component
DMN6066SSD-13
Public Made by Adomby adom
Diodes Incorporated MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DMN6066SSD-13
Diodes Incorporated · MOSFETs · SO-8
DMN6066SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (N-channel). |
| 2 | G1 | input | Gate of MOSFET 1; VGS maximum is 20V, threshold 1.0V to 3.0V. |
| 3 | S2 | passive | Source of MOSFET 2 (N-channel). |
| 4 | G2 | input | Gate of MOSFET 2; VGS maximum is 20V, threshold 1.0V to 3.0V. |
| 5 | D2 | passive | Drain of MOSFET 2; VDSS is 60V. |
| 6 | D2 | passive | Drain of MOSFET 2; VDSS is 60V, connected with pin 5. |
| 7 | D1 | passive | Drain of MOSFET 1; VDSS is 60V. |
| 8 | D1 | passive | Drain of MOSFET 1; VDSS is 60V, connected with pin 7. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | 2 | |||
| Gate-Source Voltage | VGS | 20 | V | Note 5 | 2 | ||
| Single Pulsed Avalanche Energy | EAS | 37.5 | mJ | Note 12 | 2 | ||
| Single Pulsed Avalanche Current | IAS | 5 | A | Note 12 | 2 | ||
| Continuous Drain Current | ID | 4.4 | A | VGS = 10V, Note 8 | 2 | ||
| Continuous Drain Current | ID | 3.5 | A | TA = +70°C, Note 8 | 2 | ||
| Continuous Drain Current | ID | 3.3 | A | Note 6 | 2 | ||
| Pulsed Drain Current | IDM | 17 | A | VGS = 10V, Note 8 | 2 | ||
| Continuous Source Current (Body Diode) | IS | 3.2 | A | Note 7 | 2 | ||
| Pulsed Source Current (Body Diode) | ISM | 17 | A | Note 7 | 2 | ||
| Power Dissipation | PD | 1.25 | W | Notes 6 & 9 | 2 | ||
| Power Dissipation | PD | 1.8 | W | Notes 6 & 10 | 2 | ||
| Power Dissipation | PD | 2.14 | W | Notes 7 & 9 | 2 | ||
| Thermal Resistance, Junction to Ambient | RJA | 100 | °C/W | Notes 6 & 9 | 2 | ||
| Thermal Resistance, Junction to Ambient | RJA | 70 | °C/W | Notes 6 & 10 | 2 | ||
| Thermal Resistance, Junction to Ambient | RJA | 58 | °C/W | Notes 7 & 9 | 2 | ||
| Thermal Resistance, Junction to Lead | RJL | 55 | °C/W | Notes 9 & 11 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | ID = 250µA, VGS = 0V | 4 | ||
| Zero Gate Voltage Drain Current | IDSS | 0.5 | µA | VDS = 60V, VGS = 0V | 4 | ||
| Gate-Source Leakage | IGSS | 100 | nA | VGS = 20V, VDS = 0V | 4 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 3 | V | ID = 250µA, VDS = VGS | 4 | |
| Static Drain-Source On-Resistance | RDS(ON) | 48 | 66 | mΩ | VGS = 10V, ID = 4.5A | 4 | |
| Static Drain-Source On-Resistance | RDS(ON) | 68 | 97 | mΩ | VGS = 4.5V, ID = 3.5A | 4 | |
| Diode Forward Voltage | VSD | 0.89 | 1.15 | V | IS = 4.5A, VGS = 0V | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | • Terminals Connections: See Diagram Below • Terminals: Finish - Matte Tin Annealed over Copper Leadframe. | 1 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
DMN6066SSD-13 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8, generated on the KiCad land (body 3.85 x 4.9 mm, terminals on the pads, 1.45 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
dmn6066ssd-13-etched.step/dmn6066ssd-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmn6066ssd-13.step/dmn6066ssd-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (9 pp, sha256
8ef6ed15bb0cf2e4, retrieved 2026-11-13, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
# DMN6066SSD-13
**Diodes Incorporated** · MOSFETs · SO-8
DMN6066SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (N-channel). |
| 2 | G1 | input | Gate of MOSFET 1; VGS maximum is 20V, threshold 1.0V to 3.0V. |
| 3 | S2 | passive | Source of MOSFET 2 (N-channel). |
| 4 | G2 | input | Gate of MOSFET 2; VGS maximum is 20V, threshold 1.0V to 3.0V. |
| 5 | D2 | passive | Drain of MOSFET 2; VDSS is 60V. |
| 6 | D2 | passive | Drain of MOSFET 2; VDSS is 60V, connected with pin 5. |
| 7 | D1 | passive | Drain of MOSFET 1; VDSS is 60V. |
| 8 | D1 | passive | Drain of MOSFET 1; VDSS is 60V, connected with pin 7. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 60 | V | | 2 |
| Gate-Source Voltage | VGS | | | 20 | V | Note 5 | 2 |
| Single Pulsed Avalanche Energy | EAS | | | 37.5 | mJ | Note 12 | 2 |
| Single Pulsed Avalanche Current | IAS | | | 5 | A | Note 12 | 2 |
| Continuous Drain Current | ID | | | 4.4 | A | VGS = 10V, Note 8 | 2 |
| Continuous Drain Current | ID | | | 3.5 | A | TA = +70°C, Note 8 | 2 |
| Continuous Drain Current | ID | | | 3.3 | A | Note 6 | 2 |
| Pulsed Drain Current | IDM | | | 17 | A | VGS = 10V, Note 8 | 2 |
| Continuous Source Current (Body Diode) | IS | | | 3.2 | A | Note 7 | 2 |
| Pulsed Source Current (Body Diode) | ISM | | | 17 | A | Note 7 | 2 |
| Power Dissipation | PD | | | 1.25 | W | Notes 6 & 9 | 2 |
| Power Dissipation | PD | | | 1.8 | W | Notes 6 & 10 | 2 |
| Power Dissipation | PD | | | 2.14 | W | Notes 7 & 9 | 2 |
| Thermal Resistance, Junction to Ambient | RJA | | | 100 | °C/W | Notes 6 & 9 | 2 |
| Thermal Resistance, Junction to Ambient | RJA | | | 70 | °C/W | Notes 6 & 10 | 2 |
| Thermal Resistance, Junction to Ambient | RJA | | | 58 | °C/W | Notes 7 & 9 | 2 |
| Thermal Resistance, Junction to Lead | RJL | | | 55 | °C/W | Notes 9 & 11 | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 60 | | | V | ID = 250µA, VGS = 0V | 4 |
| Zero Gate Voltage Drain Current | IDSS | | | 0.5 | µA | VDS = 60V, VGS = 0V | 4 |
| Gate-Source Leakage | IGSS | | | 100 | nA | VGS = 20V, VDS = 0V | 4 |
| Gate Threshold Voltage | VGS(th) | 1 | | 3 | V | ID = 250µA, VDS = VGS | 4 |
| Static Drain-Source On-Resistance | RDS(ON) | | 48 | 66 | mΩ | VGS = 10V, ID = 4.5A | 4 |
| Static Drain-Source On-Resistance | RDS(ON) | | 68 | 97 | mΩ | VGS = 4.5V, ID = 3.5A | 4 |
| Diode Forward Voltage | VSD | | 0.89 | 1.15 | V | IS = 4.5A, VGS = 0V | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | • Terminals Connections: See Diagram Below • Terminals: Finish - Matte Tin Annealed over Copper Leadframe. | 1 |
## CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol: `DMN6066SSD-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8, generated on the KiCad land (body 3.85 x 4.9 mm, terminals on the pads, 1.45 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files: `dmn6066ssd-13-etched.step` / `dmn6066ssd-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmn6066ssd-13.step` / `dmn6066ssd-13.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/DMN6066SSD-13.pdf) (9 pp, sha256 `8ef6ed15bb0cf2e4`, retrieved 2026-11-13, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
[Datasheet PDF](docs/dmn6066ssd-13-datasheet.pdf)