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Contents

README

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DMNH4015SSDQ-13

Diodes Incorporated · MOSFETs · SO-8

DMNH4015SSDQ-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 S1 passive Source of N-channel MOSFET 1; the pin 1 corner marker is shown on the top view.
2 G1 input Gate of N-channel MOSFET 1; gate-source voltage is rated ±20 V (VGSS).
3 S2 passive Source of N-channel MOSFET 2.
4 G2 input Gate of N-channel MOSFET 2; gate-source voltage is rated ±20 V (VGSS).
5 D2 passive Drain of N-channel MOSFET 2; drain-source voltage is rated 40 V (VDSS).
6 D2 passive Drain of N-channel MOSFET 2, connected to pin 5; drain-source voltage is rated 40 V (VDSS).
7 D1 passive Drain of N-channel MOSFET 1, connected to pin 8; drain-source voltage is rated 40 V (VDSS).
8 D1 passive Drain of N-channel MOSFET 1; drain-source voltage is rated 40 V (VDSS).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 40 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 40V, VGS = 0V 2
Gate-Source Leakage IGSS 100 nA VGS = ±20V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 1 3 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 10 15 mΩ VGS = 10V, ID = 12A 2
Static Drain-Source On-Resistance RDS(ON) 12 20 mΩ VGS = 4.5V, ID = 10A 2
Diode Forward Voltage VSD 0.7 1 V VGS = 0V, IS = 1A 2
Gate Resistance RG 1.8 3.2 Ω VDS = 0V, VGS = 0V, f = 1.0MHz 2
Drain-Source Voltage VDSS 40 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current, steady state ID 8.6 A VGS = 10V, steady state, TA = +25°C (Note 7) 2
Continuous Drain Current, steady state ID 6.9 A VGS = 10V, steady state, TA = +70°C (Note 7) 2
Continuous Drain Current, t<10s ID 11 A VGS = 10V, t<10s, TA = +25°C (Note 7) 2
Continuous Drain Current, t<10s ID 8.8 A VGS = 10V, t<10s, TA = +70°C (Note 7) 2
Maximum Body Diode Forward Current IS 2.2 A Note 7 2
Pulsed Drain Current IDM 80 A 380µs pulse, duty cycle = 1% 2
Avalanche Current IAS 25 A L = 0.1mH (Note 8) 2
Avalanche Energy EAS 33 mJ L = 0.1mH (Note 8) 2
Total Power Dissipation PD 1.4 W TA = +25°C (Note 6) 2
Total Power Dissipation PD 0.9 W TA = +70°C (Note 6) 2
Total Power Dissipation PD 2 W TA = +25°C (Note 7) 2
Total Power Dissipation PD 1.2 W TA = +70°C (Note 7) 2
Thermal Resistance, Junction to Ambient, steady state RθJA 111 °C/W Steady state (Note 6) 2
Thermal Resistance, Junction to Ambient, t<10s RθJA 66 °C/W t<10s (Note 6) 2
Thermal Resistance, Junction to Ambient, steady state RθJA 75 °C/W Steady state (Note 7) 2
Thermal Resistance, Junction to Ambient, t<10s RθJA 45 °C/W t<10s (Note 7) 2
Thermal Resistance, Junction to Case RθJC 10.4 °C/W Note 7 2
Operating and Storage Temperature Range TJ, TSTG -55 175 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Body Diode Reverse Recovery Charge Qrr  7.6  nC Notes: 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 2
contacts Copper tin  Terminal Connections: See Diagram  Terminals: Finish, Tin Finish Annealed over Copper Leadframe. 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: DMNH4015SSDQ-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8, generated on the KiCad land (body 3.85 x 4.9 mm, terminals on the pads, 1.45 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: dmnh4015ssdq-13-etched.step / dmnh4015ssdq-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmnh4015ssdq-13.step / dmnh4015ssdq-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 26df6079dd94f224, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF