component
DMN6068LK3-13
Public Made by Adomby adom
Diodes Incorporated MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownDMN6068LK3-13
Diodes Incorporated · MOSFETs · TO-252
DMN6068LK3-13 from Diodes Incorporated, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET, rated for a gate-source voltage of ±20V maximum (±16V maximum for AEC-Q101 qualified parts per Note 5), with VGS(th) of 1.0 to 3.0 V at ID = 250µA. |
| 2 | D | passive | Drain of the MOSFET, rated for a drain-source voltage of 60V (VDSS) and a continuous drain current of 8.5A at VGS = 10V, TA = +25°C; the drain is also connected to the metal tab. |
| 3 | S | passive | Source of the MOSFET, with a continuous body-diode source current of 10.2A and a pulsed body-diode source current of 22.2A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | ID = 250µA, VGS= 0V | 4 | ||
| Zero Gate Voltage Drain Current | IDSS | 0.5 | µA | VDS= 60V, VGS= 0V | 4 | ||
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS= ±20V, VDS= 0V | 4 | |
| Gate Threshold Voltage | VGS(th) | 1 | 3 | V | ID= 250µA, VDS= VGS | 4 | |
| Static Drain-Source On-Resistance | RDS(ON) | 0.068 | Ω | VGS= 10V, ID= 12A | 4 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 0.1 | Ω | VGS= 4.5V, ID= 6A | 4 | ||
| Diode Forward Voltage | VSD | 0.98 | 1.15 | V | IS= 12A, VGS= 0V | 4 | |
| Drain-Source voltage | VDSS | 60 | V | 2 | |||
| Gate-Source voltage | VGS | -20 | 20 | V | 2 | ||
| Single Pulsed Avalanche Energy | EAS | 37.5 | mJ | Note 11: L=3.0mH, IAS=5.0A, RG=25Ω, VDD=50V, starting TJ=25°C | 2 | ||
| Single Pulsed Avalanche Current | IAS | 5 | A | Note 11: L=3.0mH, RG=25Ω, VDD=50V, starting TJ=25°C | 2 | ||
| Continuous Drain current | ID | 8.5 | A | VGS = 10V, Note 7 (t ≤ 10 s) | 2 | ||
| Continuous Drain current at TA = 70°C | ID | 6.8 | A | VGS = 10V, TA = 70°C, Note 7 | 2 | ||
| Continuous Drain current | ID | 6 | A | VGS = 10V, Note 6 (steady state, 50mm x 50mm 2oz FR4) | 2 | ||
| Pulsed Drain current | IDM | 22.2 | A | VGS= 10V, Note 8 (D=0.02, pulse width 300 µs) | 2 | ||
| Continuous Source current (Body diode) | IS | 10.2 | A | Note 7 | 2 | ||
| Pulsed Source current (Body diode) | ISM | 22.2 | A | Note 8 | 2 | ||
| Operating and storage temperature range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Power dissipation | PD | 4.12 | W | Note 6 (50mm x 50mm 2oz FR4, steady state) | 2 | ||
| Power dissipation | PD | 8.49 | W | Note 7 (t ≤ 10 s) | 2 | ||
| Power dissipation | PD | 2.12 | W | Note 9 (25mm x 25mm 1oz FR4, steady state) | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 30.3 | °C/W | Note 6 (50mm x 50mm 2oz FR4, steady state) | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 14.7 | °C/W | Note 7 (t ≤ 10 s) | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 59 | °C/W | Note 9 (25mm x 25mm 1oz FR4, steady state) | 2 | ||
| Thermal Resistance, Junction to Lead | RθJL | 3.09 | °C/W | Note 10 (junction to solder point at end of drain lead) | 2 | ||
| Linear derating factor | 33 | mW/°C | Note 6 | 2 | |||
| Linear derating factor | 67.9 | mW/°C | Note 7 | 2 | |||
| Linear derating factor | 16.9 | mW/°C | Note 9 | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | • Terminals Connections: See Diagram • Terminals: Matte Tin Finish annealed over Copper leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMN6068LK3-13 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
dmn6068lk3-13-etched.step/dmn6068lk3-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmn6068lk3-13.step/dmn6068lk3-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (8 pp, sha256
83b003caa897c0f6, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).