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Contents

README

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DMHC3025LSD-13

Diodes Incorporated · MOSFETs · SO-8

DMHC3025LSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N1G input Gate of N-channel MOSFET N1 (VGS(TH) 1 to 2 V, VGSS ±20 V max).
2 N1D/P1D passive Common drain of N-channel N1 and P-channel P1, the first half-bridge output (VDSS 30 V N-channel, -30 V P-channel).
3 N1S/N2S passive Common source of both N-channel MOSFETs N1 and N2, the low-side return of the H-bridge.
4 N2G input Gate of N-channel MOSFET N2 (VGS(TH) 1 to 2 V, VGSS ±20 V max).
5 P2G input Gate of P-channel MOSFET P2 (VGS(TH) -1 to -2 V, VGSS ±20 V max).
6 N2D/P2D passive Common drain of N-channel N2 and P-channel P2, the second half-bridge output (VDSS 30 V N-channel, -30 V P-channel).
7 P1S/P2S passive Common source of both P-channel MOSFETs P1 and P2, the high-side supply node of the H-bridge.
8 P1G input Gate of P-channel MOSFET P1 (VGS(TH) -1 to -2 V, VGSS ±20 V max).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Total Power Dissipation PD 1.5 W TA = +25°C; Note 5 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 83 °C/W Steady state; Note 5 2
Thermal Resistance, Junction to Ambient, t<10s RθJA 50 °C/W t < 10s; Note 5 2
Thermal Resistance, Junction to Case RθJC 14.5 °C/W 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Voltage (N-Channel) VDSS 30 V N-Channel, TA = +25°C 2
Gate-Source Voltage (N-Channel) VGSS -20 20 V N-Channel, TA = +25°C 2
Continuous Drain Current (N-Channel) ID 6 A VGS = 10V, steady state, TA = +25°C; Note 5 2
Continuous Drain Current (N-Channel) ID 4.8 A VGS = 10V, steady state, TA = +70°C; Note 5 2
Continuous Drain Current (N-Channel) ID 7.8 A VGS = 10V, t < 10s, TA = +25°C; Note 5 2
Continuous Drain Current (N-Channel) ID 6.1 A VGS = 10V, t < 10s, TA = +70°C; Note 5 2
Continuous Drain Current (N-Channel) ID 4.6 A VGS = 4.5V, steady state, TA = +25°C; Note 5 2
Continuous Drain Current (N-Channel) ID 3.6 A VGS = 4.5V, steady state, TA = +70°C; Note 5 2
Maximum Continuous Body Diode Forward Current (N-Channel) IS 2.5 A Note 5 2
Pulsed Drain Current (N-Channel) IDM 60 A 10μs pulse, duty cycle = 1% 2
Drain-Source Voltage (P-Channel) VDSS 30 V P-Channel, TA = +25°C; printed as 30 V 2
Gate-Source Voltage (P-Channel) VGSS -20 20 V P-Channel, TA = +25°C 2
Continuous Drain Current (P-Channel) ID -4.2 A VGS = -10V, steady state, TA = +25°C; Note 5 2
Continuous Drain Current (P-Channel) ID -3.3 A VGS = -10V, steady state, TA = +70°C; Note 5 2
Continuous Drain Current (P-Channel) ID -5.4 A VGS = -10V, t < 10s, TA = +25°C; Note 5 2
Continuous Drain Current (P-Channel) ID -4.3 A VGS = -10V, t < 10s, TA = +70°C; Note 5 2
Continuous Drain Current (P-Channel) ID -3.2 A VGS = -4.5V, steady state, TA = +25°C; Note 5 2
Continuous Drain Current (P-Channel) ID -2.5 A VGS = -4.5V, steady state, TA = +70°C; Note 5 2
Maximum Continuous Body Diode Forward Current (P-Channel) IS -2.5 A Note 5 2
Pulsed Drain Current (P-Channel) IDM -30 A 10μs pulse, duty cycle = 1% 2
Drain-Source Breakdown Voltage (N-Channel) BVDSS 30 V VGS = 0V, ID = 250μA 3
Zero Gate Voltage Drain Current (N-Channel) IDSS 0.5 μA VDS = 30V, VGS = 0V 3
Gate-Source Leakage (N-Channel) IGSS -1 1 μA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage (N-Channel) VGS(TH) 1 2 V VDS = VGS, ID = 250μA 3
Static Drain-Source On-Resistance (N-Channel) RDS(ON) 19 25 mΩ VGS = 10V, ID = 5A 3
Static Drain-Source On-Resistance (N-Channel) RDS(ON) 26 40 mΩ VGS = 4.5V, ID = 4A 3
Diode Forward Voltage (N-Channel) VSD 0.7 1.2 V VGS = 0V, IS = 1.7A 3
Drain-Source Breakdown Voltage (P-Channel) BVDSS -30 V VGS = 0V, ID = -250μA 3
Zero Gate Voltage Drain Current (P-Channel) IDSS -0.5 μA VDS = -30V, VGS = 0V 3
Gate-Source Leakage (P-Channel) IGSS -1 1 μA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage (P-Channel) VGS(TH) -1 -2 V VDS = VGS, ID = -250μA 3
Static Drain-Source On-Resistance (P-Channel) RDS(ON) 43 50 mΩ VGS = -10V, ID = -5A 3
Static Drain-Source On-Resistance (P-Channel) RDS(ON) 68 80 mΩ VGS = -4.5V, ID = -4A 3
Diode Forward Voltage (P-Channel) VSD -0.7 -1.2 V VGS = 0V, IS = -1.7A 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminal Connections Indicator: See Diagram  Terminals: Finish  Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMHC3025LSD-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: dmhc3025lsd-13-etched.step / dmhc3025lsd-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmhc3025lsd-13.step / dmhc3025lsd-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (9 pp, sha256 26061431183de856, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF