component
DMN6040SVT-7
Public Made by Adomby adom
Diodes Incorporated MOSFETs, TSOT-26. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DMN6040SVT-7
Diodes Incorporated · MOSFETs · TSOT-26
DMN6040SVT-7 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain terminal, internally common with pins 2, 5 and 6; the device is rated for VDSS of 60V. |
| 2 | D | passive | Drain terminal, internally common with pins 1, 5 and 6; continuous drain current is 5.0A at VGS = 10V, TA = 25°C. |
| 3 | G | input | Gate terminal with a gate-source voltage rating of ±20V and a threshold voltage of 1V to 3V. |
| 4 | S | passive | Source terminal, connected to the body diode, which has a maximum forward current of 2.1A. |
| 5 | D | passive | Drain terminal, internally common with pins 1, 2 and 6; pulsed drain current is 30A. |
| 6 | D | passive | Drain terminal, internally common with pins 1, 2 and 5; RDS(on) is 44mΩ max at VGS = 10V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-26 |
| Category | Transistors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | TA = 25°C | 2 | ||
| Gate-Source Voltage | VGSS | -20 | 20 | V | TA = 25°C | 2 | |
| Continuous Drain Current, steady state | ID | 5 | A | VGS = 10V, TA = 25°C, Note 5 | 2 | ||
| Continuous Drain Current, steady state | ID | 4 | A | VGS = 10V, TA = 70°C, Note 5 | 2 | ||
| Continuous Drain Current, t<10s | ID | 6.3 | A | VGS = 10V, TA = 25°C, Note 5 | 2 | ||
| Continuous Drain Current, t<10s | ID | 5 | A | VGS = 10V, TA = 70°C, Note 5 | 2 | ||
| Continuous Drain Current, steady state | ID | 4.3 | A | VGS = 5V, TA = 25°C, Note 5 | 2 | ||
| Continuous Drain Current, steady state | ID | 3.4 | A | VGS = 5V, TA = 70°C, Note 5 | 2 | ||
| Continuous Drain Current, t<10s | ID | 5.4 | A | VGS = 5V, TA = 25°C, Note 5 | 2 | ||
| Continuous Drain Current, t<10s | ID | 4.3 | A | VGS = 5V, TA = 70°C, Note 5 | 2 | ||
| Maximum Body Diode Forward Current | IS | 2.1 | A | Note 5 | 2 | ||
| Pulsed Drain Current | IDM | 30 | A | 10μs pulse, duty cycle = 1% | 2 | ||
| Avalanche Current | IAR | 14.2 | A | L = 0.1mH, Note 6 | 2 | ||
| Avalanche Energy | EAR | 10 | mJ | L = 0.1mH, Note 6 | 2 | ||
| Total Power Dissipation | PD | 1.2 | W | TA = 25°C, Note 4 | 2 | ||
| Total Power Dissipation | PD | 0.75 | W | TA = 70°C, Note 4 | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state | RθJA | 106 | °C/W | Steady state, Note 4 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | 69 | °C/W | t<10s, Note 4 | 2 | ||
| Total Power Dissipation | PD | 1.8 | W | TA = 25°C, Note 5 | 2 | ||
| Total Power Dissipation | PD | 1.1 | W | TA = 70°C, Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state | RθJA | 68 | °C/W | Steady state, Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | 44 | °C/W | t<10s, Note 5 | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 20 | °C/W | Note 5 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS = 0V, ID = 250μA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 100 | nA | VDS = 60V, VGS = 0V | 3 | ||
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ±20V, VDS = 0V | 3 | |
| Gate Threshold Voltage | VGS(th) | 1 | 3 | V | VDS = VGS, ID = 250μA | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 30 | 44 | mΩ | VGS = 10V, ID = 4.3A | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 35 | 60 | mΩ | VGS = 4.5V, ID = 4A | 3 | |
| Diode Forward Voltage | VSD | 0.7 | 1.2 | V | VGS = 0V, IS = 1A | 3 | |
| Forward Transfer Admittance | /Yfs/ | 4.5 | S | VDS = 10V, ID = 4.3A | 3 | ||
| Input Capacitance | Ciss | 1287 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 | ||
| Output Capacitance | Coss | 57 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 44 | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 | ||
| Gate Resistance | RG | 1.2 | Ω | VDS = 0V, VGS = 0V, f = 1.0MHz | 3 | ||
| Total Gate Charge (VGS = 10V) | Qg | 22.4 | nC | VDS = 30V, ID = 4.3A | 3 | ||
| Total Gate Charge (VGS = 4.5V) | Qg | 10.4 | nC | VDS = 30V, ID = 4.3A | 3 | ||
| Gate-Source Charge | Qgs | 4.9 | nC | VDS = 30V, ID = 4.3A | 3 | ||
| Gate-Drain Charge | Qgd | 3 | nC | VDS = 30V, ID = 4.3A | 3 | ||
| Turn-On Delay Time | tD(on) | 6.6 | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 | ||
| Turn-On Rise Time | tr | 8.1 | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 | ||
| Turn-Off Delay Time | tD(off) | 20.1 | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 | ||
| Turn-Off Fall Time | tf | 4 | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 | ||
| Body Diode Reverse Recovery Time | trr | 18 | nS | IS = 4.3A, dI/dt = 100A/μs | 3 | ||
| Body Diode Reverse Recovery Charge | Qrr | 11.9 | nC | IS = 4.3A, dI/dt = 100A/μs | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | Body Diode Reverse Recovery Charge Qrr ⎯ 11.9 ⎯ nC IS = 4.3A, dI/dt = 100A/μs Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. | 3 | |
| contacts | Copper | tin | • Terminal Connections: See Diagram • Terminals: Finish, Tin Finish annealed over Copper leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMN6040SVT-7 - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-26 (KiCad packages3D, STEP)
- 3D model files:
dmn6040svt-7-etched.step/dmn6040svt-7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmn6040svt-7.step/dmn6040svt-7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
e2b418f9fcd72d98, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DMN6040SVT-7
**Diodes Incorporated** · MOSFETs · TSOT-26
DMN6040SVT-7 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain terminal, internally common with pins 2, 5 and 6; the device is rated for VDSS of 60V. |
| 2 | D | passive | Drain terminal, internally common with pins 1, 5 and 6; continuous drain current is 5.0A at VGS = 10V, TA = 25°C. |
| 3 | G | input | Gate terminal with a gate-source voltage rating of ±20V and a threshold voltage of 1V to 3V. |
| 4 | S | passive | Source terminal, connected to the body diode, which has a maximum forward current of 2.1A. |
| 5 | D | passive | Drain terminal, internally common with pins 1, 2 and 6; pulsed drain current is 30A. |
| 6 | D | passive | Drain terminal, internally common with pins 1, 2 and 5; RDS(on) is 44mΩ max at VGS = 10V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-26 |
| Category | Transistors |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 60 | V | TA = 25°C | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | TA = 25°C | 2 |
| Continuous Drain Current, steady state | ID | | | 5 | A | VGS = 10V, TA = 25°C, Note 5 | 2 |
| Continuous Drain Current, steady state | ID | | | 4 | A | VGS = 10V, TA = 70°C, Note 5 | 2 |
| Continuous Drain Current, t<10s | ID | | | 6.3 | A | VGS = 10V, TA = 25°C, Note 5 | 2 |
| Continuous Drain Current, t<10s | ID | | | 5 | A | VGS = 10V, TA = 70°C, Note 5 | 2 |
| Continuous Drain Current, steady state | ID | | | 4.3 | A | VGS = 5V, TA = 25°C, Note 5 | 2 |
| Continuous Drain Current, steady state | ID | | | 3.4 | A | VGS = 5V, TA = 70°C, Note 5 | 2 |
| Continuous Drain Current, t<10s | ID | | | 5.4 | A | VGS = 5V, TA = 25°C, Note 5 | 2 |
| Continuous Drain Current, t<10s | ID | | | 4.3 | A | VGS = 5V, TA = 70°C, Note 5 | 2 |
| Maximum Body Diode Forward Current | IS | | | 2.1 | A | Note 5 | 2 |
| Pulsed Drain Current | IDM | | | 30 | A | 10μs pulse, duty cycle = 1% | 2 |
| Avalanche Current | IAR | | | 14.2 | A | L = 0.1mH, Note 6 | 2 |
| Avalanche Energy | EAR | | | 10 | mJ | L = 0.1mH, Note 6 | 2 |
| Total Power Dissipation | PD | | | 1.2 | W | TA = 25°C, Note 4 | 2 |
| Total Power Dissipation | PD | | | 0.75 | W | TA = 70°C, Note 4 | 2 |
| Thermal Resistance, Junction to Ambient, steady state | RθJA | | 106 | | °C/W | Steady state, Note 4 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | | 69 | | °C/W | t<10s, Note 4 | 2 |
| Total Power Dissipation | PD | | | 1.8 | W | TA = 25°C, Note 5 | 2 |
| Total Power Dissipation | PD | | | 1.1 | W | TA = 70°C, Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, steady state | RθJA | | 68 | | °C/W | Steady state, Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | | 44 | | °C/W | t<10s, Note 5 | 2 |
| Thermal Resistance, Junction to Case | RθJC | | 20 | | °C/W | Note 5 | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 60 | | | V | VGS = 0V, ID = 250μA | 3 |
| Zero Gate Voltage Drain Current | IDSS | | | 100 | nA | VDS = 60V, VGS = 0V | 3 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VGS = ±20V, VDS = 0V | 3 |
| Gate Threshold Voltage | VGS(th) | 1 | | 3 | V | VDS = VGS, ID = 250μA | 3 |
| Static Drain-Source On-Resistance | RDS(ON) | | 30 | 44 | mΩ | VGS = 10V, ID = 4.3A | 3 |
| Static Drain-Source On-Resistance | RDS(ON) | | 35 | 60 | mΩ | VGS = 4.5V, ID = 4A | 3 |
| Diode Forward Voltage | VSD | | 0.7 | 1.2 | V | VGS = 0V, IS = 1A | 3 |
| Forward Transfer Admittance | /Yfs/ | | 4.5 | | S | VDS = 10V, ID = 4.3A | 3 |
| Input Capacitance | Ciss | | 1287 | | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 |
| Output Capacitance | Coss | | 57 | | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 |
| Reverse Transfer Capacitance | Crss | | 44 | | pF | VDS = 25V, VGS = 0V, f = 1.0MHz | 3 |
| Gate Resistance | RG | | 1.2 | | Ω | VDS = 0V, VGS = 0V, f = 1.0MHz | 3 |
| Total Gate Charge (VGS = 10V) | Qg | | 22.4 | | nC | VDS = 30V, ID = 4.3A | 3 |
| Total Gate Charge (VGS = 4.5V) | Qg | | 10.4 | | nC | VDS = 30V, ID = 4.3A | 3 |
| Gate-Source Charge | Qgs | | 4.9 | | nC | VDS = 30V, ID = 4.3A | 3 |
| Gate-Drain Charge | Qgd | | 3 | | nC | VDS = 30V, ID = 4.3A | 3 |
| Turn-On Delay Time | tD(on) | | 6.6 | | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 |
| Turn-On Rise Time | tr | | 8.1 | | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 |
| Turn-Off Delay Time | tD(off) | | 20.1 | | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 |
| Turn-Off Fall Time | tf | | 4 | | nS | VGS = 10V, VDD = 30V, RG = 6Ω, ID = 4.3A | 3 |
| Body Diode Reverse Recovery Time | trr | | 18 | | nS | IS = 4.3A, dI/dt = 100A/μs | 3 |
| Body Diode Reverse Recovery Charge | Qrr | | 11.9 | | nC | IS = 4.3A, dI/dt = 100A/μs | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | | Body Diode Reverse Recovery Charge Qrr ⎯ 11.9 ⎯ nC IS = 4.3A, dI/dt = 100A/μs Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. | 3 |
| contacts | Copper | tin | • Terminal Connections: See Diagram • Terminals: Finish, Tin Finish annealed over Copper leadframe. | 1 |
## CAD (KiCad official)
- Symbol: `DMN6040SVT-7`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-6`
- 3D model: TSOT-26 (KiCad packages3D, STEP)
- 3D model files: `dmn6040svt-7-etched.step` / `dmn6040svt-7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmn6040svt-7.step` / `dmn6040svt-7.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/DMN6040SVT-7.pdf) (7 pp, sha256 `e2b418f9fcd72d98`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dmn6040svt-7-datasheet.pdf)