component
DN1509K1-G
Public Made by Adomby adom
Microchip Tech MOSFETs, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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DN1509K1-G
Microchip Tech · MOSFETs · SOT-23-5
DN1509K1-G from Microchip Tech, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Listed as NC (not connected) in Table 2-1 for the SOT-23 package; the datasheet states no function or limit for this pin. |
| 2 | DRAIN | passive | Drain terminal of the N-channel depletion-mode DMOS FET; drain-to-source breakdown voltage BVDSX is specified at 90 V minimum (VGS = -5 V, ID = 1.0 µA). |
| 3 | NC | unconnected | Listed as NC (not connected) in Table 2-1 for the SOT-23 package; the datasheet states no function or limit for this pin. |
| 4 | SOURCE | passive | Source terminal of the N-channel depletion-mode DMOS FET; saturated drain-to-source current IDSS is specified at 300 mA minimum (VGS = 0 V, VDS = 25 V). |
| 5 | GATE | input | Gate of the FET; gate-to-source voltage is rated ±20 V and gate-to-source off voltage VGS(OFF) is -1.8 V to -3.5 V at ID = 10 µA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOT-23-5 |
| Category | Transistors/Thyristors |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-source breakdown voltage | BVDSX | 90 | V | VGS = -5V, ID = 1.0µA | 3 | ||
| Gate-to-source off voltage | VGS(OFF) | -1.8 | -3.5 | V | ID = 10µA | 3 | |
| VGS(OFF) change with temperature | ∆VGS(OFF) | -4.5 | mV/°C | VDS = 15V, ID= 10µA (Note 2) | 3 | ||
| Gate body leakage | IGSS | 100 | nA | VGS = ±20V, VDS = 0V | 3 | ||
| Drain-to-source leakage current | ID(OFF) | 1 | µA | VDS = BVDSX, VGS = -5.0V | 3 | ||
| Drain-to-source leakage current (VDS = 0.8 BVDSX, TA = 125°C) | ID(OFF) | 1 | mA | VDS = 0.8 BVDSX, VGS = -5.0V, TA= 125°C (Note 2) | 3 | ||
| Saturated drain-to-source current | IDSS | 300 | 540 | mA | VGS = 0V, VDS = 25V | 3 | |
| Static drain-to-source on-state resistance | RDS(ON) | 3.2 | 6 | Ω | VGS = 0V, ID= 200mA | 3 | |
| Change in RDS(ON) with temperature | ∆RDS(ON) | 1.1 | %/°C | VGS = 0V, ID= 200mA (Note 2) | 3 | ||
| Forward transconductance | GFS | 200 | mmho | VDS = 10V, ID= 200mA | 3 | ||
| Input capacitance | CISS | 70 | 150 | pF | VGS = -10V, VDS = 25V, f = 1MHz | 3 | |
| Common source output capacitance | COSS | 20 | 40 | pF | VGS = -10V, VDS = 25V, f = 1MHz | 3 | |
| Reverse transfer capacitance | CRSS | 6 | 15 | pF | VGS = -10V, VDS = 25V, f = 1MHz | 3 | |
| Turn-on delay time | td(ON) | 12 | 30 | ns | VDD = 25V, ID = 100mA, RGEN = 25Ω | 3 | |
| Rise time | tr | 16 | 45 | ns | VDD = 25V, ID = 100mA, RGEN = 25Ω | 3 | |
| Turn-off delay time | td(OFF) | 15 | 45 | ns | VDD = 25V, ID = 100mA, RGEN = 25Ω | 3 | |
| Fall time | tf | 25 | 60 | ns | VDD = 25V, ID = 100mA, RGEN = 25Ω | 3 | |
| Diode forward voltage drop | VSD | 1.8 | V | VGS = -5.0V, ISD= 500mA (Note 1) | 3 | ||
| Gate-to-source voltage | -20 | 20 | V | 3 | |||
| Operating and storage temperature | -55 | 150 | °C | 3 | |||
| Typical thermal resistance, junction to ambient (5-lead SOT-23) | θja | 253 | °C/W | 5-lead SOT-23 package; mounted per Table 1-2 (typical) | 4 | ||
| ID continuous (5-lead SOT-23) | ID | 200 | mA | Continuous; limited by max rated TJ | 4 | ||
| ID pulsed (5-lead SOT-23) | ID | 500 | mA | Pulsed | 4 | ||
| Power dissipation (5-lead SOT-23) | 0.49 | W | @TA = 2.5°C (as printed) | 4 | |||
| IDR (5-lead SOT-23) | IDR | 200 | mA | 4 | |||
| IDRM (5-lead SOT-23) | IDRM | 500 | mA | 4 |
CAD (KiCad official)
- Symbol:
DN1509K1-G - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
dn1509k1-g-etched.step/dn1509k1-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dn1509k1-g.step/dn1509k1-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (12 pp, sha256
4a9f4b9fbcbcca2f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).