component
DRV8245SQPWPRQ1
Public Made by Adomby adom
Texas Instruments Gate Drivers, HTSSOP-28. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDRV8245SQPWPRQ1
Texas Instruments · Gate Drivers · HTSSOP-28
DRV8245SQPWPRQ1 from Texas Instruments, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCLK | input | SPI serial clock input. |
| 2 | nSCS | input | Active-low SPI chip select enabling serial interface communication. |
| 3 | PH/IN2 | input | Controller input pin for bridge operation. |
| 4 | EN/IN1 | input | Controller input pin for bridge operation. |
| 5 | DRVOFF | input | Controller input pin for bridge Hi-Z. |
| 6 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 7 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 8 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 9 | OUT1 | output | Half-bridge output 1 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 10 | OUT1 | output | Half-bridge output 1 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 11 | OUT1 | output | Half-bridge output 1 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 12 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 13 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 14 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 15 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 16 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 17 | GND | power_in | Ground pin (one of 6 total); must combine all GND pins for device current capability. |
| 18 | OUT2 | output | Half-bridge output 2 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 19 | OUT2 | output | Half-bridge output 2 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 20 | OUT2 | output | Half-bridge output 2 to motor/load (one of 3 total pins); must combine pins for device current capability. |
| 21 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 22 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 23 | VM | power_in | Motor supply voltage pin (one of 6 total); bypass to GND with 0.1µF ceramic and bulk capacitor. |
| 24 | nSLEEP | input | SPI (S) variant controller input pin for SLEEP; also defines VIO logic level for SDO. |
| 25 | IPROPI | bidirectional | Driver load current analog feedback proportional to high-side sensed current. |
| 26 | nFAULT | tri_state | Open-drain fault indication output to controller. |
| 27 | SDO | output | SPI serial data output updated on rising edge of SCLK. |
| 28 | SDI | input | SPI serial data input captured on falling edge of SCLK. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-28 |
| Category | Motor Driver ICs |
| Pins | 29 |
CAD (KiCad official)
- Symbol:
DRV8245SQPWPRQ1 - Footprint:
Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm - 3D model: HTSSOP-28 (KiCad packages3D, STEP)
- 3D model files:
drv8245sqpwprq1-etched.step/drv8245sqpwprq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv8245sqpwprq1.step/drv8245sqpwprq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (82 pp, sha256
ef9b9567d4c2ffed, retrieved 2026-10-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).