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Contents

README

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DMN3401LDW-13

Diodes Incorporated · MOSFETs · SOT-363

DMN3401LDW-13 from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of Q1 N-channel MOSFET, with body diode to D1; VDSS 30V.
2 G1 input Gate of Q1 with integrated gate protection diode; VGSS ±20V, threshold 0.8V to 1.6V.
3 D2 passive Drain of Q2 N-channel MOSFET; VDSS 30V, ID 0.8A continuous at TA=+25°C.
4 S2 passive Source of Q2 N-channel MOSFET, with body diode to D2; VDSS 30V.
5 G2 input Gate of Q2 with integrated gate protection diode; VGSS ±20V, threshold 0.8V to 1.6V.
6 D1 passive Drain of Q1 N-channel MOSFET; VDSS 30V, ID 0.8A continuous at TA=+25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Triode/MOS Tube/Transistor
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 30 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current ID 0.8 A VGS = 10V, steady state, TA = +25°C 2
Continuous Drain Current ID 0.6 A VGS = 10V, steady state, TA = +70°C 2
Maximum Continuous Body Diode Forward Current IS 0.4 A Note 6 2
Pulsed Drain Current IDM 4 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 0.29 W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 433 °C/W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Total Power Dissipation PD 0.35 W Note 6: FR-4 PCB, 2oz copper, with 1 inch square copper plate 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 360 °C/W Note 6: FR-4 PCB, 2oz copper, with 1 inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS = 30V, VGS = 0V 2
Gate-Source Leakage IGSS -10 10 μA VGS = ±20V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.8 1.2 1.6 V VDS = VGS, ID = 250μA 2
Static Drain-Source On-Resistance RDS(ON) 0.2 0.4 Ω VGS = 10V, ID = 0.59A 2
Static Drain-Source On-Resistance RDS(ON) 0.3 0.7 Ω VGS = 4.5V, ID = 0.2A 2
Diode Forward Voltage VSD 0.7 1.2 V VGS = 0V, IS = 10mA 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminal Connections Indicator: See Diagram • Terminals: Finish  Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMN3401LDW-13
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: dmn3401ldw-13-etched.step / dmn3401ldw-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn3401ldw-13.step / dmn3401ldw-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 e9d7706f46c140ec, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF