component
DRV425RTJR
Public Made by Adomby adom
Texas Instruments Linear Hall Sensors, QFN-20-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDRV425RTJR
Texas Instruments · Linear Hall Sensors · QFN-20-EP(4x4)
DRV425RTJR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BSEL | input | Bandwidth selection input; selects 32 kHz when low or 47 kHz when high with 22Ω external shunt resistance. |
| 2 | RSEL1 | input | Reference voltage mode selection input bit 1; used with RSEL0 to select REFOUT of 2.5V (00), 1.65V (01), or VDD/2 (1x). |
| 3 | RSEL0 | input | Reference voltage mode selection input bit 0; used with RSEL1 to select REFOUT of 2.5V (00), 1.65V (01), or VDD/2 (1x). |
| 4 | REFOUT | output | Precision voltage reference output providing 2.5V ±2% maximum accuracy or 1.65V ±2% or VDD/2 with ±50ppm/°C temperature drift. |
| 5 | REFIN | input | Common-mode reference input of shunt sense amplifier; accepts input voltage range from GND to VDD with 40kΩ to 60kΩ input impedance. |
| 6 | VOUT | output | Shunt sense amplifier output with 4V/V gain centered at REFIN voltage and responsive to detected magnetic field proportional to external shunt resistor voltage. |
| 7 | GND | power_in | Ground reference pin; must be connected to ground plane for proper device operation and thermal dissipation. |
| 8 | VDD | power_in | Power supply pin for 3.0V to 5.5V operation; must be bypassed with 1µF ceramic capacitor placed close to the device. |
| 9 | VDD | power_in | Power supply pin for 3.0V to 5.5V operation; must be bypassed with 1µF ceramic capacitor placed close to the device. |
| 10 | GND | power_in | Ground reference pin; must be connected to ground plane for proper device operation and thermal dissipation. |
| 11 | DRV2 | output | Compensation coil driver output 2; differential drive capable of ±250mA at 5V or ±150mA at 3.3V with common-mode voltage set by RSEL pins. |
| 12 | DRV1 | output | Compensation coil driver output 1; differential drive capable of ±250mA at 5V or ±150mA at 3.3V with common-mode voltage set by RSEL pins. |
| 13 | AINP | input | Non-inverting input of shunt sense amplifier; connected to positive terminal of external shunt resistor with 20kΩ differential input impedance. |
| 14 | AINN | input | Inverting input of shunt sense amplifier; connected to negative terminal of external shunt resistor with 20kΩ differential input impedance. |
| 15 | OR | output | Out-of-range indicator; open-drain active-low output asserted when shunt sense amplifier output exceeds 48mV to 100mV from supply rails with 2.5µs to 3.5µs response delay. |
| 16 | COMP1 | input | Internal compensation coil feedback input 1; provides feedback signal for closed-loop magnetic field compensation circuit. |
| 17 | COMP2 | input | Internal compensation coil feedback input 2; provides feedback signal for closed-loop magnetic field compensation circuit. |
| 18 | GND | power_in | Ground reference pin; must be connected to ground plane for proper device operation and thermal dissipation. |
| 19 | ERROR | output | Error flag; open-drain active-low output asserted when fluxgate sensor saturates with internal magnetic field exceeding ±1.6mT, with 4µs to 6µs suppression delay. |
| 20 | GND | power_in | Ground reference pin; must be connected to ground plane for proper device operation and thermal dissipation. |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-20-EP(4x4) |
| Category | Magnetic Sensors |
| Pins | 21 |
CAD (KiCad official)
- Symbol:
DRV425RTJR - Footprint:
Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
drv425rtjr-etched.step/drv425rtjr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv425rtjr.step/drv425rtjr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (40 pp, sha256
bd09889dc24e60d9, retrieved 2026-09-24, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).