component
DMNH6021SK3Q-13
Public Made by Adomby adom
Diodes Incorporated MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
DMNH6021SK3Q-13
Diodes Incorporated · MOSFETs · TO-252
DMNH6021SK3Q-13 from Diodes Incorporated, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage rated ±20 V with threshold VGS(TH) of 1 V to 3 V at 250 µA. |
| 2 | D | passive | Drain (center lead, internally common with the exposed drain tab); VDSS 60 V and continuous ID 50 A at TC = +25°C. |
| 3 | S | passive | Source; maximum body diode forward current IS is 40 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TO-252 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | 50 | A | VGS = 10V, TC = +25°C | 2 | ||
| Continuous Drain Current | ID | 35 | A | VGS = 10V, TC = +100°C | 2 | ||
| Pulsed Drain Current | IDM | 80 | A | 10μs Pulse, Duty Cycle = 1% | 2 | ||
| Maximum Body Diode Forward Current | IS | 40 | A | 2 | |||
| Avalanche Current | IAS | 35 | A | L = 0.1mH | 2 | ||
| Avalanche Energy | EAS | 64 | mJ | L = 0.1mH | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 175 | °C | 2 | ||
| Total Power Dissipation | PD | 2.1 | W | Note 5: FR-4 PC board, minimum recommended pad layout | 2 | ||
| Thermal Resistance, Junction to Ambient Steady State | RJA | 73 | °C/W | Note 5: FR-4 PC board, minimum recommended pad layout | 2 | ||
| Total Power Dissipation | PD | 3.7 | W | Note 6: FR-4 PC board, 2oz copper, 1inch square copper plate | 2 | ||
| Thermal Resistance, Junction to Ambient Steady State | RJA | 40 | °C/W | Note 6: FR-4 PC board, 2oz copper, 1inch square copper plate | 2 | ||
| Thermal Resistance, Junction to Case | RJC | 1.8 | °C/W | Note 7: junction to soldering point (exposed drain pad) | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS = 0V, ID = 250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS = 60V, VGS = 0V | 2 | ||
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ±20V, VDS = 0V | 2 | |
| Gate Threshold Voltage | VGS(TH) | 1 | 3 | V | VDS = VGS, ID = 250μA | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 13 | 23 | mΩ | VGS = 10V, ID = 12A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 18 | 28 | mΩ | VGS = 4.5V, ID = 12A | 2 | |
| Diode Forward Voltage | VSD | 0.75 | 1.2 | V | VGS = 0V, IS = 20A | 2 | |
| Input Capacitance | Ciss | 1143 | pF | VDS = 25V, VGS = 0V, f = 1MHz | 2 | ||
| Output Capacitance | Coss | 168 | pF | VDS = 25V, VGS = 0V, f = 1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 69 | pF | VDS = 25V, VGS = 0V, f = 1MHz | 2 | ||
| Gate Resistance | Rg | 2.5 | Ω | VDS = 0V, VGS = 0V, f = 1MHz | 2 | ||
| Total Gate Charge (VGS = 10V) | Qg | 20.1 | nC | VDS = 30V, ID = 20A | 2 | ||
| Total Gate Charge (VGS = 4.5V) | Qg | 12.1 | nC | VDS = 30V, ID = 20A | 2 | ||
| Gate-Source Charge | Qgs | 4.3 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 5.5 | nC | 2 | |||
| Turn-On Delay Time | tD(ON) | 4.4 | ns | VDD = 30V, VGS = 10V, RG = 4.7Ω, ID = 10A | 2 | ||
| Turn-On Rise Time | tR | 6 | ns | VDD = 30V, VGS = 10V, RG = 4.7Ω, ID = 10A | 2 | ||
| Turn-Off Delay Time | tD(OFF) | 14.2 | ns | VDD = 30V, VGS = 10V, RG = 4.7Ω, ID = 10A | 2 | ||
| Turn-Off Fall Time | tF | 5.4 | ns | VDD = 30V, VGS = 10V, RG = 4.7Ω, ID = 10A | 2 | ||
| Reverse-Recovery Time | tRR | 21.2 | ns | IF = 20A, di/dt = 100A/μs | 2 | ||
| Reverse-Recovery Charge | QRR | 15.2 | nC | IF = 20A, di/dt = 100A/μs | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | • Terminals: Finish, Matte Tin Annealed over Copper Leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMNH6021SK3Q-13 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
dmnh6021sk3q-13-etched.step/dmnh6021sk3q-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmnh6021sk3q-13.step/dmnh6021sk3q-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
bc84eaafc77f1922, retrieved 2026-11-10, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).