component
DP83826ERHBR
Public Made by Adomby adom
Texas Instruments Global Sourcing Parts, VQFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDP83826ERHBR
Texas Instruments · Global Sourcing Parts · VQFN-32-EP(5x5)
DP83826ERHBR from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ModeSelect | input | Mode selection pin for enhanced mode (NC or pull high to VDDIO) or basic mode (connect to GND); internal pull-up. |
| 2 | CEXT | passive | External capacitor connection pin; connect 2nF capacitor to GND for PLL stabilization. |
| 3 | VDDA3V3 | power_in | Analog power supply input voltage 3.3V with recommended decoupling capacitors. |
| 4 | RD_M | input | Differential receive input (minus) for 10BASE-Te and 100BASE-TX PMD interface, auto-configurable per selected mode. |
| 5 | RD_P | input | Differential receive input (plus) for 10BASE-Te and 100BASE-TX PMD interface, auto-configurable per selected mode. |
| 6 | TD_M | output | Differential transmit output (minus) for 10BASE-Te and 100BASE-TX PMD interface, auto-configurable per selected mode. |
| 7 | TD_P | output | Differential transmit output (plus) for 10BASE-Te and 100BASE-TX PMD interface, auto-configurable per selected mode. |
| 8 | XO | output | Crystal oscillator output for reference clock; leave floating when CMOS oscillator connected to XI. |
| 9 | XI/50MHzIn | input | Crystal oscillator input; requires 25MHz ±50ppm crystal/oscillator in MII or RMII leader mode, or 50MHz ±50ppm CMOS oscillator in RMII follower mode. |
| 10 | RBIAS | passive | Bias resistor connection to GND with 6.49kΩ ±1% precision value for internal reference. |
| 11 | MDIO | bidirectional | Bidirectional serial management data I/O with 10kΩ internal pull-up; capable of open-drain output for management access. |
| 12 | MDC | input | Management data clock input synchronizing MDIO serial interface; maximum clock rate 25MHz with no minimum rate. |
| 13 | RX_D3 | output | Receive data bit 3 output synchronized to RX_CLK rising edge containing valid data when RX_DV asserted; half-nibble in MII mode or 2-bit in RMII mode. |
| 14 | RX_D2 | output | Receive data bit 2 output synchronized to RX_CLK rising edge containing valid data when RX_DV asserted; half-nibble in MII mode or 2-bit in RMII mode. |
| 15 | RX_D1 | output | Receive data bit 1 output synchronized to RX_CLK rising edge containing valid data when RX_DV asserted; half-nibble in MII mode or 2-bit in RMII mode. |
| 16 | RX_D0 | output | Receive data bit 0 output synchronized to RX_CLK rising edge containing valid data when RX_DV asserted; half-nibble in MII mode or 2-bit in RMII mode. |
| 17 | VDDIO | power_in | I/O power supply input voltage 3.3V or 1.8V with recommended decoupling capacitors. |
| 18 | RX_DV/CRS_DV | output | Receive data valid output in MII mode or combined carrier sense and RX valid (CRS_DV) in RMII mode; indicates valid data on RX_D[3:0] in MII or RX_D[1:0] in RMII. |
| 19 | RX_CLK/50MHz_RMII | output | MII receive clock output at 25MHz for 100Mbps or 2.5MHz for 10Mbps derived from receive data; or 50MHz in RMII leader mode (unused input in RMII follower mode). |
| 20 | RX_ER | output | Receive error output synchronized to RX_CLK in MII mode or reference clock in RMII mode indicating error symbols detected in received packets. |
| 21 | PWRDN/INT | bidirectional | Power down input (default) or interrupt output when configured via register; active-low open-drain output with 9.5kΩ internal pull-up. |
| 22 | TX_CLK | output | MII transmit clock output at 25MHz for 100Mbps or 2.5MHz for 10Mbps with fixed phase to input clock; unused in RMII mode. |
| 23 | TX_EN | input | Transmit enable input appearing on TX_CLK rising edge indicating valid transmit data on TX_D[3:0] in MII or TX_D[1:0] in RMII mode; active-high signal. |
| 24 | TX_D0 | input | Transmit data bit 0 input synchronized to TX_CLK rising edge in MII mode or reference clock edge in RMII mode. |
| 25 | TX_D1 | input | Transmit data bit 1 input synchronized to TX_CLK rising edge in MII mode or reference clock edge in RMII mode. |
| 26 | TX_D2 | input | Transmit data bit 2 input synchronized to TX_CLK rising edge in MII mode or reference clock edge in RMII mode. |
| 27 | TX_D3 | input | Transmit data bit 3 input synchronized to TX_CLK rising edge in MII mode or reference clock edge in RMII mode. |
| 28 | COL/LED2/TX_ER/GPIO | output | Collision detection output (default) asserted in half-duplex when both transmit and receive active, configurable as LED2, MII TX_ER, or GPIO via register. |
| 29 | CRS/LED3 | output | Carrier sense output asserted when transmit or receive medium active in MII mode, configurable as LED3 status output; unused in RMII mode. |
| 30 | LED0 | output | Link status LED output indicating link state with activity blinking when transmitter or receiver active; polarity auto-detected from external pull configuration. |
| 31 | CLKOUT/LED1 | output | 25MHz reference clock output from XI (default after power-on reset) or LED1 output for 100Mbps link indication; clock unaffected by reset, configurable via strap or register. |
| 32 | RST_N | input | Active-low reset input requiring minimum 25µs pulse to force device reset; triggers strap resampling and resets all internal registers to default; internal pull-up. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32-EP(5x5) |
| Category | Global Sourcing Parts |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
DP83826ERHBR - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
dp83826erhbr-etched.step/dp83826erhbr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dp83826erhbr.step/dp83826erhbr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (115 pp, sha256
0ddec6391c36bec1, retrieved 2026-10-01, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).