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DMN3018SSD-13
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Diodes Incorporated MOSFETs, SO-8. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
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DMN3018SSD-13
Diodes Incorporated · MOSFETs · SO-8
DMN3018SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S2 | passive | Source of MOSFET element 2 (N-channel, 30V VDSS). |
| 2 | G2 | input | Gate of MOSFET element 2, ESD protected with gate protection diode, VGSS ±20V. |
| 3 | S1 | passive | Source of MOSFET element 1 (N-channel, 30V VDSS). |
| 4 | G1 | input | Gate of MOSFET element 1, ESD protected with gate protection diode, VGSS ±20V. |
| 5 | D1 | passive | Drain of MOSFET element 1, connected to pin 6; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 6 | D1 | passive | Drain of MOSFET element 1, connected to pin 5; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 7 | D2 | passive | Drain of MOSFET element 2, connected to pin 8; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 8 | D2 | passive | Drain of MOSFET element 2, connected to pin 7; 30V VDSS, 6.7A continuous at TA=+25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 30 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | 6.7 | A | VGS = 10V, Steady State, TA = +25°C | 2 | ||
| Continuous Drain Current | ID | 5.3 | A | VGS = 10V, Steady State, TA = +70°C | 2 | ||
| Continuous Drain Current | ID | 8.7 | A | VGS = 10V, t < 10s, TA = +25°C | 2 | ||
| Continuous Drain Current | ID | 6.9 | A | VGS = 10V, t < 10s, TA = +70°C | 2 | ||
| Pulsed Drain Current | IDM | 60 | A | 10µs Pulse, Duty Cycle = 1% | 2 | ||
| Maximum Body Diode Continuous Current | IS | 2 | A | 2 | |||
| Avalanche Current | IAR | 19 | A | L = 0.1mH | 2 | ||
| Repetitive Avalanche Energy | EAR | 18 | mJ | L = 0.1mH | 2 | ||
| Total Power Dissipation | PD | 1.5 | W | Note 5 (FR-4, 2oz copper, 1 inch square copper plate) | 2 | ||
| Thermal Resistance, Junction to Ambient (steady state) | RθJA | 83 | °C/W | Steady State, Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient (t < 10s) | RθJA | 50 | °C/W | t < 10s, Note 5 | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 14.5 | °C/W | Note 5 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS = 0V, ID = 250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS = 24V, VGS = 0V | 2 | ||
| Gate-Source Leakage | IGSS | -10 | 10 | μA | VGS = ±20V, VDS = 0V | 2 | |
| Gate Threshold Voltage | VGS(TH) | 1 | 1.7 | 2.1 | V | VDS = VGS, ID = 250μA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | 16 | 22 | mΩ | VGS = 10V, ID = 10A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 23 | 30 | mΩ | VGS = 4.5V, ID = 6A | 2 | |
| Diode Forward Voltage | VSD | 0.5 | 1.2 | V | VGS = 0V, IS = 1A | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Connections Indicator: See Diagram Terminals: Finish Matte Tin Annealed over Copper Leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMN3018SSD-13 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
dmn3018ssd-13-etched.step/dmn3018ssd-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmn3018ssd-13.step/dmn3018ssd-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (6 pp, sha256
d5f56e135460a926, retrieved 2026-10-21, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DMN3018SSD-13
**Diodes Incorporated** · MOSFETs · SO-8
DMN3018SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S2 | passive | Source of MOSFET element 2 (N-channel, 30V VDSS). |
| 2 | G2 | input | Gate of MOSFET element 2, ESD protected with gate protection diode, VGSS ±20V. |
| 3 | S1 | passive | Source of MOSFET element 1 (N-channel, 30V VDSS). |
| 4 | G1 | input | Gate of MOSFET element 1, ESD protected with gate protection diode, VGSS ±20V. |
| 5 | D1 | passive | Drain of MOSFET element 1, connected to pin 6; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 6 | D1 | passive | Drain of MOSFET element 1, connected to pin 5; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 7 | D2 | passive | Drain of MOSFET element 2, connected to pin 8; 30V VDSS, 6.7A continuous at TA=+25°C. |
| 8 | D2 | passive | Drain of MOSFET element 2, connected to pin 7; 30V VDSS, 6.7A continuous at TA=+25°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 30 | V | | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | | 2 |
| Continuous Drain Current | ID | | | 6.7 | A | VGS = 10V, Steady State, TA = +25°C | 2 |
| Continuous Drain Current | ID | | | 5.3 | A | VGS = 10V, Steady State, TA = +70°C | 2 |
| Continuous Drain Current | ID | | | 8.7 | A | VGS = 10V, t < 10s, TA = +25°C | 2 |
| Continuous Drain Current | ID | | | 6.9 | A | VGS = 10V, t < 10s, TA = +70°C | 2 |
| Pulsed Drain Current | IDM | | | 60 | A | 10µs Pulse, Duty Cycle = 1% | 2 |
| Maximum Body Diode Continuous Current | IS | | | 2 | A | | 2 |
| Avalanche Current | IAR | | | 19 | A | L = 0.1mH | 2 |
| Repetitive Avalanche Energy | EAR | | | 18 | mJ | L = 0.1mH | 2 |
| Total Power Dissipation | PD | | | 1.5 | W | Note 5 (FR-4, 2oz copper, 1 inch square copper plate) | 2 |
| Thermal Resistance, Junction to Ambient (steady state) | RθJA | | | 83 | °C/W | Steady State, Note 5 | 2 |
| Thermal Resistance, Junction to Ambient (t < 10s) | RθJA | | | 50 | °C/W | t < 10s, Note 5 | 2 |
| Thermal Resistance, Junction to Case | RθJC | | | 14.5 | °C/W | Note 5 | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 30 | | | V | VGS = 0V, ID = 250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | μA | VDS = 24V, VGS = 0V | 2 |
| Gate-Source Leakage | IGSS | -10 | | 10 | μA | VGS = ±20V, VDS = 0V | 2 |
| Gate Threshold Voltage | VGS(TH) | 1 | 1.7 | 2.1 | V | VDS = VGS, ID = 250μA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 16 | 22 | mΩ | VGS = 10V, ID = 10A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 23 | 30 | mΩ | VGS = 4.5V, ID = 6A | 2 |
| Diode Forward Voltage | VSD | 0.5 | | 1.2 | V | VGS = 0V, IS = 1A | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Connections Indicator: See Diagram Terminals: Finish Matte Tin Annealed over Copper Leadframe. | 1 |
## CAD (KiCad official)
- Symbol: `DMN3018SSD-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `dmn3018ssd-13-etched.step` / `dmn3018ssd-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmn3018ssd-13.step` / `dmn3018ssd-13.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588879840959205376) (6 pp, sha256 `d5f56e135460a926`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dmn3018ssd-13-datasheet.pdf)