1L.
26 CP1H passive Charge pump switching node; connect a 100 nF capacitor rated for PVDD between CP1H and CP1L.
27 VCP passive Charge pump output; connect a 1 µF, 16 V ceramic capacitor between VCP and PVDD.
28 PVDD power_in Device driver power supply input, connected to the bridge supply, with a 0.1 µF PVDD-rated ceramic capacitor and a local bulk capacitor of 10 µF or more to GND.
29 DRAIN input Bridge MOSFET drain voltage sense pin, connected to the common point of the high-side MOSFET drains.
30 GH3 output High-side gate driver output, connected to the gate of the high-side MOSFET.
31 SH3 input High-side source sense input, connected to the high-side MOSFET source.
32 GL3 output Low-side gate driver output, connected to the gate of the low-side MOSFET.
33 PGND2 power_in Low-side MOSFET gate drive 3-4 sense and power return, connected to system ground close to the device and half-bridges 3-4.
34 GL4 output Low-side gate driver output, connected to the gate of the low-side MOSFET.
35 SH4 input High-side source sense input, connected to the high-side MOSFET source.
36 GH4 output High-side gate driver output, connected to the gate of the high-side MOSFET.
37 GND power_in Device ground, connected to system ground.
38 DVDD power_in Device logic and digital output supply input and external voltage reference and supply for the current sense amplifier; a 1.0 µF, 6.3 V ceramic capacitor to GND is recommended.
39 GAIN input Amplifier gain setting, a 4-level input pin set by an external resistor.
40 VDS input VDS monitor threshold setting, a 6-level input pin set by an external resistor.
41 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-40(6x6)
Category Power Supply Chip
Pins 41

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
PVDD driver supply voltage VPVDD 4.9 37 V PVDD 23
DVDD digital supply voltage VDVDD 3 5.5 V DVDD 23
Digital input voltage VDIN 0 5.5 V BRAKE, DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, nSCS, SCLK, SDI 23
High-side average gate drive current IHS 0 15 mA GHx 23
Low-side average gate drive current ILS 0 15 mA GLx 23
Open-drain pull-up voltage VOD 0 5.5 V DRVOFF/nFLT 23
Open-drain output current IOD 0 5 mA DRVOFF/nFLT 23
Digital output current IDOUT 0 5 mA SDO 23
Brake input voltage VBRAKE 0 V BRAKE, upper limit PVDD 23
Amplifier reference supply voltage VAREF 3 5.5 V AREF 23
Shunt amplifier output current ISO 0 5 mA SOx 23
Operating ambient temperature TA -40 125 °C 23
Operating junction temperature TJ -40 150 °C 23
ESD HBM V(ESD) -2000 2000 V HBM, AEC Q100-002, classification level 2 23
ESD CDM corner pins V(ESD) -750 750 V CDM, AEC Q100-011, classification C4B, corner pins 23
ESD CDM other pins V(ESD) -500 500 V CDM, AEC Q100-011, classification C4B, other pins 23
Junction-to-ambient thermal resistance RθJA 31 °C/W DRV8714-Q1 RHA (VQFN) 40-pin 23
Junction-to-case (top) thermal resistance RθJC(top) 20.9 °C/W RHA 40-pin 23
Junction-to-board thermal resistance RθJB 12.5 °C/W RHA 40-pin 23
Junction-to-top characterization parameter ΨJT 0.2 °C/W RHA 40-pin 23
Junction-to-board characterization parameter ΨJB 12.4 °C/W RHA 40-pin 23
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.3 °C/W RHA 40-pin 23
PVDD sleep mode current IPVDDQ 2.25 3.5 µA VPVDD, VDRAIN = 13.5V, nSLEEP = 0V, BRAKE = 0V, -40 ≤ TJ ≤ 85°C 24
PVDD sleep mode current (BRAKE high) IPVDDQ 10 15 µA VPVDD, VDRAIN = 13.5V, nSLEEP = 0V, BRAKE = 5V, -40 ≤ TJ ≤ 85°C 24
DRAIN sleep mode current IDRAINQ 1.25 2 µA VPVDD, VDRAIN = 13.5V, nSLEEP = 0V, -40 ≤ TJ ≤ 85°C 24
DVDD sleep mode current (RHA) IDVDDQ 2.25 5.25 µA VPVDD, VDRAIN = 13.5V, nSLEEP = 0V, -40 ≤ TJ ≤ 85°C, DRV8714-Q1 RHA 24
PVDD active mode current IPVDD 13.5 15.5 mA VPVDD, VDRAIN = 13.5V, nSLEEP = 5V 24
DRAIN active mode current IDRAIN 1 1.65 mA VPVDD, VDRAIN = 13.5V, nSLEEP = 5V, VDS_LVL ≤ 500mV 24
DVDD active mode current (RHA) IDVDD 10 13 mA VDVDD = 5V, SDO = 0V, DRV8714-Q1 RHA 24
Digital oscillator switching frequency fDVDD 14.25 MHz Main frequency of spread spectrum 24
Turn-on time tWAKE 1 ms nSLEEP = 5V to operating mode 24
Turn-off time tSLEEP 1 ms nSLEEP = 0V to sleep mode 24
Charge pump voltage vs PVDD, tripler VVCP 9.5 10.5 11 V Tripler mode, VPVDD ≥ 9V, IVCP ≤ 30mA 24
Charge pump voltage vs PVDD, tripler VVCP 8.4 9 11 V Tripler mode, VPVDD = 7V, IVCP ≤ 25mA, DRV8714-Q1 RHA 24
Charge pump voltage vs PVDD, tripler VVCP 6.8 7.5 11 V Tripler mode, VPVDD = 4.9V, IVCP ≤ 12mA, DRV8714-Q1 RHA 24
Charge pump voltage vs PVDD, doubler VVCP 9.5 10.5 11 V Doubler mode, VPVDD ≥ 13V, IVCP ≤ 25mA 24
Charge pump voltage vs PVDD, doubler VVCP 6.9 8 11 V Doubler mode, VPVDD = 9V, IVCP ≤ 13.5mA, DRV8714-Q1 RHA 24
Charge pump voltage vs PVDD, doubler VVCP 5.3 6 11 V Doubler mode, VPVDD = 7V, IVCP ≤ 10mA, DRV8714-Q1 RHA 24
Charge pump switching frequency fVCP 400 kHz Main frequency of spread spectrum 24
BRAKE input logic low voltage VIL 0 0.6 V BRAKE 24
BRAKE input logic high voltage VIH 1.8 5.5 V BRAKE 24
BRAKE input hysteresis VHYS 0.5 V BRAKE 25
Input logic low current IIL -5 5 µA VDIN = 0V, BRAKE, DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, SCLK, SDI 25
Input pull-down resistance RPD 50 100 150 kΩ To GND, DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, SCLK, SDI 25
BRAKE pull-down resistance, sleep RPD 500 1000 1500 kΩ BRAKE to GND, nSLEEP = 0V, BRAKE ≤ 2 V, 4.9V ≤ VPVDD ≤ VPOB_OV 25
BRAKE pull-down resistance, active RPD 50 136 200 kΩ BRAKE to GND, nSLEEP = 5V, BRAKE ≤ 2 V, 4.9V ≤ VPVDD ≤ VPOB_OV 25
Input pull-up resistance RPU 50 100 150 kΩ To DVDD, nSCS 25
Four-level input 2 resistor RQI2 44.65 47 49.35 kΩ GAIN, MODE, level 2 set by resistor to GND 25
Six-level input 2 resistor RSI2 28.5 30 31.5 kΩ IDRIVE, VDS, level 2 set by resistor to GND 25
Six-level input 3 resistor RSI3 95 100 105 kΩ IDRIVE, VDS, level 3 set by resistor to GND 25
Six-level input 5 resistor RSI5 58.9 62 65.1 kΩ IDRIVE, VDS, level 5 set by resistor to DVDD 25
Output logic low voltage VOL 0.5 V IDOUT = 5mA 25

CAD (KiCad official)

  • Symbol: DRV8714HQRHARQ1
  • Footprint: Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
  • 3D model: VQFN-40(6x6) (KiCad packages3D, STEP)
  • 3D model files: drv8714hqrharq1-etched.step / drv8714hqrharq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8714hqrharq1.step / drv8714hqrharq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (190 pp, sha256 2f450297544df01a, retrieved 2026-11-02, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF