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DMP510DLQ-7

Diodes Incorporated · MOSFETs · SOT-23-3

DMP510DLQ-7 from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage is rated at ±30 V, with a gate threshold of -0.8 V to -2.0 V at VDS = VGS, ID = -1 mA.
2 S passive Source; continuous drain current is -196 mA at TA = +25°C and body diode forward current is -196 mA.
3 D passive Drain; drain-source voltage is rated at -50 V, with a pulsed drain current of -1.2 A and RDS(ON) of 9.5 Ω max at VGS = -5 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -50 V VGS = 0V, ID = -250µA 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -50V, VGS = 0V 2
Gate-Source Leakage IGSS 100 nA VGS = 20V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) -0.8 -2 V VDS = VGS, ID = -1mA 2
Static Drain-Source On-Resistance RDS(ON) 1.9 9.5 Ω VGS = -5V, ID = -0.1A 2
Diode Forward Voltage VSD -0.8 -1.4 V VGS = 0V, IS = -115mA 2
Drain-Source Voltage VDSS -50 V 2
Gate-Source Voltage VGSS -30 30 V 2
Continuous Drain Current, steady state ID -196 mA VGS = -5V, TA = +25°C, steady state (Note 6) 2
Continuous Drain Current, steady state ID -156 mA VGS = -5V, TA = +70°C, steady state (Note 6) 2
Maximum Continuous Body Diode Forward Current IS -196 mA Note 6 2
Pulsed Drain Current IDM -1.2 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 0.52 W Note 5, minimum recommended pad layout 2
Total Power Dissipation PD 0.69 W Note 6, 1 inch square copper pad layout 2
Thermal Resistance, Junction to Ambient, steady state RθJA 240 °C/W Note 5, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient, steady state RθJA 180 °C/W Note 6, 1 inch square copper pad layout 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Body Diode Reverse Recovery Charge QRR  16.3  nC IF = -1A, di/dt = 100A/μs Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 2
contacts tin  Terminals: Matte Tin Finish (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DMP510DLQ-7
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: dmp510dlq-7-etched.step / dmp510dlq-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp510dlq-7.step / dmp510dlq-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 09696e1bbca825aa, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF