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DRV8350SRTVT

Texas Instruments · Motor Driver ICs · WQFN-32-EP(5x5)

DRV8350SRTVT from Texas Instruments, in a WQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CPH power_out Charge pump switching node; connect a X5R or X7R, 47-nF, VDRAIN-rated ceramic capacitor between CPH and CPL.
2 VM power_in Gate driver power supply input; connect to VDRAIN or a separate gate driver supply, with a X5R or X7R 0.1-µF VM-rated capacitor and at least 10 µF of local capacitance to GND.
3 VDRAIN input High-side MOSFET drain sense input and charge pump reference; connect to the common point of the MOSFET drains.
4 VCP power_out Charge pump output; connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between VCP and VDRAIN.
5 GHA output High-side gate driver output; connect to the gate of the high-side power MOSFET.
6 SHA input High-side source sense input; connect to the high-side power MOSFET source.
7 GLA output Low-side gate driver output; connect to the gate of the low-side power MOSFET.
8 SLA input Low-side source sense input; connect to the low-side power MOSFET source.
9 SLB input Low-side source sense input; connect to the low-side power MOSFET source.
10 GLB output Low-side gate driver output; connect to the gate of the low-side power MOSFET.
11 SHB input High-side source sense input; connect to the high-side power MOSFET source.
12 GHB output High-side gate driver output; connect to the gate of the high-side power MOSFET.
13 GHC output High-side gate driver output; connect to the gate of the high-side power MOSFET.
14 SHC input High-side source sense input; connect to the high-side power MOSFET source.
15 GLC output Low-side gate driver output; connect to the gate of the low-side power MOSFET.
16 SLC input Low-side source sense input; connect to the low-side power MOSFET source.
17 nFAULT output Open-drain fault indicator output; pulled logic low during a fault condition and requires an external pullup resistor.
18 SDO output Open-drain serial data output; data is shifted out on the rising edge of SCLK and the pin requires an external pullup resistor.
19 SDI input Serial data input; data is captured on the falling edge of SCLK.
20 SCLK input Serial clock input; serial data is shifted out and captured on the corresponding rising and falling edges of this pin.
21 nSCS input Serial chip select; a logic low on this pin enables serial interface communication.
22 ENABLE input Gate driver enable; a logic low puts the device into low-power sleep mode, and an 8 to 40-µs pulse can be used to reset fault conditions.
23 INHA input High-side gate driver control input that controls the output of the high-side gate driver.
24 INLA input Low-side gate driver control input that controls the output of the low-side gate driver.
25 INHB input High-side gate driver control input that controls the output of the high-side gate driver.
26 INLB input Low-side gate driver control input that controls the output of the low-side gate driver.
27 INHC input High-side gate driver control input that controls the output of the high-side gate driver.
28 INLC input Low-side gate driver control input that controls the output of the low-side gate driver.
29 DVDD power_out 5-V internal regulator output; connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between DVDD and GND, and the regulator can source up to 10 mA externally.
30 GND power_in Device primary ground; connect to system ground.
31 VGLS power_out 11-V internal regulator output; connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between VGLS and GND.
32 CPL power_out Charge pump switching node; connect a X5R or X7R, 47-nF, VDRAIN-rated ceramic capacitor between CPH and CPL.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-32-EP(5x5)
Category Power Supply Chip
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply pin voltage (VM) -0.3 80 V 10
MOSFET drain sense pin voltage (VDRAIN) -0.3 102 V 10
Low-side gate drive regulator pin voltage (VGLS) -0.3 18 V 10
Internal logic regulator pin voltage (DVDD) -0.3 5.75 V 10
Digital pin voltage (ENABLE, GAIN, IDRIVE, INHx, INLx, MODE, nFAULT, nSCS, SCLK, SDI, SDO, VDS) -0.3 5.75 V 10
Reference input pin voltage (VREF) -0.3 5.75 V 10
Continuous low-side source sense pin voltage (SLx) -1 1 V 10
Continuous shunt amplifier input pin voltage (SNx, SPx) -1 1 V 10
Junction temperature, TJ TJ -40 150 °C 10
Ambient temperature, TA TA -40 125 °C 10
Gate driver power supply voltage (VM) VVM 9 75 V 11
Charge pump reference and drain voltage sense (VDRAIN) VVDRAIN 7 100 V 11
Input voltage (ENABLE, GAIN, IDRIVE, INHx, INLx, MODE, nSCS, SCLK, SDI, VDS) VI 0 5.5 V 11
Applied PWM signal (INHx, INLx) fPWM 0 200 kHz 11
High-side average gate-drive current (GHx) IGATE_HS 0 25 mA 11
Low-side average gate-drive current (GLx) IGATE_LS 0 25 mA 11
External load current (DVDD) IDVDD 0 10 mA 11
Reference voltage input (VREF) VVREF 3 5.5 V 11
Shunt amplifier output current (SOx) ISO 0 5 mA 11
Open drain pullup voltage (nFAULT, SDO) VOD 0 5.5 V 11
Open drain output current (nFAULT, SDO) IOD 0 5 mA 11
Operating ambient temperature TA -40 125 °C 11
Operating junction temperature TJ -40 150 °C 11
Junction-to-ambient thermal resistance (32-pin RTV WQFN) RθJA 29.2 °C/W 11
Junction-to-case (top) thermal resistance (32-pin RTV WQFN) RθJC(top) 15.2 °C/W 11
VM operating supply current IVM 8.5 13 mA VVM = VVDRAIN = 48 V, ENABLE = 3.3 V, INHx/INLx = 0 V 12
VDRAIN operating supply current IVDRAIN 1.9 4 mA VVM = VVDRAIN = 48 V, ENABLE = 3.3 V, INHx/INLx = 0 V 12
Sleep mode supply current ISLEEP 20 40 µA ENABLE = 0 V, VVM = VVDRAIN = 48 V, TA = 25°C 12
Sleep mode supply current ISLEEP 100 µA ENABLE = 0 V, VVM = VVDRAIN = 48 V, TA = 125°C 12
Reset pulse time tRST 5 40 µs ENABLE = 0 V period to reset faults 12
Turnon time tWAKE 1 ms VVM > VUVLO, ENABLE = 3.3 V to outputs ready 12
Turnoff time tSLEEP 1 ms ENABLE = 0 V to device sleep mode 12
DVDD regulator voltage VDVDD 4.75 5 5.25 V IDVDD = 0 to 10 mA 12
VCP operating voltage with respect to VDRAIN VVCP 9 10.5 12 V VVM = 15 V, IVCP = 0 to 25 mA 12
VCP operating voltage with respect to VDRAIN VVCP 5.5 7.5 8.5 V VVM = 9 V, IVCP = 0 to 10 mA 12
VGLS operating voltage with respect to GND VVGLS 13 14.5 16 V VVM = 15 V, IVGLS = 0 to 25 mA 12
VGLS operating voltage with respect to GND VVGLS 7 8.5 9.5 V VVM = 9 V, IVGLS = 0 to 10 mA 12
Input logic low voltage VIL 0 0.8 V 12
Input logic high voltage VIH 1.5 5.5 V 12
Input logic low current IIL -5 5 µA VVIN = 0 V 12
Input logic high current IIH 50 70 µA VVIN = 5 V 12
Output logic low voltage VOL 0.125 V IO = 5 mA 12
Output high impedance leakage IOZ -2 2 µA VO = 5 V 12
High-side gate drive voltage with respect to SHx VGSH 9 10.5 12 V VVM = 15 V, IVCP = 0 to 25 mA 13
High-side gate drive voltage with respect to SHx VGSH 5.5 7.5 8.5 V VVM = 9 V, IVCP = 0 to 10 mA 13
Low-side gate drive voltage with respect to PGND VGSL 9.5 11 12.5 V VVM = 15 V, IVGLS = 0 to 25 mA 13
Low-side gate drive voltage with respect to PGND VGSL 6.5 8 9.5 V VVM = 9 V, IVGLS = 0 to 10 mA 13
Amplifier gain GCSA 4.85 5 5.15 V/V SPI Device, CSA_GAIN = 00b 14
Amplifier gain GCSA 38.8 40 41.2 V/V SPI Device, CSA_GAIN = 11b 14
Common mode input range VCOM -0.15 0.15 V 14
Differential mode input range VDIFF -0.3 0.3 V 14
Input offset error VOFF -3 3 mV VSP = VSN = 0 V 14
Drift offset VDRIFT 10 µV/°C VSP = VSN = 0 V 14
VREF input current IVREF 1.5 2.5 mA VVREF = 5 V 15
VM undervoltage lockout (VM falling, UVLO report) VVM_UV 8 8.3 8.8 V DRV835x: VM falling, UVLO report 15
VM undervoltage lockout (VM rising, UVLO recovery) VVM_UV 8.2 8.5 9 V DRV835x: VM rising, UVLO recovery 15
VDRAIN undervoltage lockout (VDRAIN falling, UVLO report) VVDR_UV 6.1 6.4 6.8 V DRV835x: VDRAIN falling, UVLO report 15
VDRAIN undervoltage lockout (VDRAIN rising, UVLO recovery) VVDR_UV 6.3 6.6 7 V DRV835x: VDRAIN rising, UVLO recovery 15
VDS overcurrent trip voltage VVDS_OCP 0.041 0.06 0.072 V SPI Device, DRV835x: VDS_LVL = 0000b 16
VDS overcurrent trip voltage VVDS_OCP 1.8 2 2.2 V SPI Device, VDS_LVL = 1111b 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper into the feedback pin. • Put the input bypass capacitor near the VIN pin to decrease copper trace resistance which effects input 78

CAD (KiCad official)

  • Symbol: DRV8350SRTVT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: WQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: drv8350srtvt-etched.step / drv8350srtvt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8350srtvt.step / drv8350srtvt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (101 pp, sha256 8bb3a1d29ec9ea07, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF