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Contents

README

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DP83826ERHBT

Texas Instruments · Ethernet Transceivers · VQFN-32-EP(5x5)

DP83826ERHBT from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ModeSelect input Mode selection input with internal pull-up; leave NC or pull to VDDIO for Enhanced Mode, short to GND for Basic Mode.
2 CEXT passive External capacitor node for clock stabilization; connect via 2nF capacitor to GND.
3 VDDA3V3 power_in Analog power supply input; 3.3V with appropriate decoupling capacitors per power section.
4 RD_M input Differential receive input minus; auto-configured for 10BASE-Te or 100BASE-TX according to IEEE 802.3.
5 RD_P input Differential receive input plus; auto-configured for 10BASE-Te or 100BASE-TX according to IEEE 802.3.
6 TD_M output Differential transmit output minus; configured as 10BASE-Te or 100BASE-TX per strap configuration.
7 TD_P output Differential transmit output plus; configured as 10BASE-Te or 100BASE-TX per strap configuration.
8 XO output Crystal oscillator output; leave floating when using CMOS-level oscillator on XI pin.
9 XI/50MHzIn input Crystal or oscillator input; accepts 25MHz ±50ppm crystal (MII/RMII leader) or 50MHz ±50ppm CMOS oscillator (RMII follower).
10 RBIAS passive Bias resistor node; connect 6.49kΩ ±1% resistor to ground.
11 MDIO bidirectional Bidirectional management data I/O for SMI protocol; has 10kΩ internal pull-up requiring external pull-up resistor.
12 MDC input Management data clock input; synchronizes MDIO transactions at maximum 25MHz with no minimum frequency.
13 RX_D3 output Receive data output bit 3; valid when RX_DV asserted, synchronized with RX_CLK rising edge.
14 RX_D2 output Receive data output bit 2; valid when RX_DV asserted, synchronized with RX_CLK rising edge.
15 RX_D1 output Receive data output bit 1; valid when RX_DV asserted, synchronized with RX_CLK rising edge.
16 RX_D0 output Receive data output bit 0; valid when RX_DV asserted, synchronized with RX_CLK rising edge.
17 VDDIO power_in I/O power supply; accepts 3.3V ±0.3V or 1.8V ±0.18V with appropriate decoupling capacitors.
18 RX_DV/CRS_DV output Receive data valid output in MII mode or combined carrier sense in RMII mode; active high indicating valid data on RX_D.
19 RX_CLK/50MHz_RMII output Receive clock output; provides 25MHz (100Mbps) or 2.5MHz (10Mbps) in MII mode; 50MHz in RMII leader mode.
20 RX_ER output Receive error output; indicates detection of error symbols in received packets, synchronized with RX_CLK rising edge.
21 PWRDN/INT bidirectional Power down input or interrupt output; defaults to power down function with low active signal, configurable to interrupt via register.
22 TX_CLK output Transmit clock output; provides 25MHz (100Mbps) or 2.5MHz (10Mbps) in MII mode with constant phase relative to XI.
23 TX_EN input Transmit enable input; synchronized with TX_CLK rising edge, indicates valid data on TX_D[3:0] (MII) or TX_D[1:0] (RMII).
24 TX_D0 input Transmit data input bit 0; synchronized with TX_CLK rising edge in MII or reference clock rising edge in RMII.
25 TX_D1 input Transmit data input bit 1; synchronized with TX_CLK rising edge in MII or reference clock rising edge in RMII.
26 TX_D2 input Transmit data input bit 2; synchronized with TX_CLK rising edge in MII or reference clock rising edge in RMII.
27 TX_D3 input Transmit data input bit 3; synchronized with TX_CLK rising edge in MII or reference clock rising edge in RMII.
28 COL/LED2/TX_ER/GPIO output Collision detection output in MII (low in full-duplex, high when both TX and RX active in half-duplex); configurable as LED2/TX_ER/GPIO via register.
29 CRS/LED3 output Carrier sense output in MII (high when medium active); configurable as LED3 via register.
30 LED0 output Link status LED output; indicates link status with optional transmit/receive activity blink per register and strap configuration.
31 CLKOUT/LED1 output Clock output (Enhanced Mode default); outputs 25MHz reference from XI at power-up, configurable as LED1 via strap, disabled only in deep power down.
32 RST_N input Active-low reset input with internal pull-up; minimum 25µs pulse triggers device reset and strap re-scan with internal register reset.
33 GND passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Interface
Pins 33

CAD (KiCad official)

  • Symbol: DP83826ERHBT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: dp83826erhbt-etched.step / dp83826erhbt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dp83826erhbt.step / dp83826erhbt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (115 pp, sha256 0ddec6391c36bec1, retrieved 2026-10-01, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF