component
DP83TC813SRHFRQ1
Public Made by Adomby adom
Texas Instruments Ethernet Transceivers, VQFN-28(4x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownDP83TC813SRHFRQ1
Texas Instruments · Ethernet Transceivers · VQFN-28(4x5)
DP83TC813SRHFRQ1 from Texas Instruments, in a VQFN-28(4x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TX_CLK | bidirectional | MII mode: 25 MHz output (50 Ω driver) with constant phase referenced to the reference clock; RGMII mode: 25 MHz clock input from the MAC that must be provided; not used in RMII and SGMII modes. |
| 2 | TX_EN/TX_CTRL | input | Transmit enable input: in MII it precedes the TX_CLK rising edge and indicates valid TX_D[3:0] data; in RGMII it is the transmit control input combining TX_EN and TX_ER; not used in SGMII mode. |
| 3 | TX_D3 | input | Transmit data nibble bit 3 from the MAC, latched before the TX_CLK rising edge in MII/RGMII mode; not used in RMII slave mode. |
| 4 | TX_D2 | input | Transmit data nibble bit 2 from the MAC, latched before the TX_CLK rising edge in MII/RGMII mode; not used in RMII slave mode. |
| 5 | TX_D1/TX_P | input | Transmit data bit 1 in MII/RGMII/RMII modes; in SGMII mode this pin is the TX_P differential data input receiving data from the MAC. |
| 6 | TX_D0/TX_M | input | Transmit data bit 0 in MII/RGMII/RMII modes; in SGMII mode this pin is the TX_M differential data input receiving data from the MAC. |
| 7 | VDDIO | power_in | I/O supply selectable at 1.8 V, 2.5 V or 3.3 V (recommended 1.62-1.98 V, 2.25-2.75 V or 2.97-3.63 V); decouple with ferrite bead, 0.47 µF and 0.01 µF capacitors. |
| 8 | MDIO | bidirectional | Open-drain management data input/output for the SMI bus; requires a pull-up to VDDIO, with 2.2 kΩ to 9 kΩ recommended. |
| 9 | MDC | input | Management data clock input that synchronizes MDIO transfers; MDC frequency range is 2.5 MHz to 20 MHz per the timing table and may be asynchronous to the MAC clocks. |
| 10 | INT_N | bidirectional | Active-low open-drain interrupt output with weak internal pull-up (9 kΩ typ.); can alternatively be configured as a power-down input. |
| 11 | RESET_N | input | Active-low reset input with internal pull-up (9 kΩ typ.) that reinitializes the PHY; must be held low for at least 1 µs to force a reset, and bootstrap pins are resampled on release. |
| 12 | XO | output | Crystal oscillator output used only with a 25 MHz crystal; must be left unconnected when XI is driven by a CMOS-level oscillator. |
| 13 | XI | input | Reference clock input: 25 MHz crystal or oscillator (50 MHz CMOS oscillator in RMII slave mode); a 100 Ω series resistor is required in series with XI when a crystal is used. |
| 14 | CLKOUT/LED_1 | bidirectional | Multiplexed pin: 25 MHz reference clock output (50 MHz in RMII slave mode) by default, or LED_1/GPIO output when configured by register. |
| 15 | VSLEEP | power_in | TC-10 sleep supply at 3.3 V (recommended 2.97-3.63 V); a 0.1 µF ceramic decoupling capacitor is recommended. |
| 16 | WAKE | bidirectional | High-level input that wakes the PHY from TC-10 sleep and can be tied directly to VSLEEP; a 10 kΩ external pull-down is recommended to prevent accidental wake-up. |
| 17 | INH | bidirectional | Active-high open-drain output that is high-impedance in TC-10 sleep and high in all other states; an external 2 kΩ-10 kΩ pull-down is required when implementing TC-10. |
| 18 | VDDA | power_in | Core supply at 3.3 V (recommended 2.97-3.63 V); decouple with 0.47 µF and 0.01 µF ceramic capacitors, optional ferrite bead. |
| 19 | TRD_P | bidirectional | Positive leg of the 100BASE-T1 differential media interface (IEEE 802.3bw), connected through the common-mode choke and DC-blocking/ESD network. |
| 20 | TRD_M | bidirectional | Negative leg of the 100BASE-T1 differential media interface (IEEE 802.3bw), connected through the common-mode choke and DC-blocking/ESD network. |
| 21 | RX_ER | output | Receive error output that flags a receive error symbol in MII and RMII modes; not used in RGMII and SGMII modes. |
| 22 | RX_DV/CRS_DV/RX_CTRL | output | Mode-dependent receive output: RX_DV (valid data) in MII, CRS_DV (carrier sense/data valid) in RMII (default, register 0x0551 = 0x0010), or RX_CTRL in RGMII; not used in SGMII mode; has internal pull-down (6 kΩ typ.) as strap. |
| 23 | VDDMAC | power_in | Optional separate MAC-interface supply at 1.8 V, 2.5 V or 3.3 V; must be connected to VDDIO when a separate MAC supply is not needed. |
| 24 | RX_D3/RX_M | output | Receive data bit 3 in MII/RGMII; in RMII master mode it outputs a 50 MHz clock that must be fed to the MAC; in SGMII mode it is the RX_M differential data output to the MAC. |
| 25 | RX_D2/RX_P | output | Receive data bit 2 in MII/RGMII; not used in RMII slave mode; in SGMII mode it is the RX_P differential data output to the MAC. |
| 26 | RX_D1 | output | Receive data bit 1, presented synchronously to the RX_CLK rising edge; used as RX_D[1:0] in RMII mode. |
| 27 | RX_D0 | output | Receive data bit 0, presented synchronously to the RX_CLK rising edge; used as RX_D[1:0] in RMII mode. |
| 28 | RX_CLK | output | Receive clock providing a 25 MHz reference clock in MII and RGMII modes; not used in RMII and SGMII modes. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-28(4x5) |
| Category | Interface |
| Pins | 29 |
CAD (KiCad official)
- Symbol:
DP83TC813SRHFRQ1 - Footprint:
Package_DFN_QFN:QFN-28-1EP_4x5mm_P0.5mm_EP2.65x3.65mm - 3D model: VQFN-28(4x5) (KiCad packages3D, STEP)
- 3D model files:
dp83tc813srhfrq1-etched.step/dp83tc813srhfrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dp83tc813srhfrq1.step/dp83tc813srhfrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (176 pp, sha256
6192afa4f2470823, retrieved 2026-10-10, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).