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Contents

README

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DMN2310UW-7

Diodes Incorporated · MOSFETs · SOT-323

DMN2310UW-7 from Diodes Incorporated, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; ESD-protected input with gate-source voltage limited to ±8V and threshold of 0.45V to 0.95V at ID = 250µA.
2 S passive Source terminal of the N-channel MOSFET; body diode forward current is rated 0.6A maximum.
3 D passive Drain terminal; drain-source voltage rated 20V with continuous drain current of 1.3A at VGS = 4.5V and TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-323
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250μA 2
Zero Gate Voltage Drain Current @ TC = +25°C IDSS 1 µA VDS = 20V, VGS = 0V 2
Gate-Source Leakage IGSS 10 µA VGS = ±8V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.45 0.95 V VDS = VGS, ID = 250μA 2
Static Drain-Source On-Resistance RDS(ON) 150 200 mΩ VGS = 4.5V, ID = 300mA 2
Static Drain-Source On-Resistance RDS(ON) 190 280 mΩ VGS = 2.5V, ID = 250mA 2
Static Drain-Source On-Resistance RDS(ON) 245 380 mΩ VGS = 1.8V, ID = 100mA 2
Diode Forward Voltage VSD 0.85 1.2 V VGS = 0V, IS = 1A 2
Drain-Source Voltage VDSS 20 V 2
Gate-Source Voltage VGSS -8 8 V 2
Continuous Drain Current (Note 6) ID 1.3 A VGS = 4.5V, steady state, TA = +25°C 2
Continuous Drain Current (Note 6) ID 1.1 A VGS = 4.5V, steady state, TA = +70°C 2
Pulsed Drain Current IDM 4.4 A 10µs pulse, duty cycle = 1% 2
Maximum Body Diode Forward Current (Note 5) IS 0.6 A 2
Total Power Dissipation (Note 5) PD 0.45 W Device on FR-4 PC board, minimum recommended pad layout 2
Total Power Dissipation (Note 6) PD 0.55 W Device on FR-4 PC board, 2oz copper, thermal bias to bottom layer 1 inch square copper plate 2
Thermal Resistance, Junction to Ambient (Note 5) RθJA 275 °C/W Steady state; device on FR-4 PC board, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient (Note 6) RθJA 226 °C/W Steady state; device on FR-4 PC board, 2oz copper, 1 inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient (Transient Thermal Resistance figure) RθJA 268 °C/W Printed as RθJA = 268°C/W with Figure 13 transient thermal resistance curves 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminal Connections Indicator: See Diagram • Terminals: FinishMatte Tin Annealed over Copper Lead-Frame. 1

CAD (KiCad official)

  • Symbol: DMN2310UW-7
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: dmn2310uw-7-etched.step / dmn2310uw-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn2310uw-7.step / dmn2310uw-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 c8aebddde21fd252, retrieved 2026-11-04, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF