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DRV5032FBDBZT
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Texas Instruments Hall Sensor, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DRV5032FBDBZT
Texas Instruments · Hall Sensor · SOT-23
DRV5032FBDBZT from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | 1.65 V to 5.5 V supply; TI recommends a ceramic capacitor to ground of at least 0.1 µF. |
| 2 | OUT | output | Push-pull omnipolar output that responds to both north and south magnetic poles (FB version: 5 Hz sampling, drives VCC or ground). |
| 3 | GND | power_in | Ground reference. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Low-level output voltage (push-pull) | VOL | 0.1 | 0.3 | V | IOUT = 1 mA | 6 | |
| Magnetic sampling frequency (FB) | fS | 3.5 | 5 | 8.5 | Hz | FB version | 6 |
| Magnetic sampling period (FB) | tS | 117 | 200 | 286 | ms | FB version | 6 |
| Average supply current (FB) | ICC(AVG) | 0.54 | µA | VCC = 1.8 V, FB version | 6 | ||
| Average supply current (FB) | ICC(AVG) | 0.69 | 1.8 | µA | VCC = 3 V, FB version | 6 | |
| Average supply current (FB) | ICC(AVG) | 1.06 | µA | VCC = 5 V, FB version | 6 | ||
| Peak supply current | ICC(PK) | 2 | 2.7 | mA | All versions | 6 | |
| Turn-on time | tON | 55 | 100 | µs | All versions | 6 | |
| Active operating period | tACTIVE | 40 | µs | All versions | 6 | ||
| Magnetic threshold operate point | BOP | 1.5 | 3 | 4.8 | mT | FA, FB, FC versions; printed as ±1.5 / ±3 / ±4.8 | 7 |
| Magnetic threshold release point | BRP | 0.5 | 1.5 | 3 | mT | FA, FB, FC versions; printed as ±0.5 / ±1.5 / ±3 | 7 |
| Magnetic hysteresis /BOP, BRP/ | BHYS | 0.8 | 1.5 | 3 | mT | FA, FB, FC versions | 7 |
| Supply voltage | VCC | -0.3 | 5.5 | V | 5 | ||
| Output voltage OUT | -0.3 | V | Max printed as VCC+0.3 | 5 | |||
| Output current OUT | -5 | 5 | mA | 5 | |||
| Junction temperature | TJ | 105 | °C | 5 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| ESD HBM | V(ESD) | -6000 | 6000 | V | ANSI/ESDA/JEDEC JS-001 | 5 | |
| ESD CDM | V(ESD) | -750 | 750 | V | JEDEC JESD22-C101 | 5 | |
| Supply voltage | VCC | 1.65 | 5.5 | V | 5 | ||
| Output voltage | VO | 0 | 5.5 | V | 5 | ||
| Output current | IO | -5 | 5 | mA | 5 | ||
| Operating ambient temperature | TA | -40 | 85 | °C | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 356 | °C/W | DBZ (SOT-23), 3 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 128 | °C/W | DBZ (SOT-23), 3 pins | 5 | ||
| Junction-to-board thermal resistance | RθJB | 94 | °C/W | DBZ (SOT-23), 3 pins | 5 | ||
| Junction-to-top characterization parameter | ψJT | 11.4 | °C/W | DBZ (SOT-23), 3 pins | 5 | ||
| Junction-to-board characterization parameter | ψJB | 92 | °C/W | DBZ (SOT-23), 3 pins | 5 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
DRV5032FBDBZT - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.12 mm tall, datasheet A, max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
drv5032fbdbzt-etched.step/drv5032fbdbzt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv5032fbdbzt.step/drv5032fbdbzt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (41 pp, sha256
529301d6efc720aa, retrieved 2026-11-13, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
# DRV5032FBDBZT
**Texas Instruments** · Hall Sensor · SOT-23
DRV5032FBDBZT from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | 1.65 V to 5.5 V supply; TI recommends a ceramic capacitor to ground of at least 0.1 µF. |
| 2 | OUT | output | Push-pull omnipolar output that responds to both north and south magnetic poles (FB version: 5 Hz sampling, drives VCC or ground). |
| 3 | GND | power_in | Ground reference. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Sensors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Low-level output voltage (push-pull) | VOL | | 0.1 | 0.3 | V | IOUT = 1 mA | 6 |
| Magnetic sampling frequency (FB) | fS | 3.5 | 5 | 8.5 | Hz | FB version | 6 |
| Magnetic sampling period (FB) | tS | 117 | 200 | 286 | ms | FB version | 6 |
| Average supply current (FB) | ICC(AVG) | | 0.54 | | µA | VCC = 1.8 V, FB version | 6 |
| Average supply current (FB) | ICC(AVG) | | 0.69 | 1.8 | µA | VCC = 3 V, FB version | 6 |
| Average supply current (FB) | ICC(AVG) | | 1.06 | | µA | VCC = 5 V, FB version | 6 |
| Peak supply current | ICC(PK) | | 2 | 2.7 | mA | All versions | 6 |
| Turn-on time | tON | | 55 | 100 | µs | All versions | 6 |
| Active operating period | tACTIVE | | 40 | | µs | All versions | 6 |
| Magnetic threshold operate point | BOP | 1.5 | 3 | 4.8 | mT | FA, FB, FC versions; printed as ±1.5 / ±3 / ±4.8 | 7 |
| Magnetic threshold release point | BRP | 0.5 | 1.5 | 3 | mT | FA, FB, FC versions; printed as ±0.5 / ±1.5 / ±3 | 7 |
| Magnetic hysteresis /BOP, BRP/ | BHYS | 0.8 | 1.5 | 3 | mT | FA, FB, FC versions | 7 |
| Supply voltage | VCC | -0.3 | | 5.5 | V | | 5 |
| Output voltage OUT | | -0.3 | | | V | Max printed as VCC+0.3 | 5 |
| Output current OUT | | -5 | | 5 | mA | | 5 |
| Junction temperature | TJ | | | 105 | °C | | 5 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 5 |
| ESD HBM | V(ESD) | -6000 | | 6000 | V | ANSI/ESDA/JEDEC JS-001 | 5 |
| ESD CDM | V(ESD) | -750 | | 750 | V | JEDEC JESD22-C101 | 5 |
| Supply voltage | VCC | 1.65 | | 5.5 | V | | 5 |
| Output voltage | VO | 0 | | 5.5 | V | | 5 |
| Output current | IO | -5 | | 5 | mA | | 5 |
| Operating ambient temperature | TA | -40 | | 85 | °C | | 5 |
| Junction-to-ambient thermal resistance | RθJA | | 356 | | °C/W | DBZ (SOT-23), 3 pins | 5 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 128 | | °C/W | DBZ (SOT-23), 3 pins | 5 |
| Junction-to-board thermal resistance | RθJB | | 94 | | °C/W | DBZ (SOT-23), 3 pins | 5 |
| Junction-to-top characterization parameter | ψJT | | 11.4 | | °C/W | DBZ (SOT-23), 3 pins | 5 |
| Junction-to-board characterization parameter | ψJB | | 92 | | °C/W | DBZ (SOT-23), 3 pins | 5 |
## CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol: `DRV5032FBDBZT`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.12 mm tall, datasheet A, max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files: `drv5032fbdbzt-etched.step` / `drv5032fbdbzt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv5032fbdbzt.step` / `drv5032fbdbzt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/drv5032fbdbzt.pdf) (41 pp, sha256 `529301d6efc720aa`, retrieved 2026-11-13, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
[Datasheet PDF](docs/drv5032fbdbzt-datasheet.pdf)