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DMN10H100SK3-13

Diodes Incorporated · MOSFETs · TO-252

DMN10H100SK3-13 from Diodes Incorporated, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage is rated at ±20 V maximum with a gate threshold voltage of 1.0 V to 3.0 V at ID = 250µA.
2 D passive Drain (center lead, also connected to the exposed tab); drain-source voltage is rated at 100 V with continuous drain current of 18 A at TC = +25°C.
3 S passive Source; connects to the body diode anode with a typical forward voltage of 0.77 V at IS = 3.2A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS = 0V, ID = 250µA 2
Gate Threshold Voltage VGS(TH) 1 2 3 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 65 80 mΩ VGS = 10V, ID = 3.3A 2
Static Drain-Source On-Resistance RDS(ON) 70 100 mΩ VGS = 4.5V, ID = 2A 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 80V, VGS = 0V 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±20V, VDS = 0V 2
Drain-Source Voltage VDSS 100 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current ID 18 A VGS = 10V, TC = +25°C 2
Continuous Drain Current ID 14 A VGS = 10V, TC = +70°C 2
Pulsed Drain Current IDM 16 A 380μs Pulse, Duty Cycle = 1% 2
Avalanche Current IAS 8 A L = 1mH (Note 7) 2
Avalanche Energy EAS 32.6 mJ L = 1mH (Note 7) 2
Total Power Dissipation PD 37 W TC = +25°C (Note 6) 2
Total Power Dissipation PD 24 W TC = +70°C (Note 6) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient RθJA 46 °C/W Note 5: FR-4 PCB, 2oz copper, with 1-inch square copper plate 2
Thermal Resistance, Junction to Case RθJC 3.3 °C/W Note 6: device mounted on infinite heatsink 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Body Diode Reverse Recovery Charge Qrr  15.9  nC Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate. 2
contacts Copper tin  Terminal Connections: See Diagram  Terminals: Finish, Matte Tin Annealed over Copper Leadframe 1

CAD (KiCad official)

  • Symbol: DMN10H100SK3-13
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: dmn10h100sk3-13-etched.step / dmn10h100sk3-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn10h100sk3-13.step / dmn10h100sk3-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 ed1201002a82992a, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF