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DMP2900UW-13

Diodes Incorporated · MOSFETs · SOT-323

DMP2900UW-13 from Diodes Incorporated, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate, ESD-protected with an internal gate protection diode; VGSS is limited to ±6 V and VGS(TH) is -0.5 V to -1.0 V.
2 S passive Source of the P-channel MOSFET; the body diode forward current is limited to -0.45 A.
3 D passive Drain of the P-channel MOSFET; VDSS is -20 V and continuous ID is -0.6 A at TA = +25°C (VGS = -4.5 V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-323
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -20 V VGS = 0V, ID = -250μA 2
Zero Gate Voltage Drain Current (TJ = +25°C) IDSS -100 nA VDS = -20V, VGS = 0V 2
Gate-Source Leakage IGSS -2 2 μA VGS = ±4.5V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) -0.5 -1 V VDS = VGS, ID = -250μA 2
Static Drain-Source On-Resistance RDS(ON) 0.75 Ω VGS = -4.5V, ID = -430mA 2
Static Drain-Source On-Resistance RDS(ON) 1.05 Ω VGS = -2.5V, ID = -300mA 2
Static Drain-Source On-Resistance RDS(ON) 1.5 Ω VGS = -1.8V, ID = -150mA 2
Diode Forward Voltage VSD -1.2 V VGS = 0V, IS = -150mA 2
Drain-Source Voltage VDSS -20 V 2
Gate-Source Voltage VGSS -6 6 V 2
Continuous Drain Current (TA = +25°C, steady state) ID -0.6 A VGS = -4.5V, steady state, TA = +25°C 2
Continuous Drain Current (TA = +70°C, steady state) ID -0.5 A VGS = -4.5V, steady state, TA = +70°C 2
Maximum Body Diode Forward Current IS -0.45 A Note 6 2
Pulsed Drain Current IDM -2.5 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 0.3 W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Total Power Dissipation PD 0.5 W Note 6: FR-4 PCB, 2oz copper, 1 inch square copper plate 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 393 °C/W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 272 °C/W Note 6: FR-4 PCB, 2oz copper, 1 inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminal Connections: See Diagram Below  Terminals: Finish, Matte Tin Annealed Over Alloy 42 1

CAD (KiCad official)

  • Symbol: DMP2900UW-13
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: dmp2900uw-13-etched.step / dmp2900uw-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp2900uw-13.step / dmp2900uw-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 03a8e3932e4f657b, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF