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Contents

README

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DRV8323HRTAT

Texas Instruments · Motor Driver ICs · WQFN-40-EP(6x6)

DRV8323HRTAT from Texas Instruments, in a WQFN-40-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CPL power_in Charge pump negative switching node; connect X5R or X7R 47nF VM-rated ceramic capacitor between CPH and CPL.
2 CPH power_in Charge pump switching node; connect X5R or X7R 47nF VM-rated ceramic capacitor between CPH and CPL pins.
3 VCP power_out Charge pump output; connect X5R or X7R 1µF 25V ceramic capacitor between VCP and VM pins.
4 VM power_in Gate driver power supply input 6V to 60V; connect to motor power supply and VDRAIN with X5R/X7R 0.1µF VM-rated and ≥10µF bulk capacitors.
5 VDRAIN input High-side MOSFET drain input; connect to the common point of high-side MOSFET drains for VDS monitor.
6 GHA output High-side gate driver output; connect to high-side power MOSFET gate with up to 1A peak current drive capability.
7 SHA bidirectional High-side source pin; connect to high-side MOSFET source for VDS monitoring and gate driver sink current return path.
8 GLA output Low-side gate driver output; connect to low-side power MOSFET gate with up to 2A peak sink current capability.
9 SPA input Low-side shunt amplifier input and VDS monitor negative input; connect to current shunt high side or SNA if CSA unused.
10 SNA input Current sense amplifier input; connect to current sampling resistor low side or PGND if CSA unused.
11 SNB input Current sense amplifier input; connect to current sampling resistor low side or PGND if CSA unused.
12 SPB input Low-side shunt amplifier input and VDS monitor negative input; connect to current shunt high side or SNB if CSA unused.
13 GLB output Low-side gate driver output; connect to low-side power MOSFET gate with up to 2A peak sink current capability.
14 SHB bidirectional High-side source pin; connect to high-side MOSFET source for VDS monitoring and gate driver sink current return path.
15 GHB output High-side gate driver output; connect to high-side power MOSFET gate with up to 1A peak current drive capability.
16 GHC output High-side gate driver output; connect to high-side power MOSFET gate with up to 1A peak current drive capability.
17 SHC bidirectional High-side source pin; connect to high-side MOSFET source for VDS monitoring and gate driver sink current return path.
18 GLC output Low-side gate driver output; connect to low-side power MOSFET gate with up to 2A peak sink current capability.
19 SPC input Low-side shunt amplifier input and VDS monitor negative input; connect to current shunt high side or SNC if CSA unused.
20 SNC input Current sense amplifier input; connect to current sampling resistor low side or PGND if CSA unused.
21 SOC output Current sense amplifier output for phase C; keep unconnected if current sense amplifier CSA not used.
22 SOB output Current sense amplifier output for phase B; keep unconnected if current sense amplifier CSA not used.
23 SOA output Current sense amplifier output for phase A; keep unconnected if current sense amplifier CSA not used.
24 VREF power_out Current sense amplifier power input and reference 3V to 5.5V; connect X5R or X7R 0.1µF 6.3V ceramic capacitor between VREF and AGND.
25 nFAULT tri_state Fault indicator open-drain output pulled to logic low during fault condition; requires external pull-up resistor to logic supply.
26 MODE input PWM input mode setting 4-level input set by external resistor for 6x/3x/1x/Independent PWM mode selection.
27 IDRIVE input Gate driver output current setting 7-level input set by external resistor to select 10mA to 1A peak drive current.
28 VDS input VDS monitoring trip point setting 7-level input set by external resistor to select overcurrent threshold 0.06V to 1.88V.
29 GAIN input Amplifier gain setting 4-level input set by external resistor for current sense amplifier gain 5V/V to 40V/V selection.
30 ENABLE input Gate driver enable input; logic low enables low-power sleep mode, pulse 8µs to 40µs resets fault without sleep mode.
31 CAL input Amplifier calibration input; set to logic high to internally short amplifier inputs and perform automatic offset voltage calibration.
32 AGND power_in Device analog ground; connect to system ground with AGND externally connected to PGND.
33 DVDD power_out 3.3V internal regulator output with 30mA capacity; connect X5R or X7R 1µF 6.3V ceramic capacitor between DVDD and AGND.
34 INHA input High-side gate driver control input; in 6x PWM mode, controls high-side gate driver output state for phase A.
35 INLA input Low-side gate driver control input; in 6x PWM mode, controls low-side gate driver output state for phase A.
36 INHB input High-side gate driver control input; in 6x PWM mode, controls high-side gate driver output state for phase B.
37 INLB input Low-side gate driver control input; in 6x PWM mode, controls low-side gate driver output state for phase B.
38 INHC input High-side gate driver control input; in 6x PWM mode, controls high-side gate driver output state for phase C.
39 INLC input Low-side gate driver control input; in 6x PWM mode, controls low-side gate driver output state for phase C.
40 PGND power_in Device power ground and low-side MOSFET gate driver return path; connect to system ground with PGND externally connected to AGND.
41 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-40-EP(6x6)
Category Power Supply Chip
Pins 41

CAD (KiCad official)

  • Symbol: DRV8323HRTAT
  • Footprint: Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
  • 3D model: WQFN-40-EP(6x6) (KiCad packages3D, STEP)
  • 3D model files: drv8323hrtat-etched.step / drv8323hrtat-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8323hrtat.step / drv8323hrtat.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (95 pp, sha256 98e62c0c61f99755, retrieved 2026-10-03, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF