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DMN6066SSD-13

Diodes Incorporated · MOSFETs · SO-8

DMN6066SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (N-channel).
2 G1 input Gate of MOSFET 1; VGS maximum is 20V, threshold 1.0V to 3.0V.
3 S2 passive Source of MOSFET 2 (N-channel).
4 G2 input Gate of MOSFET 2; VGS maximum is 20V, threshold 1.0V to 3.0V.
5 D2 passive Drain of MOSFET 2; VDSS is 60V.
6 D2 passive Drain of MOSFET 2; VDSS is 60V, connected with pin 5.
7 D1 passive Drain of MOSFET 1; VDSS is 60V.
8 D1 passive Drain of MOSFET 1; VDSS is 60V, connected with pin 7.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Transistors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 60 V 2
Gate-Source Voltage VGS 20 V Note 5 2
Single Pulsed Avalanche Energy EAS 37.5 mJ Note 12 2
Single Pulsed Avalanche Current IAS 5 A Note 12 2
Continuous Drain Current ID 4.4 A VGS = 10V, Note 8 2
Continuous Drain Current ID 3.5 A TA = +70°C, Note 8 2
Continuous Drain Current ID 3.3 A Note 6 2
Pulsed Drain Current IDM 17 A VGS = 10V, Note 8 2
Continuous Source Current (Body Diode) IS 3.2 A Note 7 2
Pulsed Source Current (Body Diode) ISM 17 A Note 7 2
Power Dissipation PD 1.25 W Notes 6 & 9 2
Power Dissipation PD 1.8 W Notes 6 & 10 2
Power Dissipation PD 2.14 W Notes 7 & 9 2
Thermal Resistance, Junction to Ambient RJA 100 °C/W Notes 6 & 9 2
Thermal Resistance, Junction to Ambient RJA 70 °C/W Notes 6 & 10 2
Thermal Resistance, Junction to Ambient RJA 58 °C/W Notes 7 & 9 2
Thermal Resistance, Junction to Lead RJL 55 °C/W Notes 9 & 11 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage BVDSS 60 V ID = 250µA, VGS = 0V 4
Zero Gate Voltage Drain Current IDSS 0.5 µA VDS = 60V, VGS = 0V 4
Gate-Source Leakage IGSS 100 nA VGS = 20V, VDS = 0V 4
Gate Threshold Voltage VGS(th) 1 3 V ID = 250µA, VDS = VGS 4
Static Drain-Source On-Resistance RDS(ON) 48 66 mΩ VGS = 10V, ID = 4.5A 4
Static Drain-Source On-Resistance RDS(ON) 68 97 mΩ VGS = 4.5V, ID = 3.5A 4
Diode Forward Voltage VSD 0.89 1.15 V IS = 4.5A, VGS = 0V 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminals Connections: See Diagram Below • Terminals: Finish - Matte Tin Annealed over Copper Leadframe. 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: DMN6066SSD-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8, generated on the KiCad land (body 3.85 x 4.9 mm, terminals on the pads, 1.45 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: dmn6066ssd-13-etched.step / dmn6066ssd-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn6066ssd-13.step / dmn6066ssd-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (9 pp, sha256 8ef6ed15bb0cf2e4, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF