# DRV8300NRGER

**Texas Instruments** · Isolators - Gate Drivers · VQFN-24(4x4)

DRV8300NRGER from Texas Instruments, in a VQFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INLA | input | Low-side gate driver control input for phase A. Controls the output of the low-side gate driver (GLA). 3.3V/5V logic compatible, absolute max 20V. |
| 2 | INLB | input | Low-side gate driver control input for phase B. Controls the output of the low-side gate driver (GLB). 3.3V/5V logic compatible. |
| 3 | INLC | input | Low-side gate driver control input for phase C. Controls the output of the low-side gate driver (GLC). 3.3V/5V logic compatible. |
| 4 | GVDD | power_in | Gate driver power supply input, 5-20V. Connect a X5R or X7R GVDD-rated ceramic capacitor >=10uF between GVDD and GND locally. |
| 5 | MODE | input | Mode input pin. Controls polarity of GLx relative to INLx: MODE floating selects non-inverted (GLx same phase as INLx), MODE tied to GVDD selects inverted polarity. |
| 6 | GND | power_in | Device ground reference. |
| 7 | NC | unconnected | No internal connection. May be left floating or tied to system ground. |
| 8 | NC | unconnected | No internal connection. May be left floating or tied to system ground. |
| 9 | GLC | output | Low-side gate driver output for phase C. Connect to the gate of the low-side power MOSFET. 750mA source / 1.5A sink capability. |
| 10 | GLB | output | Low-side gate driver output for phase B. Connect to the gate of the low-side power MOSFET. |
| 11 | GLA | output | Low-side gate driver output for phase A. Connect to the gate of the low-side power MOSFET. |
| 12 | SHC | input | High-side source sense input for phase C. Connect to the high-side power MOSFET source. Absolute max SHx voltage +125V; can tolerate -22V transient. |
| 13 | GHC | output | High-side gate driver output for phase C. Connect to the gate of the high-side power MOSFET. |
| 14 | BSTC | output | Bootstrap capacitor pin for phase C. Connect capacitor between BSTC and SHC. On DRV8300N an external bootstrap diode is required. |
| 15 | SHB | input | High-side source sense input for phase B. Connect to the high-side power MOSFET source. |
| 16 | GHB | output | High-side gate driver output for phase B. Connect to the gate of the high-side power MOSFET. |
| 17 | BSTB | output | Bootstrap capacitor pin for phase B. Connect capacitor between BSTB and SHB. External bootstrap diode required on DRV8300N. |
| 18 | SHA | input | High-side source sense input for phase A. Connect to the high-side power MOSFET source. |
| 19 | GHA | output | High-side gate driver output for phase A. Connect to the gate of the high-side power MOSFET. |
| 20 | BSTA | output | Bootstrap capacitor pin for phase A. Connect capacitor between BSTA and SHA. External bootstrap diode required on DRV8300N. |
| 21 | DT | input | Deadtime input pin. Connect a resistor to ground to set variable dead-time; leave floating for fixed deadtime. Only available on QFN (RGE) packages. |
| 22 | INHA | input | High-side gate driver control input for phase A. Controls the output of the high-side gate driver (GHA). 3.3V/5V logic compatible. |
| 23 | INHB | input | High-side gate driver control input for phase B. Controls the output of the high-side gate driver (GHB). |
| 24 | INHC | input | High-side gate driver control input for phase C. Controls the output of the high-side gate driver (GHC). |
| PAD | PowerPAD | power_in | Exposed thermal pad on package bottom. Connect to GND plane for thermal dissipation and ground reference. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24(4x4) |
| Category | PMIC |
| Pins | 25 |

## Ordering variants

Same part, different packaging or reel option.

- `DRV8300NRGERDRGE`
- `DRV8300NRGER`
- `DRV8300NRGERDIPW`
- `DRV8300NRGERDPW`
- `DRV8300NRGERNIPW`
- `DRV8300NRGERNPW`

## CAD (KiCad official)

- Symbol: `DRV8300NRGER`
- Footprint: `Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm`
- 3D model: VQFN-24(4x4) (KiCad packages3D, STEP)
- 3D model files: `drv8300nrger-etched.step` / `drv8300nrger-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv8300nrger.step` / `drv8300nrger.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](docs/drv8300nrger-datasheet.pdf) (36 pp, sha256 `4e3a04ce3548f210`, retrieved 2026-08-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/drv8300nrger-datasheet.pdf)