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DMN2055UW-13

Diodes Incorporated · MOSFETs · SOT-323

DMN2055UW-13 from Diodes Incorporated, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel MOSFET; gate-source voltage VGSS is limited to ±8 V and gate threshold VGS(TH) is 0.4 V min to 1.0 V max.
2 S passive Source of the N-channel MOSFET; the maximum body diode forward current IS is 0.8 A.
3 D passive Drain of the N-channel MOSFET; drain-source voltage VDSS is 20 V and continuous drain current ID is 3.1 A at TA = +25°C (steady state, VGS = 4.5 V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-323
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250μA 2
Zero Gate Voltage Drain Current @TC = +25°C IDSS 1 µA VDS = 20V, VGS = 0V 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±8V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.4 1 V VDS = VGS, ID = 250μA 2
Static Drain-Source On-Resistance RDS(ON) 35 46 mΩ VGS = 4.5V, ID = 3.6A 2
Static Drain-Source On-Resistance RDS(ON) 39 53 mΩ VGS = 2.5V, ID = 3.1A 2
Diode Forward Voltage VSD 0.7 1 V VGS = 0V, IS = 1A 2
Drain-Source Voltage VDSS 20 V 2
Gate-Source Voltage VGSS -8 8 V 2
Continuous Drain Current (Note 6), steady state ID 3.1 A VGS = 4.5V, TA = +25°C 2
Continuous Drain Current (Note 6), steady state ID 2.4 A VGS = 4.5V, TA = +70°C 2
Pulsed Drain Current IDM 22 A 10μs Pulse, Duty Cycle = 1% 2
Maximum Body Diode Forward Current (Note 5) IS 0.8 A 2
Total Power Dissipation (Note 5) PD 0.52 W Device mounted on FR-4 PCB, minimum recommended pad layout 2
Total Power Dissipation (Note 6) PD 0.65 W Device mounted on FR-4 PCB, 2oz copper, 1inch square plate 2
Thermal Resistance, Junction to Ambient, Steady State (Note 5) RθJA 241 °C/W Device mounted on FR-4 PCB, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient, Steady State (Note 6) RθJA 191 °C/W Device mounted on FR-4 PCB, 2oz copper, 1inch square plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Transient Thermal Resistance model value (Figure 13) RθJA 237.2 °C/W Figure 13 model, RθJA = 237.2℃/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminal Connections Indicator: See Diagram  Terminals: Finish  Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMN2055UW-13
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: dmn2055uw-13-etched.step / dmn2055uw-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn2055uw-13.step / dmn2055uw-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 8e15c415dbbafe8f, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF