component
DMP45H4D9HJ3
Public Made by Adomby adom
Diodes Incorporated MOSFETs, TO-251-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownDMP45H4D9HJ3
Diodes Incorporated · MOSFETs · TO-251-3
DMP45H4D9HJ3 from Diodes Incorporated, in a TO-251-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal, with a maximum gate-source voltage of ±30V and a gate threshold of -3.0V to -5.0V at ID = -250µA. |
| 2 | D | passive | Drain terminal (also connected to the tab), rated for VDSS of -450V and continuous drain current of -4.6A at TC = +25°C. |
| 3 | S | passive | Source terminal, with a maximum body diode forward current of -3.0A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TO-251-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -450 | V | TA = +25°C | 2 | ||
| Gate-Source Voltage | VGSS | -30 | 30 | V | TA = +25°C | 2 | |
| Continuous Drain Current | ID | -4.6 | A | VGS = -10V, Steady State, TC = +25°C | 2 | ||
| Continuous Drain Current | ID | -3 | A | VGS = -10V, Steady State, TC = +100°C | 2 | ||
| Maximum Body Diode Forward Current | IS | -3 | A | Note 5 | 2 | ||
| Pulsed Drain Current | IDM | -22.4 | A | 10µs Pulse, Duty Cycle = 1% | 2 | ||
| Avalanche Current | IAS | -2.5 | A | L = 60mH | 2 | ||
| Avalanche Energy | EAS | 187 | mJ | L = 60mH | 2 | ||
| Peak Diode Recovery dv/dt | dv/dt | 50 | V/ns | VDD = -400V, ID = -2.0A | 2 | ||
| Total Power Dissipation | PD | 104 | W | TC = +25°C | 2 | ||
| Total Power Dissipation | PD | 41 | W | TC = +100°C | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 40 | °C/W | Note 6: FR-4, 2oz copper, 1inch square pad | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 1.2 | °C/W | Note 5 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | -450 | V | VGS = 0V, ID = -250µA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -450V, VGS = 0V | 2 | ||
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ±30V, VDS = 0V | 2 | |
| Gate Threshold Voltage | VGS(TH) | -3 | -4 | -5 | V | VDS = VGS, ID = -250µA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | 3.1 | 4.9 | Ω | VGS = -10V, ID = -1.05A | 2 | |
| Diode Forward Voltage | VSD | -1.3 | V | VGS = 0V, IS = -2.1A | 2 | ||
| Input Capacitance | Ciss | 547 | pF | VDS = -25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Output Capacitance | Coss | 74 | pF | VDS = -25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 3.1 | pF | VDS = -25V, VGS = 0V, f = 1.0MHz | 2 | ||
| Total Gate Charge | Qg | 13.7 | nC | VDS = -360V, ID = -2.7A, VGS = -10V | 2 | ||
| Gate-Source Charge | Qgs | 3.4 | nC | VDS = -360V, ID = -2.7A, VGS = -10V | 2 | ||
| Gate-Drain Charge | Qgd | 6 | nC | VDS = -360V, ID = -2.7A, VGS = -10V | 2 | ||
| Turn-On Delay Time | tD(ON) | 19 | ns | VDD = -225V, RG = 3.0Ω, ID = -2.7A | 2 | ||
| Turn-On Rise Time | tR | 40 | ns | VDD = -225V, RG = 3.0Ω, ID = -2.7A | 2 | ||
| Turn-Off Delay Time | tD(OFF) | 32 | ns | VDD = -225V, RG = 3.0Ω, ID = -2.7A | 2 | ||
| Turn-Off Fall Time | tF | 31 | ns | VDD = -225V, RG = 3.0Ω, ID = -2.7A | 2 | ||
| Body Diode Reverse Recovery Time | tRR | 164 | ns | VGS = 0V, VDD = -200V, IS = -2.7A, dI/dt = 100A/μs | 2 | ||
| Body Diode Reverse Recovery Charge | QRR | 1.3 | nC | VGS = 0V, VDD = -200V, IS = -2.7A, dI/dt = 100A/μs | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Connections: See Diagram Terminals: Finish, Matte Tin Annealed over Copper Leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMP45H4D9HJ3 - Footprint:
Package_TO_SOT_THT:TO-251-3_Vertical - 3D model: TO-251-3 (KiCad packages3D, STEP)
- 3D model files:
dmp45h4d9hj3-etched.step/dmp45h4d9hj3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmp45h4d9hj3.step/dmp45h4d9hj3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
06a3703fd375a540, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).